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5AGXMA3D4F31C5G

Intel

5AGXMA3D4F31C5G by Intel

Intel's 5AGXMA3D4F31C5G FPGA features 156K logic cells, TSMC technology, and 5890 CLBs. Ideal for applications requiring high-speed processing, such as data centers and telecommunications infrastructure.

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Vyrian

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Nova Conductors

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Ampacity Inc.

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AZTECH Wire

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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Microchip USA

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Continental Prestige Electronics

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Overview

Unleash the power of innovation with the Intel 5AGXMA3D4F31C5G Field Programmable Gate Array. Crafted with precision by Intel, this FPGA promises unparalleled quality and reliability. With 156,000 logic cells and 5890 CLBs, it offers endless possibilities for customization and optimization. Whether you're designing cutting-edge electronics or pushing the boundaries of technology, this FPGA is your ultimate tool. Trust Intel to deliver top-notch performance and efficiency in every project, making your ideas a reality. Elevate your work to new heights with the Intel 5AGXMA3D4F31C5G FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good protection for the components inside the package.

No. of Logic Cells: 156000

With a large number of logic cells, this FPGA can handle complex logic functions and processing tasks efficiently.

Surface Mount: YES

Surface mount technology enables easy and secure installation of the FPGA on circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.13 V

The maximum supply voltage of 1.13 V ensures safe operation and prevents damage to the FPGA.

No. of CLBs: 5890

The high number of Configurable Logic Blocks (CLBs) allows for flexible and customizable logic configurations.

Technology Used: TSMC

TSMC is a reputable semiconductor manufacturing technology provider known for its reliability and performance.

No. of Inputs: 416

With a large number of inputs, this FPGA can handle multiple data streams and input signals simultaneously.

Package Shape: SQUARE

The square package shape allows for easy integration into PCB layouts and efficient use of space.

Form Of Terminal: BALL

The ball form of terminals provides secure connections and reliable contact points for stable operation.

Nominal Supply Voltage (V): 1.1

The nominal supply voltage of 1.1 V is within a safe operating range for the FPGA.

No. of Terminals: 896

The high number of terminals allows for versatile connections and interfaces with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this IC offers flexibility in design and functionality, making it suitable for a wide range of applications.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style with a heat sink or slug enhances thermal management and prevents overheating during operation.

Minimum Supply Voltage: 1.07 V

The minimum supply voltage of 1.07 V ensures stable performance even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance in various environmental conditions.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals facilitates easy soldering and connection to circuit boards.

Organization: 5890 CLBS

The organization of 5890 CLBs provides a structured layout for logical operations and efficient data processing.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in cold environments.

Position Of Terminal: BOTTOM

The bottom position of terminals enables easy access for connections and integration into circuit board designs.

Maximum Seated Height: 2.7 mm

The maximum seated height of 2.7 mm allows for compact and low-profile designs when incorporating the FPGA.

Width: 31 mm

With a width of 31 mm, this FPGA can fit into various PCB layouts and designs without taking up excessive space.

No. of Outputs: 416

The 416 outputs provide multiple options for transmitting processed data and signals to other components in the system.

Length: 31 mm

With a length of 31 mm, this FPGA offers a balanced form factor for easy integration and efficient use of space on PCBs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5AGXMA3D4F31C5G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

156000

No. of Inputs:

416

No. of Outputs:

416

No. of CLBs:

5890

Technology:

TSMC

Organization:

5890 CLBS

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

2.7 mm

Package Equivalence Code:

BGA896,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

896

Standards

JESD-30 Code:

S-PBGA-B896

Trade Compliance

5AGXMA3D4F31C5G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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