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XCKU15P-L2FFVA1156E

Xilinx

XCKU15P-L2FFVA1156E by Xilinx

Xilinx XCKU15P-L2FFVA1156E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 110°C.

Median Price

$7,855.865

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 870 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 258 parts In-Stock

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Ampacity Inc.

Singapore . 291 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 300 parts In-Stock

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Corohmni

South Africa . 157 parts In-Stock

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 615 parts In-Stock

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Texas Native Microelectronics

USA . 326 parts In-Stock

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Kenton Components

USA . 580 parts In-Stock

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Qasali Group International

UK . 30 parts In-Stock

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Argo Parts USA

USA . 5,329 parts In-Stock

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Continental Prestige Electronics

USA . 5,298 parts In-Stock

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Overview

Unleash the power of innovation with the XCKU15P-L2FFVA1156E by Xilinx. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Xilinx delivers unmatched quality and reliability in each product, ensuring top-notch performance for a wide range of applications. With a multitude of logic cells and inputs, this FPGA offers unparalleled flexibility and customization. Experience the value and benefits of Xilinx's cutting-edge technology, providing customers with the tools they need to bring their ideas to life. Elevate your projects with the XCKU15P-L2FFVA1156E and unlock endless possibilities in the world of programmable ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package for the FPGA.

No. of Logic Cells: 1143450

Having a large number of logic cells allows for complex programmable logic designs to be implemented effectively.

Surface Mount: YES

The surface mount capability makes it easier to integrate the FPGA onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 0.742 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the FPGA energy-efficient.

No. of CLBs: 65340

The high number of Configurable Logic Blocks (CLBs) provides flexibility in creating custom logic functions and configurations.

No. of Inputs: 668

Having a large number of inputs allows for diverse connectivity options and input signal processing capabilities.

Nominal Supply Voltage (V): 0.72

The nominal supply voltage ensures stable and reliable operation of the FPGA within specified voltage limits.

No. of Terminals: 1156

The abundant number of terminals enables connectivity to other components and peripherals for versatile system integration.

Package Style (Meter): GRID ARRAY

The grid array package style offers ease of mounting and soldering on PCBs, enhancing manufacturing efficiency.

Minimum Supply Voltage: 0.698 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and reduces the risk of overvoltage damage.

Maximum Operating Temperature: 110 °C

The high maximum operating temperature makes the FPGA suitable for demanding industrial and automotive applications where temperature variations are common.

Pitch Of Terminal: 1 mm

The 1mm terminal pitch simplifies PCB layout and allows for compact design configurations.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making it suitable for diverse applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of multiple metals for terminal finishing improves conductivity, corrosion resistance, and solderability, enhancing overall product reliability.

Position Of Terminal: BOTTOM

Having terminals located at the bottom facilitates easy connection to PCBs and allows for a more compact form factor.

Moisture Sensitivity Level (MSL): 4

The MSL rating indicates the product's resistance to moisture, ensuring reliability in humid environments and during assembly processes.

Maximum Seated Height: 3.71 mm

The low maximum seated height helps in achieving a slim and space-efficient design for the overall system.

Width: 35 mm

The compact width dimension allows for easy integration into various electronic devices and systems with limited space constraints.

No. of Outputs: 668

The high number of outputs enables the FPGA to drive multiple devices and perform multiple functions simultaneously, enhancing its processing capabilities.

Length: 35 mm

The balanced length dimension complements the width and height specifications, making the FPGA suitable for a wide range of form factors and applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU15P-L2FFVA1156E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

1143450

No. of Inputs:

668

No. of Outputs:

668

No. of CLBs:

65340

Organization:

65340 CLBs

Additional Features:

Also Operates at 0.85 V nominal supply

Power Characteristics

Nominal Supply Voltage:

0.72

Minimum Supply Voltage:

.698 V

Maximum Supply Voltage:

.742 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

110 °C (230 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.71 mm

Package Equivalence Code:

BGA1156,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e1

Trade Compliance

XCKU15P-L2FFVA1156E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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