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XCKU040-2FBVA676E

Xilinx

XCKU040-2FBVA676E by Xilinx

XCKU040-2FBVA676E by Xilinx is a PLASTIC/EPOXY FPGA with 530250 logic cells. It has 1920 CLBs and 520 inputs/outputs. This FPGA is suitable for applications requiring high-performance programmable ICs.

Median Price

$2,567.800

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VNN

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Argo Parts USA

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$2,444.662

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Microchip USA

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Netroflash

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QUARKTWIN TECHNOLOGY LTD

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Overview

Experience superior performance and flexibility with the XCKU040-2FBVA676E by Xilinx. As a leading manufacturer in field programmable gate arrays (FPGA), Xilinx delivers exceptional quality and reliability. This cutting-edge device boasts 530,250 logic cells, 1,920 CLBs, and 520 inputs and outputs, making it perfect for a wide range of applications. Whether you're developing advanced AI systems or designing high-performance networking solutions, the XCKU040-2FBVA676E offers unparalleled value, benefits, and advantages. With its compact square shape, surface mount capability, and versatile package style, this FPGA is the ultimate choice for those seeking top-notch performance. Unlock your creativity and achieve groundbreaking results with Xilinx's XCKU040-2FBVA676E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FPGA lightweight and durable, suitable for various applications.

No. of Logic Cells: 530250

Large number of logic cells provide high flexibility and processing power for complex designs and computations.

Surface Mount: YES

Surface mounting capability allows for easy and efficient PCB assembly, saving time and effort.

Maximum Supply Voltage: 0.979 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation, making the FPGA energy-efficient.

No. of CLBs: 1920

Abundance of Configurable Logic Blocks (CLBs) enables versatile programming and customization of the FPGA for specific tasks.

No. of Inputs: 520

Numerous input pins allow for interfacing with external devices and sensors, enhancing the versatility of the FPGA.

Package Shape: SQUARE

Square package shape ensures efficient use of space, making it easier to integrate the FPGA into compact electronic systems.

Form Of Terminal: BALL

Ball terminals provide reliable connections and high density packaging, optimizing the signal transmission and connectivity of the FPGA.

Nominal Supply Voltage (V): 0.95

Stable nominal supply voltage ensures consistent performance and reliable operation of the FPGA in various conditions.

Power Supplies (V): 0.95

Compatible power supply voltages simplify system design and integration, making the FPGA easier to work with.

No. of Terminals: 676

Sufficient number of terminals allow for versatile connectivity options and facilitate the integration of the FPGA into complex electronic systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, the FPGA offers high level of flexibility and customization for a wide range of applications.

Package Style (Meter): GRID ARRAY

Grid array package style facilitates easy mounting and soldering on PCBs, ensuring reliable connections and efficient assembly.

Minimum Supply Voltage: 0.922 V

Low minimum supply voltage allows the FPGA to operate efficiently even in low power scenarios, extending its usability across a range of applications.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance enables the FPGA to function reliably in harsh environmental conditions without any performance degradation.

Pitch Of Terminal: 1 mm

1mm terminal pitch allows for compact design and efficient routing of signals on PCB, improving overall system performance.

Organization: 1920 CLBS

Organized structure of 1920 Configurable Logic Blocks (CLBs) provides a systematic approach to programming and designing complex logic circuits.

Minimum Operating Temperature: 0 °C

Wide temperature range from 0 °C ensures the FPGA can operate reliably in both extreme cold and hot environments, enhancing its versatility.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin, silver, and copper finishing on terminals provide excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the FPGA.

Position Of Terminal: BOTTOM

Bottom terminal placement allows for efficient heat dissipation and better signal integrity, contributing to the overall reliability and performance of the FPGA.

Moisture Sensitivity Level (MSL): 4

MSL rating of 4 indicates that the FPGA is robust against moisture exposure, making it suitable for a wide range of environments and applications.

Maximum Seated Height: 2.71 mm

Low seated height enables the FPGA to be integrated into compact devices and systems without compromising on performance or reliability.

Width: 27 mm

Compact width of 27mm allows for easy integration and placement of the FPGA on PCBs, optimizing board space utilization.

No. of Outputs: 520

Numerous output pins enable the FPGA to drive multiple external devices and interfaces, enhancing its capability to handle complex output tasks.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures efficient soldering and mounting of the FPGA on PCBs, reducing assembly time and effort.

Peak Reflow Temperature °C: 250

High peak reflow temperature tolerance of 250 °C ensures reliable and robust solder joints, enhancing the durability and longevity of the FPGA.

Length: 27 mm

Compact length of 27mm allows for efficient placement and routing of signals on PCB, optimizing the overall system design and performance.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU040-2FBVA676E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

530250

No. of Inputs:

520

No. of Outputs:

520

No. of CLBs:

1920

Sub-Category:

Field Programmable Gate Arrays

Organization:

1920 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.922 V

Maximum Supply Voltage:

.979 V

Power Supplies:

0.95 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.71 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCKU040-2FBVA676E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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