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XCKU11P-1FFVA1156E

Xilinx

XCKU11P-1FFVA1156E by Xilinx

Xilinx XCKU11P-1FFVA1156E FPGA offers 653100 logic cells, 37320 CLBs, and 512 inputs/outputs. Ideal for applications requiring high processing power in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.825V to 0.876V.

Median Price

$3,725.085

Lifecycle Status

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Mouser Electronics

USA . 4 parts In-Stock

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DigiKey

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Digiode

USA . 184 parts In-Stock

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$3,294.790

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VNN

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Nova Conductors

Japan . 200 parts In-Stock

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Vyrian

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Chip Stock

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AZTECH Wire

Italy . 414 parts In-Stock

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$16.399

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Texas Native Microelectronics

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$115.515

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$110.894

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$107.429

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$101.653

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

India . 2 parts In-Stock

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Corphita

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Corohmni

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Microchip USA

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Netroflash

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MARBEL Systems

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Supply Digital

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Qasali Group International

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Vigor

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Kenton Components

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Overview

Unlock endless possibilities with the Xilinx XCKU11P-1FFVA1156E Field Programmable Gate Array. With over 650,000 logic cells and 512 inputs/outputs, this FPGA offers unmatched flexibility and customization for your projects. Manufactured by industry leader Xilinx, known for their high-quality products, this FPGA is perfect for a wide range of applications. Whether you're designing cutting-edge technology or pushing the boundaries of innovation, the XCKU11P-1FFVA1156E provides the performance and reliability you need to bring your ideas to life. Elevate your projects with the power of Xilinx today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material provides a good balance of durability and cost-effectiveness for the FPGA.

No. of Logic Cells: 653100

With a high number of logic cells, this FPGA offers a large amount of programmable resources for complex designs.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 0.876 V

The maximum supply voltage of 0.876 V ensures efficient power usage and helps in preventing overheating of the FPGA.

No. of CLBs: 37320

The high number of Configurable Logic Blocks (CLBs) provides flexibility and customization options for designing complex logic circuits.

No. of Inputs: 512

Having a large number of inputs allows for versatile connectivity with external devices and sensors.

Package Shape: SQUARE

The square package shape is space-efficient for PCB layout and ensures a compact design of the FPGA.

Form Of Terminal: BALL

The ball terminal form provides reliable electrical connections and makes soldering easier during the assembly process.

Nominal Supply Voltage (V): 0.85

The nominal supply voltage of 0.85 V is within the optimal range for stable operation and power efficiency of the FPGA.

No. of Terminals: 1156

The high number of terminals allows for versatile connectivity options and makes it easier to interface with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for reprogramming of logic functions, making it adaptable to changing design requirements.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized arrangement of terminals, making PCB design and assembly more efficient.

Minimum Supply Voltage: 0.825 V

The minimum supply voltage of 0.825 V ensures compatibility with low-power applications and helps in reducing energy consumption.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA can withstand high temperature environments and operates reliably under various conditions.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals allows for precise mounting and soldering, ensuring a secure and stable connection on the PCB.

Organization: 37320 CLBS

The organization of 37320 Configurable Logic Blocks (CLBs) offers a structured and efficient layout for implementing complex logic functions.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can function reliably even in cold environments without any performance degradation.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishes on the terminals ensures good conductivity, corrosion resistance, and reliable solder joints.

Position Of Terminal: BOTTOM

Having the terminals positioned at the bottom allows for easy access during PCB assembly and ensures a secure mounting on the circuit board.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that this FPGA is suitable for reflow soldering processes and can withstand moderate exposure to moisture without any damage.

Maximum Seated Height: 3.51 mm

With a maximum seated height of 3.51 mm, this FPGA is compact and allows for a lower profile design in tight spaces.

Width: 35 mm

The 35 mm width provides a balanced form factor for the FPGA, making it suitable for various PCB layouts and designs.

No. of Outputs: 512

With 512 outputs, this FPGA can drive a large number of external devices and provides flexibility in signal routing and data transmission.

Length: 35 mm

The 35 mm length offers a compact footprint for the FPGA, allowing for efficient use of space on the PCB and enabling versatile integration in different systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU11P-1FFVA1156E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

653100

No. of Inputs:

512

No. of Outputs:

512

No. of CLBs:

37320

Organization:

37320 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.51 mm

Package Equivalence Code:

BGA1156,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e1

Trade Compliance

XCKU11P-1FFVA1156E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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