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LCMXO3LF-6900C-6BG400C

Lattice Semiconductor

LCMXO3LF-6900C-6BG400C by Lattice Semiconductor

LCMXO3LF-6900C-6BG400C by Lattice Semiconductor is a FPGA with 858 CLBs, operating voltage of 2.375V to 3.465V, and temp range of 0-85°C. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

Median Price

$29.210

Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip1Stop

Japan . 90 parts In-Stock

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$35.900

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Arrow

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$22.520

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Nova Conductors

Japan . 99 parts In-Stock

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$20.480

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Chip Stock

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Vyrian

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Semicontronic

India . 2,310 parts In-Stock

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$18.662

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$18.566

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Continental Prestige Electronics

USA . 3,871 parts In-Stock

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$20.480

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$20.070

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Netroflash

USA . 100 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Microchip USA

USA . 2,673 parts In-Stock

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Ampacity Inc.

Singapore . 2,653 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,477 parts In-Stock

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Corohmni

South Africa . 459 parts In-Stock

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Argo Parts USA

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Epart123

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Overview

Unlock limitless possibilities with the Lattice Semiconductor LCMXO3LF-6900C-6BG400C Field Programmable Gate Array. Manufactured by industry leader Lattice Semiconductor, this FPGA offers unparalleled quality and reliability. With 858 CLBs and a low profile grid array package style, this versatile device is perfect for a wide range of applications. From robotics to telecommunications, the LCMXO3LF-6900C-6BG400C provides exceptional value, flexibility, and performance. Experience the innovation and power of Lattice Semiconductor's cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.465 V

High maximum supply voltage allows for flexible power options in various applications.

No. of CLBs: 858

Large number of CLBs provides ample resources for complex programmable logic designs.

Package Shape: SQUARE

Square package shape ensures efficient use of board space and easy alignment during assembly.

Form Of Terminal: BALL

Ball terminals offer reliable connections and are suitable for high-density applications.

Nominal Supply Voltage (V): 2.5

Stable nominal supply voltage ensures consistent performance and reliability.

No. of Terminals: 400

Large number of terminals allow for versatile connectivity options in the design.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA technology provides reprogrammable logic, allowing for flexibility in design and prototyping.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch enables high-density mounting and efficient signal routing.

Minimum Supply Voltage: 2.375 V

Low minimum supply voltage supports energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

Pitch Of Terminal: 0.8 mm

Small pitch of terminals allows for compact layout and high interconnect density.

Organization: 858 CLBS

Organized layout of 858 CLBs provides a structured framework for complex logic implementations.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality in a wide range of operating environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Terminal finishing with tin, silver, and copper enhances solderability and corrosion resistance.

Position Of Terminal: BOTTOM

Bottom terminal position facilitates easy mounting and soldering on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly.

Maximum Seated Height: 1.7 mm

Low maximum seated height minimizes board stack-up for space-constrained applications.

Width: 17 mm

Compact width dimension enhances board space utilization and allows for dense PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering and reliability of connections during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder joint formation and reliability in temperature cycling conditions.

Length: 17 mm

Compact length dimension enables space-efficient integration into tight layouts and compact designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO3LF-6900C-6BG400C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of CLBs:

858

Organization:

858 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

3.465 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.7 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

400

Standards

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Trade Compliance

LCMXO3LF-6900C-6BG400C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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