Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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EP4SGX230FF35I3G by Intel is a FPGA with 228,000 logic cells and 9,120 CLBs. It operates at a voltage range of 0.87V to 0.93V and has a max temperature of 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package.
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Corphita
This material provides durability and protection for the FPGA, making it suitable for various environmental conditions.
With a large number of logic cells, this FPGA can handle complex computations and programming tasks efficiently.
Being surface mountable makes it easy to integrate this FPGA onto circuit boards, saving space and simplifying the assembly process.
Operating at a low maximum supply voltage helps in reducing power consumption and heat generation.
A high number of Configurable Logic Blocks (CLBs) allows for flexible and customized implementation of logic functions.
Having a large number of input pins enables the FPGA to interface with multiple external devices and sensors.
The square shape of the package provides uniformity and ease of handling during manufacturing and assembly processes.
Ball terminals offer reliable connections and easy soldering, ensuring good signal integrity and robustness.
Operating at a nominal supply voltage of 0.9V strikes a good balance between power efficiency and performance for the FPGA.
A high number of terminals allows for extensive connectivity options and versatile circuit design possibilities.
Being a field programmable device, this FPGA offers flexibility in design iterations and customization for specific applications.
The grid array package style facilitates efficient routing of signals and power distribution, optimizing performance and reliability.
With a low minimum supply voltage, the FPGA can operate reliably even under low power conditions.
Capable of operating at high temperatures, this FPGA is suitable for industrial environments and demanding applications.
The small pitch of the terminals allows for high-density mounting and compact PCB designs, saving space in electronic devices.
The organizational structure of 9120 Configurable Logic Blocks enables efficient resource utilization and optimized performance.
With a wide operating temperature range, this FPGA can function reliably in extreme cold conditions, suitable for various applications.
Having terminals positioned at the bottom of the package facilitates PCB layout and soldering processes, enhancing ease of assembly.
The low seated height of the package ensures compatibility with slim devices and space-constrained applications.
The compact width of 35mm allows for efficient board space utilization and integration into small form factor electronics.
A high number of output pins enables the FPGA to drive multiple components and communicate effectively with external devices.
The 35mm length of the package contributes to a well-balanced form factor, suitable for various electronic designs.
Designed for industrial-grade temperature ranges, this FPGA can withstand harsh environmental conditions and operate reliably in demanding applications.
Field Programmable Gate Arrays (FPGA) EP4SGX230FF35I3G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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JESD-30 Code:
EP4SGX230FF35I3G Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult Dev Software Chgs 3/Jun/2021 Quartus SW/Web Chgs 23/Sep/2021
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
2N2222A
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
Toshiba
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
TE Connectivity
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
0462-201-16141
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
1N4148
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Sangdest Microelectronics (Nanjing)
M2S090TS-1FGG484I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
EP4CE10E22C8N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: HLFQFP; Package Shape: SQUARE;
10CL016YF484C8G
Intel
Intel's 10CL016YF484C8G is a FPGA with 963 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. It features a grid array package style, square shape, and ball terminals. Ideal for applications requiring high flexibility and customization in electronic circuit design.
XC7S15-2FTGB196I
Xilinx
The Xilinx XC7S15-2FTGB196I is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and low power consumption. The package style is grid array, low profile, fine pitch with matte tin finishing for optimal performance.
ICE40HX1K-TQ144
Lattice Semiconductor
ICE40HX1K-TQ144 by Lattice Semiconductor is a FPGA with 1280 logic cells, 160 CLBs, and max clock frequency of 133 MHz. Ideal for industrial applications requiring low profile, fine pitch package style and operating temperatures ranging from -40 to 100 °C.
LCMXO2-1200HC-4TG100IR1
LCMXO2-1200HC-4TG100IR1 by Lattice Semiconductor is a CMOS FPGA with 1280 logic cells, 80 inputs/outputs, and 133 MHz clock frequency. Ideal for applications requiring high-speed processing in fields like telecommunications and industrial automation.
A3P250-PQG208I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
EP3C5F256C8N
EP3C5F256C8N by Intel is a CMOS FPGA with 5136 logic cells, 182 inputs/outputs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities, such as telecommunications equipment and industrial automation systems.
A3P125-VQG100I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC7VX1140T-1FLG1930I
The Xilinx XC7VX1140T-1FLG1930I is a high-performance FPGA with 1139200 logic cells and 89000 CLBs. Operating at up to 1818 MHz, it offers 1100 inputs/outputs and uses CMOS technology. Ideal for applications requiring fast processing speeds in fields like telecommunications and aerospace.
EP3C16Q240C8N
The Altera EP3C16Q240C8N is a CMOS FPGA with 15408 logic cells and 160 inputs/outputs. It operates at a max clock frequency of 472.5 MHz and is commonly used in applications requiring programmable ICs for high-speed data processing.
LCMXO2-1200HC-4TG144IR1
LCMXO2-1200HC-4TG144IR1 by Lattice Semiconductor is a CMOS FPGA with 1280 logic cells, 108 inputs/outputs, and 133 MHz max clock frequency. It operates at 2.5V nominal voltage and is ideal for applications requiring high-speed processing in a compact form factor.
EP4CE22E22C6N
EP4CE22E22C6N by Intel is a FPGA with 22320 logic cells, 1395 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style including flatpack and low profile options, it offers versatility in design and integration.
XC6SLX9-2CSG225C
Xilinx XC6SLX9-2CSG225C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.
A3P1000-FG144I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
LCMXO2-7000HC-4TG144C
LCMXO2-7000HC-4TG144C by Lattice Semiconductor is a FPGA with 6864 logic cells, 114 inputs/outputs, and operates at 2.5V. Ideal for applications requiring high-speed processing in compact designs like IoT devices and consumer electronics due to its low profile package style and fine pitch terminals.
EP3C55F484I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
LCMXO2-256HC-4TG100I
LCMXO2-256HC-4TG100I by Lattice Semiconductor is a 256 Logic Cell FPGA with 55 inputs/outputs, operating at 2.5V nominal voltage. It comes in a square package with Gull Wing terminals, suitable for applications requiring high-speed processing and programmable logic capabilities.
LCMXO256C-5TN100C
LCMXO256C-5TN100C by Lattice Semiconductor is a 256 Logic Cells FPGA with 32 CLBs and 78 Inputs/Outputs. Operating at 1.8V, it has a max supply voltage of 3.465V and can withstand temperatures up to 85°C. Ideal for applications requiring high-performance programmable ICs in compact form factors.
LCMXO2-1200HC-4MG132C
LCMXO2-1200HC-4MG132C by Lattice Semiconductor is a 1280 logic cell FPGA with 104 inputs/outputs, operating at max frequency of 133 MHz. Suitable for applications requiring high-speed processing and programmable ICs in various industries.
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EP4SGX180FF35C3N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
EP4SGX530KH40I4G
Intel's EP4SGX530KH40I4G is a FPGA with 531,200 logic cells and 21,248 CLBs. Operating b/w -40 to 100°C, it has a supply voltage range of 0.87-0.93V. Ideal for applications requiring high-performance programmable ICs in a compact square grid array package.
EP4SGX230FF35I3N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .93 V;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1152,34X34,40;
EP4SGX230FF35I3
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 228000;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Width: 35 mm;
EP4SE230F29I3N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;
EP4SGX70DF29C2XG
FIELD PROGRAMMABLE GATE ARRAY;
EP4SGX70HF35C2N
EP4SE530H40C2G
EP4SGX180FF35C3G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
EP4SGX230HF35C2G
EP4SGX230KF40C2G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
EP4SGX530KH40C4NES
EP4SE530H40C2N
EP4SGX230FF35C2XES
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