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10CL006YU256C6G

Intel

10CL006YU256C6G by Intel

The Intel 10CL006YU256C6G is a field programmable gate array (FPGA) with 392 configurable logic blocks (CLBs). It operates at a nominal voltage of 1.2V and has a max operating temperature of 85°C. This FPGA is commonly used in applications that require high-performance and flexible digital circuitry design.

Median Price

$16.630

Lifecycle Status

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7

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1k+

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Mouser Electronics

USA . 96 parts In-Stock

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$15.840

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$15.040

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$15.030

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DigiKey

USA . 67 parts In-Stock

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$17.420

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$15.697

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$15.037

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Digiode

USA . 114 parts In-Stock

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$15.048

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Nova Conductors

Japan . 550 parts In-Stock

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$15.750

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$15.750

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VNN

France . 18,408 parts In-Stock

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Vyrian

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Chip Stock

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Vigor

Singapore . 335 parts In-Stock

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$12.800

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Ampacity Inc.

Singapore . 95 parts In-Stock

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Semicontronic

India . 95 parts In-Stock

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$13.460

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$13.056

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Corphita

USA . 309 parts In-Stock

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$14.256

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AZTECH Wire

Italy . 591 parts In-Stock

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Continental Prestige Electronics

USA . 4,788 parts In-Stock

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Corohmni

South Africa . 285 parts In-Stock

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Texas Native Microelectronics

USA . 755 parts In-Stock

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Kenton Components

USA . 430 parts In-Stock

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$199.675

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$185.698

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$175.714

430

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Qasali Group International

UK . 75 parts In-Stock

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$449.269

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MARBEL Systems

Belgium . 3,282 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$14.962

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$14.648

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Argo Parts USA

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Lucentia Tech

USA . 150 parts In-Stock

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$0.875

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$0.875

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$0.875

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$0.875

Overview

Unlock endless possibilities with the 10CL006YU256C6G by Intel. Crafted with utmost precision and expertise, this Field Programmable Gate Array (FPGA) boasts exceptional quality and reliability. Whether you're a tech enthusiast or a professional developer, this versatile device offers unparalleled flexibility for all your programming needs. With its square package shape and low profile design, it seamlessly integrates into any project. Experience the power of innovation with Intel and revolutionize the way you create. Elevate your projects to new heights with the 10CL006YU256C6G.

Feature Benefit Bullets

Flexible Programming

The FPGA allows for field programmability, allowing customers to customize and modify the functionality of the device according to their specific needs. This gives them the flexibility to adapt the product to different applications without the need for hardware changes, saving time and resources.

Durable Package Material

The use of PLASTIC/EPOXY as the package body material ensures durability and resilience of the product, making it suitable for various environments and conditions. Customers can rely on the product's robustness, reducing the risk of damage and increasing its longevity.

Easy Integration

With surface mount capability, the product can be easily integrated into electronic circuits and systems, simplifying the installation process for customers. This saves time and effort in assembly, contributing to the overall convenience and efficiency of the product.

Low Power Consumption

The FPGA operates within a maximum supply voltage of 1.25V and a minimum supply voltage of 1.15V, resulting in low power consumption. This benefits customers by extending battery life in portable devices and reducing energy costs for larger systems, providing cost savings and enhancing the product's value proposition.

High Density Design

With 392 Configurable Logic Blocks (CLBs) organized within a 14mm x 14mm grid array package, this FPGA offers a high density design. This allows customers to achieve more complex functionalities and higher levels of integration within a smaller footprint, saving valuable space in their designs and increasing the overall capabilities of their systems.

Enhanced Connectivity

The product features 256 terminals with a pitch of 0.8mm, providing a fine pitch and a large number of connections. This enables customers to connect the FPGA to other components, peripherals, and interfaces, facilitating seamless data exchange and communication between different parts of their system. It enhances connectivity options and expands the possibilities for integrating the product into a wide range of applications.

Reliable Temperature Range

The FPGA can operate within a temperature range of 0°C to 85°C, ensuring reliability and stability in various operating environments. This allows customers to confidently use the product in both standard and demanding conditions, reducing the risk of malfunctions due to temperature variations and enhancing the overall performance and longevity of their systems.

Compact Package Design

With a maximum seated height of only 1.5mm, the low profile package style of this FPGA offers a compact design. This enables customers to use the product in space-constrained applications, where size reduction is crucial. It allows for more flexibility in system design and contributes to overall efficiency and portability.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CL006YU256C6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of CLBs:

392

Organization:

392 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.5 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

Trade Compliance

10CL006YU256C6G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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