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10CL016YF484C6G

Intel

10CL016YF484C6G by Intel

Intel's 10CL016YF484C6G is a Field Programmable Gate Array with 963 CLBs. Operating voltage range of 1.15V to 1.25V, suitable for applications requiring high flexibility and customization in electronics design. Features square package shape, grid array style, and surface mount compatibility for versatile integration in various electronic systems.

Median Price

$47.730

Lifecycle Status

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Mouser Electronics

USA . 274 parts In-Stock

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$44.170

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$42.980

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DigiKey

USA . 20 parts In-Stock

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Digiode

USA . 497 parts In-Stock

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$41.220

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Nova Conductors

Japan . 76 parts In-Stock

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AZTECH Wire

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Vigor

Singapore . 179 parts In-Stock

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Ampacity Inc.

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Semicontronic

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Corphita

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Continental Prestige Electronics

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Microchip USA

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Texas Native Microelectronics

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Qasali Group International

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Argo Parts USA

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Kenton Components

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MARBEL Systems

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Netroflash

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Overview

Unleash the power of innovation with the 10CL016YF484C6G by Intel. As a leading manufacturer in the field programmable gate array category, Intel delivers unmatched quality and reliability. Whether you're designing cutting-edge electronics or optimizing industrial processes, this FPGA offers flexibility and performance like never before. With Intel's 10CL016YF484C6G, you can bring your ideas to life with ease, making it the perfect choice for any project that demands speed, efficiency, and precision. Elevate your work and exceed expectations with Intel's innovative FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers good durability and protection for the FPGA, ensuring reliable performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.25 V

High maximum supply voltage allows for flexibility in power requirements and compatibility with a variety of systems.

No. of CLBs: 963

Large number of Configurable Logic Blocks (CLBs) provide ample resources for complex logic designs and algorithms.

Package Shape: SQUARE

Square package shape offers efficient use of space on a circuit board, optimizing layout and placement.

Form Of Terminal: BALL

Ball terminals are easy to solder and offer reliable electrical connections, ensuring stable performance.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage helps maintain consistent performance and reliability of the FPGA.

No. of Terminals: 484

Large number of terminals allow for versatile connectivity options and facilitate interfacing with external components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Field Programmable Gate Array (FPGA) technology offers flexibility and reconfigurability, making it ideal for prototyping and customization.

Package Style (Meter): GRID ARRAY

Grid array package style offers secure and precise mounting onto circuit boards, enhancing reliability and durability.

Minimum Supply Voltage: 1.15 V

Low minimum supply voltage helps optimize power efficiency and reduces power consumption of the FPGA.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance even in demanding environments or industrial applications.

Pitch Of Terminal: 1 mm

1 mm pitch of terminals allows for compact and efficient layout on the circuit board, saving space and facilitating assembly.

Organization: 963 CLBS

Well-organized 963 Configurable Logic Blocks (CLBs) offer scalability and flexibility for implementing complex logic functions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in cold climates or extreme conditions.

Position Of Terminal: BOTTOM

Bottom position of terminals facilitates easy routing of traces on the circuit board and simplifies design considerations.

Maximum Seated Height: 2.4 mm

Low maximum seated height allows for slim and compact designs, making the FPGA suitable for space-constrained applications.

Width: 23 mm

Compact width of 23 mm enables space-efficient placement on the circuit board, optimizing use of available board area.

Length: 23 mm

Square package with a length of 23 mm offers a balanced footprint for easy integration and efficient board layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CL016YF484C6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of CLBs:

963

Organization:

963 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.4 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

10CL016YF484C6G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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