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XCKU11P-L2FFVA1156E

Xilinx

XCKU11P-L2FFVA1156E by Xilinx

Xilinx XCKU11P-L2FFVA1156E FPGA offers 653100 logic cells, 37320 CLBs, and 512 inputs/outputs. Ideal for applications requiring high-performance computing and signal processing in industries like telecommunications, aerospace, and automotive. Operating temperature range from 0 to 110°C with a package style of grid array.

Median Price

$5,368.090

Lifecycle Status

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6

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1k+

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Avnet

USA . 1,250 parts In-Stock

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Nova Conductors

Japan . 16 parts In-Stock

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$5,548.530

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Vyrian

USA . 6,640 parts In-Stock

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Semicontronic

India . 1,480 parts In-Stock

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$5.000

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$4.875

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$4.850

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AZTECH Wire

Italy . 873 parts In-Stock

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One Stop Electronics

USA . 309 parts In-Stock

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Ampacity Inc.

Singapore . 394 parts In-Stock

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Corohmni

South Africa . 545 parts In-Stock

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 120 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 512 parts In-Stock

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$213.143

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$204.617

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$187.566

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$213.143

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$187.566

Qasali Group International

UK . 5,615 parts In-Stock

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Continental Prestige Electronics

USA . 6,413 parts In-Stock

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Argo Parts USA

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Microchip USA

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Advanced Electronics

New Zealand . 61 parts In-Stock

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MARBEL Systems

Belgium . 1,687 parts In-Stock

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Supply Digital

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Netroflash

USA . 50 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the XCKU11P-L2FFVA1156E by Xilinx, a top-tier player in the field programmable gate arrays (FPGA) industry. Boasting over 653100 logic cells and 37320 CLBs, this FPGA offers unparalleled performance and versatility for a wide range of applications. With a package body material made of plastic/epoxy and a grid array package style, this innovative product is designed to exceed expectations. Elevate your projects to new heights with the XCKU11P-L2FFVA1156E and experience the quality and reliability that only Xilinx can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, ensuring a longer lifespan.

No. of Logic Cells: 653100

High number of logic cells allows for complex programming and customization, making it versatile for various applications.

Surface Mount: YES

Surface mount capability enables easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 0.742 V

Low maximum supply voltage helps in reducing power consumption and increasing energy efficiency.

No. of CLBs: 37320

High number of Configurable Logic Blocks (CLBs) allows for extensive logic functions and design flexibility.

No. of Inputs: 512

Abundance of input channels enables connectivity with various external devices and sensors for input data processing.

Package Shape: SQUARE

Square package shape provides a more compact form factor, making it suitable for applications with size constraints.

Nominal Supply Voltage (V): 0.72

Stable nominal supply voltage ensures consistent performance and reliability of the FPGA.

No. of Terminals: 1156

High number of terminals allows for more connections and scalability in system integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) enables real-time reprogramming and customization, making it adaptable for various applications.

Package Style (Meter): GRID ARRAY

Grid array package style provides enhanced thermal performance and durability for the FPGA.

Minimum Supply Voltage: 0.698 V

Low minimum supply voltage ensures operational stability and efficiency under varying voltage conditions.

Maximum Operating Temperature: 110 °C

High maximum operating temperature tolerance allows for reliable performance in harsh environmental conditions.

Pitch Of Terminal: 1 mm

Minimal terminal pitch enables high-density mounting and improves signal integrity in the system.

Organization: 37320 CLBS

Organized configuration of CLBs provides efficient logic processing and design implementation in the FPGA.

Minimum Operating Temperature: 0 °C

Wide range of operating temperature ensures functionality in both extreme cold and hot environments.

Finishing Of Terminal Used: TIN SILVER COPPER

High-quality terminal finishing enhances conductivity and reliability of connections in the FPGA.

Position Of Terminal: BOTTOM

Bottom terminal positioning aids in easy PCB layout and integration, optimizing space utilization.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates excellent moisture resistance, ensuring long-term performance and durability in humid conditions.

Maximum Seated Height: 3.51 mm

Low seated height facilitates compact design and efficient cooling in the system.

Width: 35 mm

Moderate width allows for easy installation and compatibility with standard PCB layouts.

No. of Outputs: 512

Abundance of output channels enables versatile output functions and data transmission capabilities.

Length: 35 mm

Moderate length facilitates integration into various system configurations without excessive space requirements.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU11P-L2FFVA1156E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

653100

No. of Inputs:

512

No. of Outputs:

512

No. of CLBs:

37320

Organization:

37320 CLBS

Additional Features:

Also Operates at 0.85 V nominal supply

Power Characteristics

Nominal Supply Voltage:

0.72

Minimum Supply Voltage:

.698 V

Maximum Supply Voltage:

.742 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

110 °C (230 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.51 mm

Package Equivalence Code:

BGA1156,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e1

Trade Compliance

XCKU11P-L2FFVA1156E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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