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10CL040YU484C6G

Intel

10CL040YU484C6G by Intel

Intel's 10CL040YU484C6G is a FPGA with 2475 CLBs, operating at 1.15-1.25V, suitable for applications requiring high flexibility and customization in electronics design. With a grid array package style and 0.8mm terminal pitch, it offers advanced programmability and reliability for various industrial projects. Operating temperature range of 0-85°C makes it ideal for diverse environmental conditions.

Median Price

$69.120

Lifecycle Status

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Mouser Electronics

USA . 72 parts In-Stock

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DigiKey

USA . 169 parts In-Stock

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Digiode

USA . 360 parts In-Stock

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Vyrian

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Chip Stock

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Nova Conductors

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AZTECH Wire

Italy . 717 parts In-Stock

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MARBEL Systems

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Texas Native Microelectronics

USA . 120 parts In-Stock

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Kenton Components

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Ampacity Inc.

Singapore . 41 parts In-Stock

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Corphita

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Microchip USA

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Aztec Data Supply Inc.

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Qasali Group International

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Vigor

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Continental Prestige Electronics

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Argo Parts USA

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Aranea Global

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Overview

Unleash the power of innovation with the Intel 10CL040YU484C6G Field Programmable Gate Array! Crafted by industry leader Intel, this FPGA offers unparalleled quality and reliability. With its 2475 CLBs and 484 terminals, this versatile device opens up a world of possibilities for applications in various industries. Whether you're designing cutting-edge electronics or revolutionizing communication systems, this FPGA provides the perfect platform for your creativity to flourish. Experience the value and benefits of Intel's advanced technology, and take your projects to new heights with the Intel 10CL040YU484C6G FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy is a durable and cost-effective material for packaging, providing protection to the FPGA.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage ensures safe operation and reduces the risk of damage to the FPGA.

No. of CLBs: 2475

Having a high number of configurable logic blocks (CLBs) provides flexibility and enables complex logic functions to be implemented.

Package Shape: SQUARE

A square package shape makes it easier to integrate the FPGA into a design and optimize the use of space on a circuit board.

Form Of Terminal: BALL

Ball terminals facilitate reliable connections and efficient heat dissipation during operation.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V is a common and stable voltage level for powering the FPGA.

No. of Terminals: 484

Having a sufficient number of terminals allows for multiple connections and interfaces with other components in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGAs offer reconfigurability and flexibility, making them suitable for a wide range of applications and designs.

Package Style (Meter): GRID ARRAY, FINE PITCH

A grid array with fine pitch layout enables high-density mounting and routing of the FPGA, optimizing board space usage.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures compatibility with various power sources and improves energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the FPGA can withstand harsh environmental conditions and maintain reliable performance.

Pitch Of Terminal: 0.8 mm

A small pitch terminal spacing allows for more connections in a compact space, enhancing the FPGA's functionality and performance.

Organization: 2475 CLBS

The organization of 2475 CLBs provides a structured and efficient architecture for implementing complex logic functions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments, offering versatility in use.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper for terminal finishing ensures good conductivity, solderability, and resistance to corrosion.

Position Of Terminal: BOTTOM

Having terminals located at the bottom facilitates easy integration and connection of the FPGA to other components on the circuit board.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the FPGA is resistant to moisture damage during storage and assembly processes.

Maximum Seated Height: 2.05 mm

The low seated height of 2.05mm allows for a compact design and easy installation of the FPGA in space-constrained applications.

Width: 19 mm

A width of 19mm provides a compact form factor for the FPGA, enabling easy integration into various electronic devices and systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering without damaging the FPGA during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the FPGA can withstand high-temperature soldering processes without degradation.

Length: 19 mm

A length of 19mm complements the width of the FPGA, providing a balanced and efficient form factor for electronic integration.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CL040YU484C6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of CLBs:

2475

Organization:

2475 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

2.05 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Trade Compliance

10CL040YU484C6G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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