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XCKU040-2FBVA900E

Xilinx

XCKU040-2FBVA900E by Xilinx

Xilinx XCKU040-2FBVA900E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operating temperature range from 0 to 100°C makes it versatile for various environments.

Median Price

$2,753.200

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Mouser Electronics

USA . 2 parts In-Stock

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Digiode

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$2,566.900

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VNN

France . 63 parts In-Stock

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$2,702.000

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Nova Conductors

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Vyrian

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AZTECH Wire

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MARBEL Systems

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Texas Native Microelectronics

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$86.059

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$82.617

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Kenton Components

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Modulus Dynamics

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Aztec Data Supply Inc.

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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$2,675.287

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$2,621.241

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Netroflash

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Microchip USA

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Supply Digital

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Overview

Unlock limitless possibilities with the XCKU040-2FBVA900E by Xilinx, a top-of-the-line Field Programmable Gate Array that boasts unparalleled quality and reliability. As a leading manufacturer in the industry, Xilinx delivers cutting-edge technology that meets the demands of various applications in today's fast-paced world. With its 530250 logic cells, 1920 CLBs, and 520 inputs/outputs, this FPGA offers unmatched flexibility and performance. Whether you're designing high-speed networking equipment, industrial automation systems, or advanced medical devices, the XCKU040-2FBVA900E provides the value, benefits, and advantages you need to stay ahead of the competition. Experience innovation like never before with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring the product is reliable and affordable.

No. of Logic Cells: 530250

High number of logic cells allow for complex and large-scale programmable logic designs to be implemented.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 0.979 V

Efficient power consumption with a low maximum supply voltage, reducing energy costs and heat generation.

No. of CLBs: 1920

Ample number of Configurable Logic Blocks (CLBs) for flexible and customizable logic configurations.

No. of Inputs: 520

High number of input pins for versatile connectivity and input options in the design.

Package Shape: SQUARE

Square package shape provides uniformity and ease of handling during assembly and integration into electronic systems.

Form Of Terminal: BALL

Ball terminal design ensures secure connections and reliable contacts for enhanced performance.

Nominal Supply Voltage (V): 0.95

Stable and standard nominal supply voltage for consistent and predictable operation of the FPGA.

Power Supplies (V): 0.95

Efficient power management with standardized power supplies for optimized performance and energy efficiency.

No. of Terminals: 900

Sufficient number of terminals for connectivity and interfacing with other components in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA allows for customizable logic implementation and quick reprogramming, making it suitable for prototyping and rapid development.

Package Style (Meter): GRID ARRAY

Grid array package style provides compact and organized layout for efficient use of space on circuit boards.

Minimum Supply Voltage: 0.922 V

Low minimum supply voltage for energy-efficient operation and reduced power consumption.

Maximum Operating Temperature: 100 °C

Wide operating temperature range allows for reliable performance under various environmental conditions.

Pitch Of Terminal: 1 mm

Optimal terminal pitch for easy soldering and assembly, enhancing the manufacturability of the product.

Organization: 1920 CLBS

Well-organized CLBs for structured and efficient logic implementation in the FPGA design.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the FPGA can function in cold environments without issues.

Finishing Of Terminal Used: TIN SILVER COPPER

Durable terminal finishing with a mix of metals for reliable and long-lasting connections in the system.

Position Of Terminal: BOTTOM

Bottom terminal positioning for easy integration into circuit boards and efficient use of space.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level 4 ensures the FPGA can withstand standard levels of moisture exposure without damage.

Maximum Seated Height: 2.8 mm

Low seated height for compact installation and space-saving design in electronic systems.

Width: 31 mm

Standard width for compatibility with common PCB sizes and easy integration into circuit board layouts.

No. of Outputs: 520

High number of output pins for signal transmission and interfacing with external components in the system.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow temperature duration ensures reliable soldering of the FPGA during manufacturing processes.

Peak Reflow Temperature °C: 245

High peak reflow temperature for secure and durable solder joints during assembly and soldering of the FPGA.

Length: 31 mm

Standard length for compatibility with common PCB sizes and easy integration into circuit board layouts.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU040-2FBVA900E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

530250

No. of Inputs:

520

No. of Outputs:

520

No. of CLBs:

1920

Sub-Category:

Field Programmable Gate Arrays

Organization:

1920 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.922 V

Maximum Supply Voltage:

.979 V

Power Supplies:

0.95 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

2.8 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCKU040-2FBVA900E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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