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LCMXO3LF-4300E-5UWG81CTR50

Lattice Semiconductor

LCMXO3LF-4300E-5UWG81CTR50 by Lattice Semiconductor

LCMXO3LF-4300E-5UWG81CTR50 by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 540 CLBs, 1.2V nominal voltage, and 0.4mm terminal pitch. Ideal for applications requiring high-density programmable logic solutions in compact form factors with operating temperatures ranging from 0 to 85°C.

Median Price

$4.320

Lifecycle Status

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3

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1k+

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Nova Conductors

Japan . 85 parts In-Stock

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Continental Prestige Electronics

USA . 5,844 parts In-Stock

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Argo Parts USA

USA . 4,481 parts In-Stock

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Netroflash

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AZTECH Wire

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Ampacity Inc.

Singapore . 1,032 parts In-Stock

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Microchip USA

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Overview

Unlocking limitless possibilities, the LCMXO3LF-4300E-5UWG81CTR50 by Lattice Semiconductor is a cutting-edge Field Programmable Gate Array (FPGA) that offers unrivaled performance and reliability. With a superior package body material of PLASTIC/EPOXY and a maximum supply voltage of 1.26V, this FPGA boasts 540 CLBs, providing unmatched flexibility in applications such as telecommunications, industrial automation, and consumer electronics. Trust in Lattice Semiconductor's expertise and elevate your projects with the LCMXO3LF-4300E-5UWG81CTR50 for seamless integration and optimal results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this FPGA lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

With surface mount capability, this FPGA can be easily integrated onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage of 1.26 V allows for flexibility in power input options, accommodating a wider range of power sources.

No. of CLBs: 540

With 540 configurable logic blocks, this FPGA offers a high level of customization and processing power for complex designs.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact form factor, optimizing space utilization in electronic systems.

Form Of Terminal: BALL

The use of ball terminals enhances connectivity and reliability, ensuring secure connections in high-performance applications.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2 V offers a standard operating level that is widely compatible with other components and systems.

No. of Terminals: 81

With 81 terminals, this FPGA provides plenty of connectivity options for interfacing with external devices and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this device offers reprogrammable logic and versatile functionality, making it suitable for a wide range of applications and design changes.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch design enables high-density mounting and improved signal integrity.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage of 1.14 V allows for efficient power consumption, reducing energy costs and heat generation.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can reliably operate in a wide range of environmental conditions.

Pitch Of Terminal: 0.4 mm

The small pitch of 0.4 mm between terminals enables high-density mounting and compact PCB layouts.

Organization: 540 CLBS

The organization of 540 configurable logic blocks provides ample resources for implementing complex digital circuits and algorithms.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can start up quickly and operate reliably in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on terminals ensures good conductivity, corrosion resistance, and solderability for reliable connections.

Position Of Terminal: BOTTOM

The terminal placement on the bottom of the FPGA simplifies PCB routing and layout, improving signal integrity and thermal management.

Maximum Seated Height: 0.567 mm

With a maximum seated height of 0.567 mm, this FPGA has a low profile that minimizes the overall height of electronic assemblies.

Width: 3.693 mm

The width of 3.693 mm makes this FPGA compact and space-efficient, suitable for applications where size constraints are a concern.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering and assembly processes for robust connections.

Length: 3.797 mm

The length of 3.797 mm offers a balanced form factor for this FPGA, making it suitable for a variety of PCB layouts and designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO3LF-4300E-5UWG81CTR50 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of CLBs:

540

Organization:

540 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

1

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Very Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

3.797 mm

Width:

3.693 mm

Maximum Seated Height:

.567 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.4 mm

No. of Terminals:

81

Standards

JESD-30 Code:

R-PBGA-B81

JESD-609 Code:

e1

Trade Compliance

LCMXO3LF-4300E-5UWG81CTR50 Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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