Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Xilinx XCKU060-3FFVA1156E FPGA features 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.97V to 1.03V, making it suitable for various industrial environments.
Median Price
$6,026.450
Lifecycle Status
Suppliers In-Stock
6
In-Stock Inventory
1k+
Mouser Electronics
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Digiode
$5,619.848
VNN
$5,915.630
Nova Conductors
Vyrian
Chip Stock
AZTECH Wire
$15.121
Modulus Dynamics
$57.651
MARBEL Systems
$63.606
$61.061
Texas Native Microelectronics
$73.110
$70.186
$67.992
Kenton Components
$87.732
$77.204
One Stop Electronics
$5,028.290
Ampacity Inc.
Semicontronic
$4,902.583
$4,877.441
Corphita
$5,324.067
Argo Parts USA
$5,856.474
$5,797.317
$5,738.161
Continental Prestige Electronics
Corohmni
Supply Digital
Vigor
Qasali Group International
$189.501
$173.709
Bastille Electronics
The use of plastic/epoxy material in the package body makes the FPGA lightweight and durable, ensuring easy handling and longevity.
With a high number of logic cells, this FPGA offers high processing capability and is suitable for complex applications that require extensive computational power.
Being surface mountable, this FPGA is easy to integrate into circuit boards, simplifying the manufacturing process and reducing assembly time.
The high maximum supply voltage of 1.03V allows for flexibility in power requirements and ensures compatibility with a wide range of power sources.
With 2760 Configurable Logic Blocks (CLBs), this FPGA offers versatile logic configurations and can be tailored to suit specific application needs.
The large number of input pins allows for extensive connectivity options and facilitates interfacing with multiple external devices for input data.
The square package shape offers efficient use of space on the circuit board, maximizing the integration possibilities in constrained layouts.
The use of ball terminals provides reliable electrical connections and facilitates convenient soldering during the assembly process.
With 1156 terminals, this FPGA offers a high degree of connectivity options for interfacing with various external components and peripherals.
As a Field Programmable Gate Array (FPGA), this IC can be reconfigured and programmed to adapt to changing requirements, making it versatile and cost-effective for a range of applications.
The grid array package style provides secure mounting and alignment on the circuit board, ensuring stability and reliability during operation.
The low minimum supply voltage of 0.97V enables power-efficient operation and contributes to reduced energy consumption in the overall system.
With a high maximum operating temperature of 100°C, this FPGA can withstand elevated temperature environments and is suitable for industrial applications.
The 1mm pitch of terminals allows for compact placement on the circuit board, enabling efficient use of space and reducing signal interference.
The organizational structure of 2760 CLBs provides a systematic approach to logic design and implementation, simplifying the programming process and enhancing efficiency.
With a low minimum operating temperature of 0°C, this FPGA can function reliably in cold environments without compromising performance or durability.
The use of tin, silver, and copper finishes on the terminals ensures excellent conductivity, corrosion resistance, and solderability, enhancing the overall reliability of the connections.
The placement of terminals at the bottom of the package facilitates easy mounting and soldering on the circuit board, simplifying the assembly process and ensuring secure connections.
With an MSL of 4, this FPGA has a moderate moisture sensitivity level and can be safely handled and stored in typical manufacturing environments without special precautions.
The maximum seated height of 3.51mm allows for a compact and low-profile design, making this FPGA suitable for space-constrained applications where height clearance is limited.
The 35mm width offers a balanced size for the package, making it compatible with standard board layouts and ensuring easy integration into various electronic systems.
With 624 output pins, this FPGA supports multiple output signals and provides a high degree of flexibility in routing and transmitting data to external devices.
The 35mm length provides a compact form factor for the FPGA, enabling efficient use of space on the circuit board and contributing to a streamlined overall system design.
Field Programmable Gate Arrays (FPGA) XCKU060-3FFVA1156E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
No. of Logic Cells:
No. of Inputs:
No. of Outputs:
No. of CLBs:
Sub-Category:
Organization:
Nominal Supply Voltage:
Minimum Supply Voltage:
Maximum Supply Voltage:
Power Supplies:
Minimum Operating Temperature:
Maximum Operating Temperature:
Temperature Grade:
Moisture Sensitivity Level (MSL):
Package Body Material:
Surface Mountable:
Package Style:
Package Code:
Package Shape:
Length:
Width:
Maximum Seated Height:
Package Equivalence Code:
Terminal Position:
Terminal Style:
Terminal Finish:
Terminal Pitch:
No. of Terminals:
JESD-30 Code:
JESD-609 Code:
Qualified:
XCKU060-3FFVA1156E Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Ultrascale & Virtex Dev Spec Chg 20/Dec/2016
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
BSS123LT1G
Onsemi
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
1N4148WT
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
LL4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
Frontier Electronics
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
BAV99
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
Weitronic Enterprise
Daco Semiconductor
1N4148WS
Taiwan Semiconductor
Db Lectro
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
XC6SLX75-3CSG484I
Xilinx
The Xilinx XC6SLX75-3CSG484I is a FPGA with 74637 logic cells, 5831 CLBs, and 328 inputs/outputs. It operates at max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing in compact form factors due to its advanced CMOS technology and fine pitch grid array package style.
XC7K325T-2FFG900C
Xilinx XC7K325T-2FFG900C FPGA features 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
EP3C25F324I7N
Intel
The Intel EP3C25F324I7N is a CMOS FPGA with 24624 logic cells and CLBs. It operates at max 472.5 MHz clock frequency, suitable for industrial applications requiring high-speed processing. With 215 inputs/outputs, it offers flexibility in designing complex digital circuits efficiently.
XC7K410T-2FFG900I
Xilinx XC7K410T-2FFG900I FPGA features 406720 logic cells, 31775 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a grid array package style.
XC7A12T-1CPG238I
Xilinx XC7A12T-1CPG238I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a low profile grid array package style.
XC6SLX150-2FGG484I
Xilinx XC6SLX150-2FGG484I FPGA features 147443 logic cells, 11519 CLBs, and 338 inputs/outputs. Operating at a max frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor with a grid array package style.
XC7A25T-2CSG325C
The Xilinx XC7A25T-2CSG325C is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various industries. With a package style of grid array and low profile, it offers flexibility in design while maintaining high performance standards.
EP4CE30F23I7N
EP4CE30F23I7N by Intel is a FPGA with 28848 logic cells, 1803 CLBs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable IC capabilities, such as telecommunications equipment and industrial automation systems.
XCAU10P-1UBVA368I
FIELD PROGRAMMABLE GATE ARRAY;
10M16SAU169C8G
Altera
The Altera 10M16SAU169C8G is a field programmable gate array (FPGA) with 169 terminals in a square BGA package. It can operate between 0 to 85 degrees Celsius and is suitable for various applications that require FPGA functionality.
10M08SAE144C8G
Intel 10M08SAE144C8G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-performance processing in commercial extended temperature environments.
LCMXO3LF-6900C-6BG256C
Lattice Semiconductor
LCMXO3LF-6900C-6BG256C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, operating b/w 0-85°C. It features a grid array package style, 0.8mm terminal pitch, and is ideal for applications requiring high-performance programmable ICs in compact designs.
EP4CE6F17C6N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
M2GL005-TQG144I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC7K325T-3FFG900E
Xilinx XC7K325T-3FFG900E is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1412 MHz. It uses CMOS technology and has 500 inputs/outputs. Ideal for high-performance computing applications requiring fast processing speeds.
M1A3P1000-PQG208M
Microchip Technology
M1A3P1000-PQG208M by Microchip Technology is a CMOS FPGA with 24576 logic cells and 1000000 equivalent gates. Operating at up to 350 MHz, it has 154 inputs/outputs and supports supply voltages of 1.425V to 1.575V. Ideal for military-grade applications requiring high-speed processing in compact form factors.
XC7S15-2FTGB196I
The Xilinx XC7S15-2FTGB196I is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and low power consumption. The package style is grid array, low profile, fine pitch with matte tin finishing for optimal performance.
M1AGL600V2-FGG144I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
M7A3P1000-FG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
10M08SAM153I7G
The Altera 10M08SAM153I7G is a field programmable gate array (FPGA) with a plastic/epoxy package and surface mount capability. It has a square package shape with ball terminals and a package code of BGA. With 153 terminals, it is a versatile programmable IC. It features a grid array package style and bottom terminal position. The JESD-30 code for this FPGA is S-PBGA-B153. Unfortunately, detailed information regarding its maximum time at peak reflow temperature and peak reflow temperature are not specified.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCKU040-2FFVA1156E
Xilinx XCKU040-2FFVA1156E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Package style: Grid Array, with a max operating temperature of 100°C.
XCKU3P-1FFVD900E
Xilinx XCKU3P-1FFVD900E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it suitable for various industrial environments.
XCKU3P-2FFVB676E
Xilinx XCKU3P-2FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.876 V. Package style is grid array with a square shape and ball terminals, suitable for various industrial uses.
XCKU060-1FFVA1517I
Xilinx XCKU060-1FFVA1517I FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range (-40 to 100°C) and low supply voltage (0.922-0.979V).
XCKU3P-1FFVA676E
Xilinx XCKU3P-1FFVA676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 0.876 V. Suitable for various industries due to its versatile programmable IC type and grid array package style.
XCKU035-2FBVA900I
Xilinx XCKU035-2FBVA900I FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. The package style is a grid array with a square shape and ball terminals for surface mount assembly.
XCKU040-2FFVA1156I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
XCKU060-1FFVA1517C
Xilinx XCKU060-1FFVA1517C FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.
XCKU3P-1FFVB676I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCKU115-2FLVA1517E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCKU060-2FFVA1156E
Xilinx XCKU060-2FFVA1156E FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.979 V. Suitable for various industries due to its versatility and robust design capabilities.
XCKU3P-1FFVB676E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCKU040-1FFVA1156C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
XCKU025-1FFVA1156I
Xilinx XCKU025-1FFVA1156I FPGA offers 318150 logic cells, 18180 CLBs, and 312 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a wide operating temperature range (-40 to 100°C) in a compact square grid array package.
XCKU035-1FFVA1156C
XCKU5P-2FFVB676E
Xilinx XCKU5P-2FFVB676E FPGA offers 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 100°C.
XCKU3P-1SFVB784E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;
XCKU035-2FBVA900E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
XCKU040-3FFVA1156E
XCKU060-2FFVA1517I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved