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XCKU5P-1FFVD900E

Xilinx

XCKU5P-1FFVD900E by Xilinx

Xilinx XCKU5P-1FFVD900E FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. It operates b/w -40 to 100°C and has a supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-performance computing in compact spaces with stringent power requirements.

Median Price

$2,168.080

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Mouser Electronics

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Digiode

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VNN

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Kenton Components

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Overview

Unleash the power of innovation with the XCKU5P-1FFVD900E by Xilinx, a cutting-edge Field Programmable Gate Array (FPGA) that offers unmatched quality and performance. With 474600 logic cells and 27120 CLBs, this FPGA is designed to elevate your projects to new heights. Ideal for applications requiring flexibility and customization, the XCKU5P-1FFVD900E boasts a package shape of a square and a form of terminal in ball shape, ensuring seamless integration. Trust Xilinx, a renowned manufacturer in the industry, to deliver excellence and reliability. Elevate your designs and achieve superior results with the XCKU5P-1FFVD900E FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package makes the FPGA lightweight and durable, suitable for a variety of applications.

No. of Logic Cells: 474600

With a high number of logic cells, this FPGA can handle complex and large-scale designs efficiently.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 0.876 V

Operates efficiently at a relatively low maximum supply voltage, reducing power consumption and heat generation.

No. of CLBs: 27120

The large number of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic functions.

No. of Inputs: 304

Multiple input options allow for versatile input configurations, enabling the FPGA to interface with various external devices.

Package Shape: SQUARE

Square package shape is space-efficient and allows for easier placement on circuit boards.

Nominal Supply Voltage (V): 0.85

Stable nominal supply voltage ensures consistent performance and reliable operation.

No. of Terminals: 900

A high number of terminals provide ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for customization and reconfiguration of logic functions as needed.

Package Style (Meter): GRID ARRAY

Grid array package style simplifies the connection of the FPGA to the rest of the circuit, enhancing reliability.

Minimum Supply Voltage: 0.825 V

Low minimum supply voltage enables efficient operation at varying power levels, extending battery life in portable applications.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance ensures reliable performance even in demanding environments.

Pitch Of Terminal: 1 mm

A standard pitch of terminals allows for easy layout and connection to other components on a circuit board.

Organization: 27120 CLBS

Well-organized 27120 Configurable Logic Blocks (CLBs) provide a structured design environment for implementing complex logic functions.

Minimum Operating Temperature: 0 °C

Operates reliably at low temperatures, suitable for applications in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of multiple finishing materials enhances terminal conductivity and reliability of connections.

Position Of Terminal: BOTTOM

Bottom positioning of terminals facilitates easy soldering and connection to the circuit board.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates low moisture sensitivity, suitable for applications in humid or wet environments.

Maximum Seated Height: 3.42 mm

Low maximum seated height allows for compact and slim designs in space-constrained applications.

Width: 31 mm

A moderate width makes the FPGA suitable for various board sizes and designs.

No. of Outputs: 304

Multiple output options enable the FPGA to drive a variety of external devices or interfaces.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 245

High peak reflow temperature capability ensures secure solder joints and reliable connections during manufacturing.

Length: 31 mm

Moderate length allows for flexibility in layout and placement on a circuit board while conserving space.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU5P-1FFVD900E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

474600

No. of Inputs:

304

No. of Outputs:

304

No. of CLBs:

27120

Organization:

27120 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

3.42 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Trade Compliance

XCKU5P-1FFVD900E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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