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EP4SGX180FF35C3N

Intel

EP4SGX180FF35C3N by Intel

EP4SGX180FF35C3N by Intel is a FPGA with 175750 logic cells, 7030 CLBs, and max clock frequency of 717 MHz. It is used in applications requiring high-speed processing and programmable ICs for various industries. With a package style of grid array and moisture sensitivity level of 3, it offers versatility in design and performance.

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One Stop Electronics

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AZTECH Wire

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MARBEL Systems

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Modulus Dynamics

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Kenton Components

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Texas Native Microelectronics

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Overview

Unlock endless possibilities with the Intel EP4SGX180FF35C3N Field Programmable Gate Array. Manufactured by industry leader Intel, this FPGA offers unparalleled quality and reliability. With over 175,000 logic cells and 7030 CLBs, this powerful device is perfect for a wide range of applications. From signal processing to cryptography, the EP4SGX180FF35C3N provides the flexibility and performance you need to bring your ideas to life. Experience the value and benefits this cutting-edge technology has to offer and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the FPGA easy to handle and resistant to damage.

No. of Logic Cells: 175750

Large number of logic cells allow for complex logic functions and designs to be implemented efficiently.

Surface Mount: YES

Surface mount technology allows for easy and reliable assembly onto circuit boards.

Maximum Supply Voltage: 0.93 V

Low maximum supply voltage helps in reducing power consumption and heat generation.

No. of CLBs: 7030

High number of Configurable Logic Blocks (CLBs) provide flexibility in designing various logic functions.

No. of Inputs: 564

Large number of inputs enable the FPGA to handle a wide range of input signals and data.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board.

Form Of Terminal: BALL

Ball terminals provide reliable connections and are suitable for high-density mounting applications.

Nominal Supply Voltage (V): 0.9

Stable nominal supply voltage ensures consistent performance and reliability of the FPGA.

Power Supplies (V): 0.9,1.2/3,1.5,2.5

Multiple power supply options cater to different power requirements and allow for versatile applications.

No. of Terminals: 1152

High number of terminals enable a greater number of connections and integration with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this product offers flexibility in design and can be reconfigured as needed.

Package Style (Meter): GRID ARRAY

Grid array package style enhances reliability and performance of the FPGA.

Minimum Supply Voltage: 0.87 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature indicates robustness and reliability in varying environmental conditions.

Pitch Of Terminal: 1 mm

Small pitch terminal spacing enables high-density mounting and efficient use of space.

Organization: 7030 CLBS

Well-organized 7030 Configurable Logic Blocks (CLBs) facilitate complex logic functions and designs.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin, silver, and copper finishing on terminals provide corrosion resistance and excellent conductivity.

Position Of Terminal: BOTTOM

Bottom terminal position allows for easy and secure mounting on a circuit board.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good resistance to moisture and environmental factors.

Maximum Seated Height: 3.4 mm

Low maximum seated height allows for compact design and easy integration in space-constrained applications.

Width: 35 mm

Compact width makes the FPGA suitable for applications where space is limited.

Maximum Clock Frequency: 717 MHz

High maximum clock frequency allows for fast processing and operation of the FPGA.

No. of Outputs: 564

Large number of outputs enable the FPGA to drive multiple external devices and handle complex output signals.

Length: 35 mm

Compact length makes the FPGA suitable for applications requiring a small footprint.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP4SGX180FF35C3N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

175750

No. of Inputs:

564

No. of Outputs:

564

No. of CLBs:

7030

Maximum Clock Frequency:

717 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

7030 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Power Supplies:

0.9,1.2/3,1.5,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.4 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP4SGX180FF35C3N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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