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XC7A15T-2FTG256C

Xilinx

XC7A15T-2FTG256C by Xilinx

The Xilinx XC7A15T-2FTG256C is a FPGA with 16640 logic cells, 1300 CLBs, and operates at a max frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor. With a low profile grid array package style, it offers versatility in various electronic designs.

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$43.510

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Overview

Unlock the potential of your projects with the XC7A15T-2FTG256C by Xilinx, a top-tier manufacturer in the field of Field Programmable Gate Arrays (FPGAs). Boasting 16640 logic cells and a maximum clock frequency of 1286 MHz, this FPGA offers unparalleled performance and flexibility for a wide range of applications. Experience seamless integration, high-speed processing, and efficient power management with this cutting-edge programmable IC. Elevate your designs to new heights with the XC7A15T-2FTG256C and revolutionize your technological endeavors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, lightweight, and offers good resistance to impact and chemicals, making the product durable and affordable.

No. of Logic Cells: 16640

With a large number of logic cells, this FPGA can handle complex logic operations, allowing for versatile and high-performance applications.

Surface Mount: YES

Surface mount technology enables easy and efficient installation on PCBs, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 1.05 V

Operates at a low maximum supply voltage, reducing power consumption and making it energy-efficient.

No. of CLBs: 1300

With a high number of Configurable Logic Blocks (CLBs), this FPGA offers flexibility in designing and implementing custom logic functions.

No. of Inputs: 250

Having a large number of inputs allows for connecting multiple external signals or devices, increasing the versatility of the product.

Package Shape: SQUARE

The square package shape is space-efficient and makes it easier to align and mount the FPGA on a PCB, enhancing the overall design aesthetics.

Form Of Terminal: BALL

The use of ball terminals simplifies the process of soldering and provides a reliable connection, ensuring stable performance of the product.

No. of Terminals: 256

Having a sufficient number of terminals allows for easy integration and connectivity with other components in a system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this product offers reprogrammable logic functions, allowing for customization and adaptation to changing project requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style enhances thermal performance, improves signal integrity, and enables high-density mounting, making the product suitable for advanced applications.

Minimum Supply Voltage: 0.95 V

Operating at a low minimum supply voltage ensures compatibility with a wide range of power sources and enhances energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand elevated environmental conditions, making it reliable in various operating environments.

Pitch Of Terminal: 1 mm

The terminal pitch of 1mm allows for high-density mounting and facilitates efficient routing of signals, optimizing PCB space and layout.

Maximum Combinatorial Delay of a CLB: 1.05 ns

With a low combinatorial delay, this FPGA offers fast processing speed and efficient logic operations, improving overall system performance.

Organization: 1300 CLBS

The organized structure of Configurable Logic Blocks (CLBs) facilitates logical design and implementation, enabling seamless integration of complex functions.

Minimum Operating Temperature: 0 °C

Operating at a low minimum temperature, this FPGA can function reliably in cold environments, ensuring consistent performance in diverse conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of a durable finishing material on terminals enhances conductivity, prevents corrosion, and ensures long-term reliability of the product.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom simplifies PCB layout and soldering, streamlining the assembly process and improving overall product reliability.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this FPGA is suitable for reflow soldering processes and can withstand moderate exposure to moisture during assembly.

Maximum Seated Height: 1.55 mm

The low seated height of the package allows for compact designs and facilitates efficient heat dissipation, enhancing the overall performance of the product.

Width: 17 mm

The compact width of the FPGA makes it suitable for space-constrained applications while providing compatibility with standard PCB sizes.

Maximum Clock Frequency: 1286 MHz

Operating at a high maximum clock frequency, this FPGA can process data at high speeds, enabling real-time operations and time-critical applications.

No. of Outputs: 250

Having a large number of outputs allows for transmitting multiple signals or data streams simultaneously, enhancing the functionality and performance of the product.

Maximum Time At Peak Reflow Temperature (s): 30

With a short time at peak reflow temperature, this FPGA can undergo soldering processes efficiently, ensuring reliable connections and optimal performance.

Peak Reflow Temperature °C: 260

Being able to withstand a high peak reflow temperature ensures the reliability of solder joints and the longevity of the product during manufacturing and assembly processes.

Length: 17 mm

The compact length of the FPGA contributes to space-saving designs and allows for versatile placement on PCBs, enhancing the overall layout and functionality of the product.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A15T-2FTG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

16640

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

1300

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Organization:

1300 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Trade Compliance

XC7A15T-2FTG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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