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10CX220YF672E6G

Intel

10CX220YF672E6G by Intel

Intel's 10CX220YF672E6G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it has 236 inputs/outputs and uses TSMC technology. Ideal for applications requiring high-speed processing and complex logic functions in industries like telecommunications and aerospace.

Median Price

$672.804

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Verical

USA . 40 parts In-Stock

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Digiode

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Vyrian

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Chip Stock

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VNN

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Nova Conductors

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MARBEL Systems

Belgium . 120 parts In-Stock

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$79.167

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$76.000

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Texas Native Microelectronics

USA . 300 parts In-Stock

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$90.996

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Kenton Components

USA . 4,414 parts In-Stock

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Microchip USA

USA . 3,826 parts In-Stock

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$244.780

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Vigor

Singapore . 639 parts In-Stock

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Corphita

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Ampacity Inc.

Singapore . 40 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Qasali Group International

UK . 129 parts In-Stock

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Aranea Global

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Glotronic Ltd.

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Overview

Unlock endless possibilities with the Intel 10CX220YF672E6G FPGA! Crafted by the renowned manufacturer Intel, this innovative device boasts 220,000 logic cells and a cutting-edge TSMC technology for top-notch performance. Perfect for a wide range of applications, from industrial automation to telecommunications, this FPGA offers unmatched flexibility and efficiency. Say goodbye to limitations and hello to limitless creativity with the Intel 10CX220YF672E6G FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging offers cost-effective and reliable protection for the FPGA, ensuring durability and longevity.

No. of Logic Cells: 220000

Large number of logic cells provide high flexibility and capability for complex programmable logic designs.

Surface Mount: YES

Surface mount capability makes installation and soldering easier and more convenient.

Maximum Supply Voltage: 0.93 V

Efficient power consumption with a maximum supply voltage of 0.93 V.

No. of CLBs: 80330

High number of Configurable Logic Blocks (CLBs) allow for versatile logic implementation and customization.

Minimum Supply Voltage: 0.87 V

Low minimum supply voltage ensures energy efficiency and reduces power consumption.

Technology Used: TSMC

Utilizing TSMC technology ensures high performance and reliability in the FPGA's design and manufacturing.

No. of Inputs: 236

A generous number of input pins enables versatile connectivity and integration with external devices and circuits.

Package Shape: SQUARE

Square package shape provides efficient use of space and facilitates easy placement on circuit boards.

Form Of Terminal: BALL

Ball terminal form offers secure and reliable connections for improved signal transmission.

Nominal Supply Voltage (V): 0.9

Stable nominal supply voltage of 0.9 V ensures consistent and reliable performance of the FPGA.

No. of Terminals: 672

Ample number of terminals enable versatile connectivity options for interfacing with other components and devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array offers flexibility for reprogramming the logic structure as needed without the need for physical alterations.

Package Style (Meter): GRID ARRAY

Grid array packaging style facilitates efficient routing and placement of the FPGA on the circuit board for optimized performance.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance of 100°C ensures stable and reliable performance in various environments and conditions.

Organization: 80330 CLBS

The organization of 80330 Configurable Logic Blocks (CLBs) within the FPGA allows for complex logic operations and configurations.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature tolerance of 0°C ensures functionality in a wide range of temperatures and environments.

Position Of Terminal: BOTTOM

Bottom terminal positioning allows for easier and more convenient integration of the FPGA into circuit board layouts.

No. of Outputs: 236

Generous number of output pins enables efficient signal transmission and connectivity with other components and devices.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX220YF672E6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

220000

No. of Inputs:

236

No. of Outputs:

236

No. of CLBs:

80330

Technology:

TSMC

Organization:

80330 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

Trade Compliance

10CX220YF672E6G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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