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EP4SGX230FF35I3G

Intel

EP4SGX230FF35I3G by Intel

EP4SGX230FF35I3G by Intel is a FPGA with 228,000 logic cells and 9,120 CLBs. It operates at a voltage range of 0.87V to 0.93V and has a max temperature of 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package.

Median Price

$14,807.880

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 800 parts In-Stock

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Vyrian

USA . 3,128 parts In-Stock

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Chip Stock

USA . 1,222 parts In-Stock

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Digiode

USA . 473 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 458 parts In-Stock

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$11.992

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MARBEL Systems

Belgium . 50 parts In-Stock

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$16.835

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Semicontronic

India . 1,124 parts In-Stock

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$18.000

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$17.550

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$17.460

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Texas Native Microelectronics

USA . 5,055 parts In-Stock

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$19.351

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$17.996

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$17.029

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$19.351

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Kenton Components

USA . 3,621 parts In-Stock

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$23.221

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$20.435

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Ampacity Inc.

Singapore . 518 parts In-Stock

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$26.000

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Corohmni

South Africa . 313 parts In-Stock

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$38.956

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Qasali Group International

UK . 4,408 parts In-Stock

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$52.248

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Aztec Data Supply Inc.

USA . 3,112 parts In-Stock

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$74.220

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Continental Prestige Electronics

USA . 6,357 parts In-Stock

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$14,807.880

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$14,511.722

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$14,511.722

Argo Parts USA

USA . 3,818 parts In-Stock

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$14,807.880

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$14,659.801

1k+ parts

$14,511.722

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$14,363.644

3,818

$14,807.880

$14,659.801

$14,511.722

$14,363.644

Netroflash

USA . 100 parts In-Stock

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$14,807.880

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$14,067.486

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$13,771.328

100

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$14,067.486

$13,771.328

Microchip USA

USA . 337 parts In-Stock

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$14,808.384

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337

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Corphita

USA . 228 parts In-Stock

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Overview

Engineered by the renowned manufacturer Intel, the EP4SGX230FF35I3G is a top-of-the-line Field Programmable Gate Array (FPGA) that boasts 228,000 logic cells and 9,120 CLBs. Offering unparalleled versatility and efficiency, this FPGA is ideal for a wide range of applications. Whether you're looking to enhance your data processing capabilities, streamline your system design, or maximize your productivity, the EP4SGX230FF35I3G delivers exceptional performance and reliability. With its innovative features and cutting-edge technology, this FPGA is sure to exceed your expectations and provide you with a competitive edge in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, making it suitable for various environmental conditions.

No. of Logic Cells: 228000

With a large number of logic cells, this FPGA can handle complex computations and programming tasks efficiently.

Surface Mount: YES

Being surface mountable makes it easy to integrate this FPGA onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 0.93 V

Operating at a low maximum supply voltage helps in reducing power consumption and heat generation.

No. of CLBs: 9120

A high number of Configurable Logic Blocks (CLBs) allows for flexible and customized implementation of logic functions.

No. of Inputs: 564

Having a large number of input pins enables the FPGA to interface with multiple external devices and sensors.

Package Shape: SQUARE

The square shape of the package provides uniformity and ease of handling during manufacturing and assembly processes.

Form Of Terminal: BALL

Ball terminals offer reliable connections and easy soldering, ensuring good signal integrity and robustness.

Nominal Supply Voltage (V): 0.9

Operating at a nominal supply voltage of 0.9V strikes a good balance between power efficiency and performance for the FPGA.

No. of Terminals: 1152

A high number of terminals allows for extensive connectivity options and versatile circuit design possibilities.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, this FPGA offers flexibility in design iterations and customization for specific applications.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates efficient routing of signals and power distribution, optimizing performance and reliability.

Minimum Supply Voltage: 0.87 V

With a low minimum supply voltage, the FPGA can operate reliably even under low power conditions.

Maximum Operating Temperature: 100 °C

Capable of operating at high temperatures, this FPGA is suitable for industrial environments and demanding applications.

Pitch Of Terminal: 1 mm

The small pitch of the terminals allows for high-density mounting and compact PCB designs, saving space in electronic devices.

Organization: 9120 CLBS

The organizational structure of 9120 Configurable Logic Blocks enables efficient resource utilization and optimized performance.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this FPGA can function reliably in extreme cold conditions, suitable for various applications.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom of the package facilitates PCB layout and soldering processes, enhancing ease of assembly.

Maximum Seated Height: 3.5 mm

The low seated height of the package ensures compatibility with slim devices and space-constrained applications.

Width: 35 mm

The compact width of 35mm allows for efficient board space utilization and integration into small form factor electronics.

No. of Outputs: 564

A high number of output pins enables the FPGA to drive multiple components and communicate effectively with external devices.

Length: 35 mm

The 35mm length of the package contributes to a well-balanced form factor, suitable for various electronic designs.

Grading Of Temperature: INDUSTRIAL

Designed for industrial-grade temperature ranges, this FPGA can withstand harsh environmental conditions and operate reliably in demanding applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP4SGX230FF35I3G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

228000

No. of Inputs:

564

No. of Outputs:

564

No. of CLBs:

9120

Organization:

9120 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

EP4SGX230FF35I3G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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