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10AX016E3F27E1HG

Intel

10AX016E3F27E1HG by Intel

Intel's 10AX016E3F27E1HG FPGA features 160,000 logic cells and 6151 CLBs. With TSMC technology, it offers 240 inputs/outputs for versatile applications in industries like telecommunications and automotive. The package style is a grid array with a square shape and plastic/epoxy body material.

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Vyrian

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Nova Conductors

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Chip Stock

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AZTECH Wire

Italy . 812 parts In-Stock

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Ampacity Inc.

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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Vigor

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Microchip USA

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Overview

Unleash the power of Intel's 10AX016E3F27E1HG Field Programmable Gate Array (FPGA) and elevate your projects to new heights! With 160,000 logic cells and 6151 CLBs, this FPGA offers unmatched performance and flexibility. Whether you're working on industrial automation, IoT devices, or telecommunications equipment, this FPGA delivers the speed and reliability you need. Intel's reputation for quality and innovation ensures that you're getting a product that is built to last. Upgrade to the Intel 10AX016E3F27E1HG FPGA today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components of the FPGA.

No. of Logic Cells: 160000

With a high number of logic cells, this FPGA can handle complex logic operations and is suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable makes it easy to integrate this FPGA into electronic circuits, saving space and simplifying the manufacturing process.

Technology Used: TSMC

TSMC technology ensures high performance and reliability, making this FPGA a dependable choice for critical applications.

No. of Inputs: 240

The FPGA's ample number of inputs allows for versatility in connecting to external devices and sensors.

Package Shape: SQUARE

The square package shape provides a compact and efficient form factor for easy integration into electronic systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array allows for customization and reprogramming of the logic functions, providing flexibility in design and implementation.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA is suitable for use in environments with elevated temperatures without compromising performance.

Minimum Operating Temperature: 0 °C

The FPGA can operate efficiently in low-temperature environments, making it suitable for a wide range of applications.

Width: 27 mm

The compact width of the FPGA allows for efficient use of space in electronic designs, especially in applications with size constraints.

No. of Outputs: 240

The FPGA's ample number of outputs facilitates the transmission of data and signals to external devices, enhancing its functionality.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10AX016E3F27E1HG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

160000

No. of Inputs:

240

No. of Outputs:

240

No. of CLBs:

6151

Technology:

TSMC

Organization:

6151 CLBS

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3.35 mm

Package Equivalence Code:

BGA672,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

Trade Compliance

10AX016E3F27E1HG Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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