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XCKU025-2FFVA1156E

Xilinx

XCKU025-2FFVA1156E by Xilinx

Xilinx XCKU025-2FFVA1156E FPGA offers 318150 logic cells, 18180 CLBs, and 312 inputs/outputs. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with grid array style. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.

Median Price

$1,802.930

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Mouser Electronics

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EBV Elektronik

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Digiode

USA . 314 parts In-Stock

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VNN

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Vyrian

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Modulus Dynamics

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Texas Native Microelectronics

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$181.840

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Kenton Components

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$218.208

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$209.480

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$202.933

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$192.023

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Qasali Group International

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Corphita

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Supply Digital

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RC Electronics

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Futuretech Components

Singapore . 20 parts In-Stock

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Overview

Unlock the power of innovation with the Xilinx XCKU025-2FFVA1156E Field Programmable Gate Array. Manufactured by industry leader Xilinx, this FPGA boasts top-quality construction and advanced technology. With over 300,000 logic cells and a multitude of inputs and outputs, this versatile device is perfect for a wide range of applications. Whether you're designing cutting-edge electronics or optimizing industrial processes, the XCKU025-2FFVA1156E offers unmatched value, performance, and reliability. Upgrade your projects today with Xilinx's state-of-the-art FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 318150

Large number of logic cells allows for complex programmable functions to be implemented.

Surface Mount: YES

Easy to mount on a PCB for integration into a larger system.

Maximum Supply Voltage: 0.979 V

Efficient power consumption and low heat generation.

No. of CLBs: 18180

Abundance of Configurable Logic Blocks enables versatile functionality.

No. of Inputs: 312

High number of inputs allows for a wide range of external signals to be processed.

Package Shape: SQUARE

Compact design for efficient use of space on a PCB.

Form Of Terminal: BALL

Ball terminal design for reliable electrical connections.

Nominal Supply Voltage (V): 0.95

Stable supply voltage for consistent performance.

No. of Terminals: 1156

Sufficient number of terminals for connectivity.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Flexibility to program and reprogram the device for various applications.

Package Style (Meter): GRID ARRAY

Grid array package style for easy mounting and alignment on the PCB.

Minimum Supply Voltage: 0.922 V

Allows for operation at lower voltages for energy efficiency.

Maximum Operating Temperature: 100 °C

Wide operating temperature range suitable for various environments.

Pitch Of Terminal: 1 mm

Standard pitch for easy mounting and soldering.

Organization: 18180 CLBS

Structured organization of CLBs for efficient use of logic resources.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments without issues.

Finishing Of Terminal Used: TIN SILVER COPPER

High-quality terminal finishing for reliable electrical connections.

Position Of Terminal: BOTTOM

Bottom terminal position for easy integration into a PCB layout.

Moisture Sensitivity Level (MSL): 4

MSL level 4 for robustness against moisture exposure.

Maximum Seated Height: 3.42 mm

Low profile design for space-constrained applications.

Width: 35 mm

Compact width for efficient PCB layout.

No. of Outputs: 312

High number of outputs for versatile signal processing capabilities.

Length: 35 mm

Balanced length for a square package design.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU025-2FFVA1156E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

318150

No. of Inputs:

312

No. of Outputs:

312

No. of CLBs:

18180

Organization:

18180 CLBS

Power Characteristics

Nominal Supply Voltage:

0.95

Minimum Supply Voltage:

.922 V

Maximum Supply Voltage:

.979 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.42 mm

Package Equivalence Code:

BGA1156,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e1

Trade Compliance

XCKU025-2FFVA1156E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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