Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Xilinx XCKU035-1FBVA900C FPGA offers 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates at a max supply voltage of 0.979 V with a package style of grid array.
Median Price
$1,727.440
Lifecycle Status
Suppliers In-Stock
9
In-Stock Inventory
1k+
Farnell
1+ parts
$1,063.000
100+ parts
-
1k+ parts
10k+ parts
DigiKey
Element14
$2,265.410
EBV Elektronik
Digiode
$1,243.550
VNN
$1,309.000
Nova Conductors
$1,542.910
Vyrian
Chip Stock
AZTECH Wire
$17.696
Modulus Dynamics
$46.831
Aztec Data Supply Inc.
$101.610
Texas Native Microelectronics
$105.626
$101.401
$98.232
Kenton Components
$126.751
$111.541
Corohmni
$141.251
Semicontronic
$878.900
$856.928
$852.533
Ampacity Inc.
$1,112.650
Continental Prestige Electronics
$1,155.000
Corphita
$1,178.100
Microchip USA
$1,486.340
Argo Parts USA
$1,528.050
$1,512.770
$1,497.489
$1,482.209
Netroflash
$1,512.052
Perfect Parts
Authorized Procurement Solutions
Supply Digital
MARBEL Systems
Vigor
Qasali Group International
$273.783
$250.967
PLASTIC/EPOXY material provides durability and protection for the internal components of the FPGA, making it suitable for various environments.
With a large number of logic cells, this FPGA can handle complex logic functions and processing tasks efficiently.
Surface mount capability allows for easy installation on circuit boards, saving time and effort in the manufacturing process.
A low maximum supply voltage of 0.979 V helps in reducing power consumption and increasing energy efficiency of the FPGA.
Having 1700 Configurable Logic Blocks (CLBs) provides flexibility in design and customization of logic functions.
The high number of inputs allows for a wide range of external signals to be processed by the FPGA, enhancing its versatility.
A square package shape is space-efficient and easy to mount on PCBs, making the FPGA suitable for compact designs.
A nominal supply voltage of 0.95 V ensures optimal performance and stability of the FPGA during operation.
Having consistent power supplies at 0.95 V ensures reliable and efficient operation of the FPGA.
A high number of terminals provide ample connectivity options and support for various input and output configurations.
As a Field Programmable Gate Array, this product offers reconfigurability and adaptability for different applications without needing hardware changes.
A grid array package style offers increased contact points and better thermal performance, enhancing the overall reliability of the FPGA.
A low minimum supply voltage of 0.922 V ensures compatibility with low-power applications and extends the operating range of the FPGA.
With a high maximum operating temperature of 85°C, this FPGA can withstand harsh environmental conditions and maintain stable performance.
A terminal pitch of 1 mm allows for precise connections and efficient signal transmission, contributing to the overall reliability of the FPGA.
Organized into 1700 Configurable Logic Blocks (CLBs), this FPGA offers a structured architecture for implementing complex logic functions and designs.
With a minimum operating temperature of 0°C, this FPGA can operate in a wide range of temperature settings, ensuring versatility and reliability.
The use of tin, silver, and copper finishing on terminals enhances conductivity, corrosion resistance, and reliability of the connections in the FPGA.
Bottom-mounted terminals facilitate easy installation and maintenance of the FPGA on circuit boards, simplifying the manufacturing process.
With a moisture sensitivity level of 4, this FPGA is suitable for handling moderate moisture exposure, ensuring long-term reliability in diverse environments.
A maximum seated height of 2.8 mm allows for a slim profile, making the FPGA suitable for compact and space-constrained applications.
A width of 31 mm provides a balance between compactness and functionality, allowing for easy integration into various electronic systems.
With 520 outputs, this FPGA can efficiently drive multiple devices and circuits, making it suitable for demanding applications with high output requirements.
A maximum reflow time of 30 seconds at peak temperature ensures proper soldering and reliability of the connections in the FPGA during manufacturing.
The peak reflow temperature of 245°C enables secure soldering and interconnects, ensuring robust assembly and reliable performance of the FPGA.
A length of 31 mm allows for a compact form factor, making the FPGA suitable for space-limited applications where size is a constraint.
Field Programmable Gate Arrays (FPGA) XCKU035-1FBVA900C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
No. of Logic Cells:
No. of Inputs:
No. of Outputs:
No. of CLBs:
Sub-Category:
Organization:
Nominal Supply Voltage:
Minimum Supply Voltage:
Maximum Supply Voltage:
Power Supplies:
Minimum Operating Temperature:
Maximum Operating Temperature:
Temperature Grade:
Peak Reflow Temperature:
Peak Reflow Time:
Moisture Sensitivity Level (MSL):
Package Body Material:
Surface Mountable:
Package Style:
Package Code:
Package Shape:
Length:
Width:
Maximum Seated Height:
Package Equivalence Code:
Terminal Position:
Terminal Style:
Terminal Finish:
Terminal Pitch:
No. of Terminals:
JESD-30 Code:
JESD-609 Code:
Qualified:
XCKU035-1FBVA900C Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Ultrascale & Virtex Dev Spec Chg 20/Dec/2016
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
MBRS1100T3G
Onsemi
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
2N2222A
North American Philips Discrete Products Div
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
STM32F103C8T6
STMicroelectronics
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
1N4148
Renesas Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Dc Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Hitachi
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WT
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148W-7-F
Diodes Incorporated
1N4148W-7-F by Diodes Inc. is a single rectifier diode with 0.715V max forward voltage and 100V max reverse voltage. Ideal for applications requiring fast switching speeds, it has a small outline package style and matte tin terminal finish, making it suitable for surface mount PCB designs.
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
LCMXO3LF-6900C-5BG324C
Lattice Semiconductor
LCMXO3LF-6900C-5BG324C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, operating b/w 0-85°C. It features a grid array package style, 0.8mm terminal pitch, and TIN SILVER COPPER finishing. Ideal for applications requiring low profile, fine pitch ICs in compact spaces.
LCMXO3LF-6900C-5BG400C
LCMXO3LF-6900C-5BG400C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, 0.8mm terminal pitch, and 400 terminals. Ideal for applications requiring low profile, fine pitch grid arrays in electronics operating b/w 0-85°C.
10M04SCU169C8G
Intel
The Intel 10M04SCU169C8G is a FPGA with 4000 logic cells, 250 CLBs, and 246 inputs/outputs. It operates at supply voltages b/w 2.85V to 3.15V and temperatures from 0°C to 85°C. This versatile device in a square grid array package is ideal for applications requiring programmable ICs with high logic cell counts and input/output capabilities.
EP3C10E144I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: RECTANGULAR;
EP3C25F324C8N
EP3C25F324C8N by Intel is a CMOS FPGA with 24624 logic cells and CLBs. It operates at a max clock frequency of 472.5 MHz, making it suitable for high-speed applications in various industries such as telecommunications, automotive, and aerospace. With a package style of grid array and moisture sensitivity level of 3, this FPGA offers flexibility and reliability in design implementations.
LFE5U-25F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
M1A3P600-FGG256I
Microchip Technology
Microchip Technology's M1A3P600-FGG256I is a CMOS FPGA with 13824 CLBs and 600000 gates. Operating at -40 to 100 °C, it has a supply voltage range of 1.425-1.575 V. Ideal for industrial applications requiring high gate count and temperature tolerance.
XCAU10P-1UBVA368I
Xilinx
FIELD PROGRAMMABLE GATE ARRAY;
LCMXO3LF-6900C-6BG400I
LCMXO3LF-6900C-6BG400I by Lattice Semiconductor is a FPGA with 6900 logic cells, 858 CLBs, and 335 inputs/outputs. It operates b/w -40 to 100 °C and has a package style of GRID ARRAY for applications requiring high-performance programmable ICs in compact form factors.
M1A3P1000-FGG484I
M1A3P1000-FGG484I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 24576 CLBs and 1000000 equivalent gates. It operates at a max clock frequency of 350 MHz and has a package shape of GRID ARRAY. This FPGA is commonly used in industrial applications requiring high-speed processing and programmability.
A3P125-VQG100I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC3S250E-4FTG256C
Xilinx XC3S250E-4FTG256C FPGA features 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
XC6SLX150T-2FGG676C
Xilinx XC6SLX150T-2FGG676C is a FPGA with 147443 logic cells, 11519 CLBs, and 396 inputs/outputs. It operates at max frequency of 667 MHz, suitable for high-speed applications like signal processing and telecommunications due to its advanced CMOS technology. The package style is grid array with a square shape and plastic/epoxy material.
M2S090-FCSG325
Microchip Technology's M2S090-FCSG325 FPGA offers 86184 logic cells, 180 inputs/outputs, and operates at a voltage range of 1.14V to 1.26V. Ideal for applications requiring high-speed processing and programmable logic in compact form factors with a grid array package style.
5CEFA7F23I7N
The Altera 5CEFA7F23I7N is a field programmable gate array (FPGA) with 149500 logic cells. It has a maximum supply voltage of 1.13V and uses CMOS technology. The package style is a grid array with 484 terminals, and it has 240 inputs and outputs. This FPGA is suitable for applications requiring high-level customization and versatility.
EP1S25F672C7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
XC7A35T-2CSG324C
Xilinx XC7A35T-2CSG324C FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor with low profile grid array package style.
LFE5U-45F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
XC6SLX4-2CSG225I
Xilinx XC6SLX4-2CSG225I is a FPGA with 3840 logic cells, 300 CLBs, and 120 inputs/outputs. Operating at max frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range from -40 to 100°C.
10M02SCE144C7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCKU040-2FFVA1156E
Xilinx XCKU040-2FFVA1156E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Package style: Grid Array, with a max operating temperature of 100°C.
XCKU3P-1FFVD900E
Xilinx XCKU3P-1FFVD900E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it suitable for various industrial environments.
XCKU3P-2FFVB676E
Xilinx XCKU3P-2FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.876 V. Package style is grid array with a square shape and ball terminals, suitable for various industrial uses.
XCKU060-1FFVA1517I
Xilinx XCKU060-1FFVA1517I FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range (-40 to 100°C) and low supply voltage (0.922-0.979V).
XCKU3P-1FFVA676E
Xilinx XCKU3P-1FFVA676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 0.876 V. Suitable for various industries due to its versatile programmable IC type and grid array package style.
XCKU035-2FBVA900I
Xilinx XCKU035-2FBVA900I FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. The package style is a grid array with a square shape and ball terminals for surface mount assembly.
XCKU040-2FFVA1156I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
XCKU060-1FFVA1517C
Xilinx XCKU060-1FFVA1517C FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.
XCKU3P-1FFVB676I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCKU115-2FLVA1517E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCKU060-2FFVA1156E
Xilinx XCKU060-2FFVA1156E FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.979 V. Suitable for various industries due to its versatility and robust design capabilities.
XCKU3P-1FFVB676E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCKU040-1FFVA1156C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
XCKU025-1FFVA1156I
Xilinx XCKU025-1FFVA1156I FPGA offers 318150 logic cells, 18180 CLBs, and 312 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a wide operating temperature range (-40 to 100°C) in a compact square grid array package.
XCKU035-1FFVA1156C
XCKU5P-2FFVB676E
Xilinx XCKU5P-2FFVB676E FPGA offers 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 100°C.
XCKU3P-1SFVB784E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;
XCKU035-2FBVA900E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
XCKU040-3FFVA1156E
XCKU060-2FFVA1517I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved