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10CL080YF780C6G

Intel

10CL080YF780C6G by Intel

Intel's 10CL080YF780C6G is a FPGA with 5079 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. Suitable for applications requiring high-speed data processing in compact form factors like IoT devices and telecommunications equipment.

Median Price

$194.780

Lifecycle Status

Suppliers In-Stock

6

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1k+

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DigiKey

USA . 9 parts In-Stock

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Nova Conductors

Japan . 88 parts In-Stock

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$176.078

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Vyrian

USA . 7,901 parts In-Stock

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Chip Stock

USA . 1,402 parts In-Stock

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VNN

France . 1,000 parts In-Stock

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Digiode

USA . 345 parts In-Stock

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AZTECH Wire

Italy . 588 parts In-Stock

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$14.963

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MARBEL Systems

Belgium . 75 parts In-Stock

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$63.292

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$60.760

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Texas Native Microelectronics

USA . 5,093 parts In-Stock

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$72.749

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$69.839

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$67.657

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Corohmni

South Africa . 245 parts In-Stock

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$77.545

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Kenton Components

USA . 262 parts In-Stock

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$87.299

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Ampacity Inc.

Singapore . 36 parts In-Stock

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$133.640

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Semicontronic

India . 36 parts In-Stock

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$129.631

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Aranea Global

USA . 50 parts In-Stock

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$172.557

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$165.654

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Continental Prestige Electronics

USA . 5,502 parts In-Stock

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Microchip USA

USA . 1,180 parts In-Stock

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$176.578

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Modulus Dynamics

Lithuania . 18 parts In-Stock

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$195.447

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$193.492

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$187.629

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Vigor

Singapore . 10 parts In-Stock

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$900.000

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Argo Parts USA

USA . 3,211 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,418 parts In-Stock

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Qasali Group International

UK . 835 parts In-Stock

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$188.565

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$172.852

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Corphita

USA . 57 parts In-Stock

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Overview

Unlock endless possibilities with the Intel 10CL080YF780C6G Field Programmable Gate Array. Manufactured by industry giant Intel, this FPGA offers unparalleled quality and reliability. Perfect for a wide range of applications, this versatile device allows you to customize and optimize your designs with ease. Experience the value and benefits of enhanced performance, flexibility, and efficiency that only Intel can provide. Embrace innovation and elevate your projects with the Intel 10CL080YF780C6G FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection to the internal components of the FPGA.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 1.25 V

Higher maximum supply voltage allows for flexibility in power supply options.

No. of CLBs: 5079

Large number of CLBs provide ample resources for complex logic functions and designs.

Package Shape: SQUARE

Square package shape ensures efficient use of space on circuit boards.

Form Of Terminal: BALL

Ball terminal design enables reliable connections and ease of soldering.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage ensures consistent performance of the FPGA.

No. of Terminals: 780

High number of terminals allow for versatile connectivity options with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA technology offers reprogrammability and flexibility in implementing custom logic functions.

Package Style (Meter): GRID ARRAY

Grid array package style enables easy alignment and mounting on PCBs.

Minimum Supply Voltage: 1.15 V

Low minimum supply voltage allows for energy-efficient operation of the FPGA.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Pitch Of Terminal: 1 mm

1mm pitch of terminals enables compact layout and high-density integration.

Organization: 5079 CLBS

Well-organized CLBs provide a structured architecture for efficient logic implementation.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality even in cold environments.

Position Of Terminal: BOTTOM

Bottom terminal positioning facilitates easy PCB layout and routing of connections.

Maximum Seated Height: 2.4 mm

Low maximum seated height allows for slim and compact assembly designs.

Width: 29 mm

Compact width dimension for space-efficient placement on PCBs.

Length: 29 mm

Squared length dimension for optimal use of board space and clearances.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CL080YF780C6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of CLBs:

5079

Organization:

5079 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

2.4 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Trade Compliance

10CL080YF780C6G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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