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XCVU095-H1FFVC1517E

Xilinx

XCVU095-H1FFVC1517E by Xilinx

Xilinx XCVU095-H1FFVC1517E FPGA features 1176000 logic cells, 67200 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.979 V. Suitable for various industries due to its versatile package style and operating temperature range from 0 to 100°C.

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Overview

Unlock a world of limitless possibilities with the XCVU095-H1FFVC1517E by Xilinx, a top-tier manufacturer in the Field Programmable Gate Arrays (FPGA) category. This cutting-edge product boasts unparalleled quality and reliability, offering customers a powerful solution for their programmable IC needs. With 1176000 logic cells and 67200 CLBs, this FPGA delivers exceptional performance and versatility. Whether you're working on complex data processing tasks or advanced signal processing applications, the XCVU095-H1FFVC1517E provides unmatched value, benefits, and advantages to help you achieve your goals efficiently and effectively. Elevate your projects to new heights with Xilinx's innovative FPGA technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the FPGA lightweight and durable, suitable for various applications.

No. of Logic Cells: 1176000

With a high number of logic cells, this FPGA offers extensive programmability and flexibility for complex designs.

Surface Mount: YES

Being surface mountable, this FPGA is easier to integrate onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 0.979 V

The low maximum supply voltage of 0.979 V ensures energy efficiency and minimizes power consumption.

No. of CLBs: 67200

The large number of Configurable Logic Blocks (CLBs) provides the FPGA with high processing capabilities and the ability to handle complex logic functions efficiently.

No. of Inputs: 832

Having 832 inputs allows for a wide range of external signals to be processed by the FPGA, enabling versatile functionality.

Package Shape: SQUARE

The square package shape offers convenient mounting and handling, making it suitable for various board layouts and designs.

Nominal Supply Voltage (V): 0.95

The nominal supply voltage of 0.95 V ensures stable performance and reliable operation of the FPGA.

No. of Terminals: 1517

With a high number of terminals, the FPGA offers extensive connectivity options for interfacing with external components and devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field programmable gate array, this IC type allows for flexibility in design and customization, making it ideal for prototyping and rapid development.

Package Style (Meter): GRID ARRAY

The grid array package style ensures easy placement and soldering onto PCBs, enhancing the reliability and manufacturability of the product.

Minimum Supply Voltage: 0.922 V

The low minimum supply voltage of 0.922 V enables energy-efficient operation and extends the battery life in portable applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C allows for reliable operation in demanding environments and industrial applications.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals enables high-density mounting and compact PCB designs, saving space and optimizing circuit layout.

Organization: 67200 CLBS

The organization of 67200 Configurable Logic Blocks (CLBs) ensures efficient resource utilization and enables complex logic functions to be implemented effectively.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, the FPGA can reliably operate in a wide range of environmental conditions, from cold to hot climates.

Finishing Of Terminal Used: TIN SILVER COPPER

The finishing of terminals with tin, silver, and copper materials provides excellent conductivity, corrosion resistance, and solderability, ensuring robust connections.

Position Of Terminal: BOTTOM

The bottom position of terminals simplifies board mounting and soldering processes, making integration and assembly more efficient.

Moisture Sensitivity Level (MSL): 4

With a Moisture Sensitivity Level (MSL) of 4, the FPGA is suitable for standard reflow soldering processes and offers good reliability during manufacturing.

Maximum Seated Height: 3.51 mm

The maximum seated height of 3.51 mm ensures compatibility with various PCB layouts and mechanical constraints, making it easy to fit into compact designs.

Width: 40 mm

The 40 mm width of the FPGA offers a compact form factor, allowing for efficient use of board space and enabling versatile integration in different applications.

No. of Outputs: 832

With 832 outputs, the FPGA can drive a large number of external devices and components, enabling versatile signal processing and control capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature of 245°C ensures reliable soldering and thermal stability during assembly processes.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C allows for efficient and reliable soldering of the FPGA onto PCBs, ensuring robust electrical connections.

Length: 40 mm

The 40 mm length of the FPGA ensures a standardized form factor, making it compatible with various board designs and layouts for easy integration.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCVU095-H1FFVC1517E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

1176000

No. of Inputs:

832

No. of Outputs:

832

No. of CLBs:

67200

Organization:

67200 CLBS

Additional Features:

Also Operates at 1 V nominal supply

Power Characteristics

Nominal Supply Voltage:

0.95

Minimum Supply Voltage:

.922 V

Maximum Supply Voltage:

.979 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

40 mm

Width:

40 mm

Maximum Seated Height:

3.51 mm

Package Equivalence Code:

BGA1517,39X39,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Trade Compliance

XCVU095-H1FFVC1517E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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