Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EP4SGX180FF35C3N by Intel is a FPGA with 175750 logic cells, 7030 CLBs, and max clock frequency of 717 MHz. It is used in applications requiring high-speed processing and programmable ICs for various industries. With a package style of grid array and moisture sensitivity level of 3, it offers versatility in design and performance.
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Plastic/Epoxy material is lightweight and durable, making the FPGA easy to handle and resistant to damage.
Large number of logic cells allow for complex logic functions and designs to be implemented efficiently.
Surface mount technology allows for easy and reliable assembly onto circuit boards.
Low maximum supply voltage helps in reducing power consumption and heat generation.
High number of Configurable Logic Blocks (CLBs) provide flexibility in designing various logic functions.
Large number of inputs enable the FPGA to handle a wide range of input signals and data.
Square package shape allows for efficient use of space on a circuit board.
Ball terminals provide reliable connections and are suitable for high-density mounting applications.
Stable nominal supply voltage ensures consistent performance and reliability of the FPGA.
Multiple power supply options cater to different power requirements and allow for versatile applications.
High number of terminals enable a greater number of connections and integration with other components.
Being a Field Programmable Gate Array, this product offers flexibility in design and can be reconfigured as needed.
Grid array package style enhances reliability and performance of the FPGA.
Low minimum supply voltage ensures compatibility with a wide range of power sources.
High maximum operating temperature indicates robustness and reliability in varying environmental conditions.
Small pitch terminal spacing enables high-density mounting and efficient use of space.
Well-organized 7030 Configurable Logic Blocks (CLBs) facilitate complex logic functions and designs.
Low minimum operating temperature ensures reliable performance even in cold environments.
Tin, silver, and copper finishing on terminals provide corrosion resistance and excellent conductivity.
Bottom terminal position allows for easy and secure mounting on a circuit board.
MSL level 3 indicates good resistance to moisture and environmental factors.
Low maximum seated height allows for compact design and easy integration in space-constrained applications.
Compact width makes the FPGA suitable for applications where space is limited.
High maximum clock frequency allows for fast processing and operation of the FPGA.
Large number of outputs enable the FPGA to drive multiple external devices and handle complex output signals.
Compact length makes the FPGA suitable for applications requiring a small footprint.
Field Programmable Gate Arrays (FPGA) EP4SGX180FF35C3N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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EP4SGX180FF35C3N Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW04020000Z0EDHP
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0EDHP is a 0402 SMT resistor with 0 ohm resistance, rated for temperatures from -55°C to 155°C. Ideal for jumper applications in automotive electronics due to AEC-Q200 compliance and compact size of 1mm x 0.5mm x 0.3mm.
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SN65HVD234DR
Texas Instruments
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
ULN2803ADW
ULN2803ADW by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85 °C and has a max supply voltage of 3 V. Ideal for applications requiring buffer or inverter-based peripheral drivers with sink current flow direction.
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM2675M-ADJ/NOPB
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
FDV303N
Onsemi
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
BSS138LT3G
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MPF100TS-1FCVG484I
MPF100TS-1FCVG484I by Microchip Tech is a CMOS FPGA with 284 inputs/outputs, operating temp range -40 to 100°C. It has a grid array package style, 0.8mm terminal pitch, and is suitable for applications requiring high-density programmable logic solutions.
XC6SLX45-3FGG484C
Xilinx
Xilinx XC6SLX45-3FGG484C FPGA features 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. Utilized in applications requiring high clock frequencies up to 862 MHz, such as telecommunications and signal processing due to its CMOS technology and low combinatorial delay of 0.21 ns.
XC7A12T-L1CPG238I
The Xilinx XC7A12T-L1CPG238I is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for various functions. With a package style of grid array and low profile, it offers flexibility in design while maintaining reliability.
M2GL060-VFG400I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
EP2C5F256C8N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
XCAU20P-2SFVB784E
Xilinx XCAU20P-2SFVB784E FPGA offers 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor with a package style of grid array, fine pitch. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.
M7A3P1000-FG256I
M7A3P1000-FG256I by Microchip Technology is a FPGA with 24576 logic cells, 1.5V nominal voltage, and 350MHz max clock frequency. Ideal for industrial applications requiring high-speed processing, it features 177 inputs/outputs and operates b/w -40 to 85°C.
LFE5U-25F-8BG381I
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
XC7A35T-2FTG256C
Xilinx XC7A35T-2FTG256C is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. Package style: Grid Array, low profile, fine pitch.
XC7S6-1FTGB196I
Xilinx XC7S6-1FTGB196I FPGA offers 6000 logic cells, 469 CLBs, and 1098 MHz clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style: Grid Array, Low Profile, Fine Pitch.
M1A3P1000-PQG208I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC6SLX45-3CSG324I
Xilinx XC6SLX45-3CSG324I FPGA features 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. With a max clock frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. Operating temperature ranges from -40 to 100°C, making it suitable for various environments.
EP3C55F484C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
XC7A100T-L1FTG256I
Xilinx XC7A100T-L1FTG256I is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.
LFCPNX-100-7BFG484I
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;
10M50DAF484C8G
Intel
Intel's 10M50DAF484C8G FPGA boasts 50000 logic cells, 3125 CLBs, and 500 inputs. Ideal for applications requiring high-speed processing and customization in fields like telecommunications, automotive, and aerospace due to its programmable nature and versatile package style.
10M40SAE144I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
MPF100T-1FCSG325I
MPF100T-1FCSG325I by Microchip: FPGA with 170 inputs/outputs, CMOS tech, 0.97V to 1.03V supply range. Ideal for high-performance computing applications due to low profile grid array package and fine pitch terminals.
EP3C40F484C8N
EP3C40F484C8N by Intel is a FPGA with 39600 logic cells and 331 inputs/outputs. Operating at up to 472.5 MHz, it has a supply voltage range of 1.15V to 1.25V. Ideal for applications requiring high-speed processing and programmable logic capabilities in compact designs.
XC7A15T-3FTG256E
The Xilinx XC7A15T-3FTG256E is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
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EP4SGX180FF35C3N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
EP4SGX530KH40I4G
Intel's EP4SGX530KH40I4G is a FPGA with 531,200 logic cells and 21,248 CLBs. Operating b/w -40 to 100°C, it has a supply voltage range of 0.87-0.93V. Ideal for applications requiring high-performance programmable ICs in a compact square grid array package.
EP4SGX230FF35I3N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .93 V;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1152,34X34,40;
EP4SGX230FF35I3G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
EP4SGX230FF35I3
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 228000;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Width: 35 mm;
EP4SE230F29I3N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;
EP4SGX70DF29C2XG
FIELD PROGRAMMABLE GATE ARRAY;
EP4SGX70HF35C2N
EP4SE530H40C2G
EP4SGX180FF35C3G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
EP4SGX230HF35C2G
EP4SGX230KF40C2G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
EP4SGX530KH40C4NES
EP4SE530H40C2N
EP4SGX180FF35I3P
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
Supply Digital Components
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