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XCKU115-2FLVB1760E

Xilinx

XCKU115-2FLVB1760E by Xilinx

Xilinx XCKU115-2FLVB1760E FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 100°C.

Median Price

$10,161.445

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Nova Conductors

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AZTECH Wire

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One Stop Electronics

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Overview

Unlock endless possibilities with the XCKU115-2FLVB1760E by Xilinx, a leading manufacturer in Field Programmable Gate Arrays (FPGA). With over 1.4 million logic cells and 5520 CLBs, this FPGA is a powerhouse for innovation. Whether you're in telecommunications, automotive, or aerospace industries, this product offers unmatched flexibility and performance. Experience the value of customizable solutions, increased efficiency, and rapid development cycles with the XCKU115-2FLVB1760E. Elevate your projects to new heights with Xilinx's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, making it suitable for a variety of environments.

No. of Logic Cells: 1451100

With a high number of logic cells, this FPGA can handle complex processing tasks efficiently.

Surface Mount: YES

Being surface mountable allows for easier and more convenient integration into electronic systems.

Maximum Supply Voltage: 0.979 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

No. of CLBs: 5520

Having a high number of Configurable Logic Blocks (CLBs) provides flexibility and customization in design implementations.

No. of Inputs: 832

Having a high number of inputs allows for the FPGA to process a large amount of data simultaneously.

Package Shape: SQUARE

The square shape of the package offers a compact form factor, making it easier to fit into tight spaces.

Form Of Terminal: BALL

Ball terminals provide a reliable connection and easy soldering for circuit board mounting.

Nominal Supply Voltage (V): 0.95

The stable nominal supply voltage ensures consistent performance of the FPGA.

Power Supplies (V): 0.95

The consistent power supply voltage ensures reliable operation of the FPGA.

No. of Terminals: 1760

Having a high number of terminals allows for versatile connectivity options.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array offers flexibility in design and reconfigurability for various applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides a high-density packaging solution for efficient use of board space.

Minimum Supply Voltage: 0.922 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature tolerance makes this FPGA suitable for industrial and harsh environments.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals allows for precise and compact placement on circuit boards.

Organization: 5520 CLBS

The organized structure of 5520 Configurable Logic Blocks enables efficient design implementation and resource utilization.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing provides excellent conductivity and durability.

Position Of Terminal: BOTTOM

Bottom positioned terminals allow for easy and secure mounting on circuit boards.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that this FPGA can withstand standard moisture exposure levels during handling and assembly.

Maximum Seated Height: 4.11 mm

The low maximum seated height enables this FPGA to be used in compact electronic systems.

Width: 42.5 mm

The moderate width allows for compatibility with standard board layouts and designs.

No. of Outputs: 832

Having a high number of outputs enables the FPGA to drive multiple signals and interfaces efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum reflow time at peak temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance allows for robust soldering processes during manufacturing.

Length: 42.5 mm

The moderate length of the FPGA accommodates standard board sizes for easy integration into electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU115-2FLVB1760E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

1451100

No. of Inputs:

832

No. of Outputs:

832

No. of CLBs:

5520

Sub-Category:

Field Programmable Gate Arrays

Organization:

5520 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.922 V

Maximum Supply Voltage:

.979 V

Power Supplies:

0.95 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

42.5 mm

Width:

42.5 mm

Maximum Seated Height:

4.11 mm

Package Equivalence Code:

BGA1760,42X42,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1760

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCKU115-2FLVB1760E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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