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XCKU3P-L2FFVB676E

Xilinx

XCKU3P-L2FFVB676E by Xilinx

Xilinx XCKU3P-L2FFVB676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 110°C. The package style is grid array with a square shape and ball terminals, suitable for surface mount assembly.

Median Price

$2,387.290

Lifecycle Status

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6

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1k+

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

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VNN

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Digiode

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Component Sense

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AZTECH Wire

Italy . 434 parts In-Stock

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Ampacity Inc.

Singapore . 491 parts In-Stock

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Semicontronic

India . 1,120 parts In-Stock

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One Stop Electronics

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MARBEL Systems

Belgium . 9,815 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

Lithuania . 39 parts In-Stock

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Qasali Group International

UK . 563 parts In-Stock

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Argo Parts USA

USA . 5,159 parts In-Stock

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$2,339.544

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$2,315.671

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Continental Prestige Electronics

USA . 2,687 parts In-Stock

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Netroflash

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Supply Digital

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Overview

Unlock endless possibilities with the XCKU3P-L2FFVB676E FPGA by Xilinx. This cutting-edge field programmable gate array offers unparalleled quality and performance for a wide range of applications. With over 355,950 logic cells and 20,340 CLBs, this versatile FPGA delivers exceptional flexibility and efficiency. Whether you're in telecommunications, automotive, or aerospace, this FPGA is designed to meet your unique needs. Experience the value of innovation and reliability with Xilinx's industry-leading technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a cost-effective and lightweight option for the package, making it suitable for a wide range of applications.

No. of Logic Cells: 355950

High number of logic cells allows for complex programmable logic circuits to be implemented, providing versatility in design.

Surface Mount: YES

Allows for easy and efficient mounting onto PCBs, simplifying the assembly process.

Maximum Supply Voltage: 0.742 V

Efficient power consumption and operation at low voltage levels.

No. of CLBs: 20340

Large number of Configurable Logic Blocks allows for flexible and customizable logic functions.

No. of Inputs: 304

High number of inputs for versatile input/output configurations.

Package Shape: SQUARE

Square shape provides efficient use of space and easy integration into PCB layouts.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections and are suitable for high-density mounting.

Nominal Supply Voltage (V): 0.72

Stable nominal supply voltage for consistent performance.

No. of Terminals: 676

Sufficient number of terminals for various connection requirements.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA technology allows for reprogrammable and customizable functionality, making it ideal for prototyping and development.

Package Style (Meter): GRID ARRAY

Grid array package style provides efficient routing of connections and thermal management.

Minimum Supply Voltage: 0.698 V

Low minimum supply voltage for energy-efficient operation.

Maximum Operating Temperature: 110 °C

Wide operating temperature range for reliable performance in various environmental conditions.

Pitch Of Terminal: 1 mm

Optimal terminal pitch for easy soldering and connection.

Organization: 20340 CLBS

Organized structure of Configurable Logic Blocks for efficient logic design and implementation.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature for reliable performance in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Durable terminal finishing for reliable electrical connections and corrosion resistance.

Position Of Terminal: BOTTOM

Bottom-positioned terminals for convenient PCB mounting and integration.

Moisture Sensitivity Level (MSL): 4

MSL 4 level indicates strong moisture resistance for extended product lifespan.

Maximum Seated Height: 3.52 mm

Low seated height for compact and space-saving designs.

Width: 27 mm

Optimal width for versatile PCB layout and integration.

No. of Outputs: 304

High number of outputs for versatile output configurations.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time for efficient soldering and assembly process.

Peak Reflow Temperature °C: 250

High peak reflow temperature tolerance for reliable soldering and assembly.

Length: 27 mm

Optimal length for compact and space-saving designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU3P-L2FFVB676E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

355950

No. of Inputs:

304

No. of Outputs:

304

No. of CLBs:

20340

Organization:

20340 CLBS

Additional Features:

Also Operates at 0.85 V nominal supply

Power Characteristics

Nominal Supply Voltage:

0.72

Minimum Supply Voltage:

.698 V

Maximum Supply Voltage:

.742 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

110 °C (230 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3.52 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Trade Compliance

XCKU3P-L2FFVB676E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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