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10CL016YU256C8G

Intel

10CL016YU256C8G by Intel

Intel's 10CL016YU256C8G FPGA features 963 CLBs, operates at 1.15-1.25V, and has a package style of GRID ARRAY. Ideal for applications requiring low profile, fine pitch components in a square shape with bottom terminal position.

Median Price

$19.730

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 357 parts In-Stock

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$18.440

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$17.490

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$17.490

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$17.490

357

$18.440

$17.490

$17.490

$17.490

Mouser Electronics

USA . 98 parts In-Stock

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$19.730

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$18.740

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$18.280

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98

$19.730

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$18.280

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DigiKey

USA . 2 parts In-Stock

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$21.700

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$19.525

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$18.738

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2

$21.700

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Verical

USA . 69 parts In-Stock

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Digiode

USA . 330 parts In-Stock

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$17.518

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330

$17.518

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Nova Conductors

Japan . 30 parts In-Stock

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$19.614

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Vyrian

USA . 4,137 parts In-Stock

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VNN

France . 483 parts In-Stock

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ComSIT Distribution GmbH

Germany . 40 parts In-Stock

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Ampacity Inc.

Singapore . 294 parts In-Stock

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$15.670

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Semicontronic

India . 225 parts In-Stock

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$15.670

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$15.278

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$15.200

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Vigor

Singapore . 645 parts In-Stock

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$15.930

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Corphita

USA . 213 parts In-Stock

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$16.596

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Aranea Global

USA . 2,000 parts In-Stock

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$19.222

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$18.453

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$19.222

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Corohmni

South Africa . 118 parts In-Stock

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$19.614

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Continental Prestige Electronics

USA . 342 parts In-Stock

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$19.614

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$19.222

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$54.789

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$49.858

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$44.927

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100

$54.789

$49.858

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Texas Native Microelectronics

USA . 560 parts In-Stock

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$156.564

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$137.776

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Kenton Components

USA . 120 parts In-Stock

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$187.877

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$180.362

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$174.725

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$165.332

120

$187.877

$180.362

$174.725

$165.332

Qasali Group International

UK . 1,962 parts In-Stock

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$422.723

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$393.132

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A-Z Elektronik GmbH

Germany . 6,837 parts In-Stock

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Argo Parts USA

USA . 935 parts In-Stock

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MARBEL Systems

Belgium . 438 parts In-Stock

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Overview

Unleash the power of innovation with Intel's 10CL016YU256C8G Field Programmable Gate Array. Designed with precision and quality, this FPGA offers endless possibilities for customization in a compact square package. Whether you're delving into AI, IoT, or data acceleration, this versatile component provides the flexibility and performance you need to stay ahead in today's fast-paced technology landscape. Elevate your projects with Intel's cutting-edge solutions and unlock the true potential of your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package durable and resistant to impact, making the product reliable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation of the FPGA in circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.25 V

With a maximum supply voltage of 1.25V, this FPGA is efficient and consumes less power, making it suitable for energy-efficient designs.

No. of CLBs: 963

Having 963 Configurable Logic Blocks (CLBs) provides ample resources for implementing complex logic functions and algorithms in the FPGA.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it easier to integrate the FPGA into compact designs.

Form Of Terminal: BALL

Ball terminals enable secure connections and good electrical performance, ensuring reliable signal transmission in the FPGA.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures stable operation of the FPGA, reducing the risk of voltage fluctuations affecting performance.

No. of Terminals: 256

Having 256 terminals provides flexibility in connecting the FPGA to other components in the system, allowing for versatile signal routing options.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for reconfigurability and flexibility in designing and implementing custom logic functions on the device.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high-density integration, efficient signal routing, and space-saving benefits for compact designs.

Minimum Supply Voltage: 1.15 V

The minimum supply voltage of 1.15V ensures the FPGA can operate within a range of voltage levels, providing versatility in different power supply configurations.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85°C enables the FPGA to function reliably under varying environmental conditions, increasing its robustness.

Pitch Of Terminal: 0.8 mm

The small pitch of 0.8mm between terminals allows for high-density packaging, enabling more terminals to be accommodated in a compact space.

Organization: 963 CLBS

Having 963 Configurable Logic Blocks (CLBs) organizes the resources efficiently for implementing complex logic functions and algorithms in the FPGA.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures the FPGA can function in cold environments without performance degradation or failure.

Position Of Terminal: BOTTOM

The terminal located at the bottom of the package simplifies the layout and routing of signals on the circuit board, improving the overall design efficiency.

Maximum Seated Height: 1.5 mm

With a maximum seated height of 1.5mm, the FPGA can be mounted close to the PCB surface, reducing the overall profile of the system and optimizing space usage.

Width: 14 mm

The width of 14mm provides a compact form factor for the FPGA, allowing for easy integration into tight spaces or densely populated PCB layouts.

Length: 14 mm

The length of 14mm complements the square shape of the package, ensuring a balanced and space-efficient footprint for the FPGA on the circuit board.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CL016YU256C8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of CLBs:

963

Organization:

963 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.5 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

Trade Compliance

10CL016YU256C8G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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