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10CL010YU256C6G

Intel

10CL010YU256C6G by Intel

Intel's 10CL010YU256C6G FPGA features 645 CLBs, operates at 1.2V, and has a max supply voltage of 1.25V. Ideal for applications requiring high-performance computing in a compact form factor with a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.

Median Price

$22.250

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Mouser Electronics

USA . 185 parts In-Stock

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$21.190

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DigiKey

USA . 22 parts In-Stock

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$23.310

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$20.977

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$20.125

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Digiode

USA . 129 parts In-Stock

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$18.820

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Nova Conductors

Japan . 550 parts In-Stock

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Vyrian

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VNN

France . 2,470 parts In-Stock

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Chip Stock

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Vigor

Singapore . 174 parts In-Stock

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$17.120

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AZTECH Wire

Italy . 576 parts In-Stock

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Corphita

USA . 433 parts In-Stock

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Ampacity Inc.

Singapore . 111 parts In-Stock

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Semicontronic

India . 111 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Continental Prestige Electronics

USA . 5,225 parts In-Stock

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Microchip USA

USA . 1,636 parts In-Stock

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$22.290

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$20.290

MARBEL Systems

Belgium . 45 parts In-Stock

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Texas Native Microelectronics

USA . 6,541 parts In-Stock

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Kenton Components

USA . 879 parts In-Stock

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Corohmni

South Africa . 346 parts In-Stock

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Qasali Group International

UK . 4,425 parts In-Stock

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Argo Parts USA

USA . 3,060 parts In-Stock

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Overview

Unlock endless possibilities with the 10CL010YU256C6G by Intel, a cutting-edge Field Programmable Gate Array that boasts unmatched quality and reliability. Manufactured by industry leader Intel, this FPGA offers unparalleled performance and versatility for a wide range of applications. From robotics to aerospace, this innovative product delivers exceptional value, benefits, and advantages to customers looking to optimize their projects. Experience the future of technology with Intel's 10CL010YU256C6G FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and affordable, making it a cost-effective choice for the package body.

Surface Mount: YES

Surface mount compatibility allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage: 1.25 V

High maximum supply voltage allows for stable and efficient operation of the FPGA.

No. of CLBs: 645

Having 645 Configurable Logic Blocks (CLBs) provides flexibility and scalability in designing and implementing logic functions.

Package Shape: SQUARE

Square package shape helps in better utilization of space and allows for efficient placement on circuit boards.

Form Of Terminal: BALL

Ball terminals ensure reliable connections and enable easy soldering during assembly.

Nominal Supply Voltage (V): 1.2

Nominal supply voltage of 1.2V is standard for many electronic components, making it compatible with a wide range of systems.

No. of Terminals: 256

Having 256 terminals provides ample connectivity options for interfacing with other components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) means it can be easily reconfigured and adapted for different applications, offering versatility in use.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch enhances electrical performance and thermal characteristics of the FPGA.

Minimum Supply Voltage: 1.15 V

Low minimum supply voltage helps in reducing power consumption and enhancing energy efficiency of the device.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures stability and reliability of the FPGA in varying environmental conditions.

Pitch Of Terminal: 0.8 mm

Terminal pitch of 0.8mm enables close packing of terminals for compact design and efficient use of board space.

Organization: 645 CLBS

Having 645 Configurable Logic Blocks (CLBs) allows for complex logic functions to be implemented efficiently in the FPGA.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the FPGA can function reliably even in cold environments.

Position Of Terminal: BOTTOM

Bottom positioning of terminals helps in simplifying the PCB layout and enables easier soldering during assembly.

Maximum Seated Height: 1.5 mm

Low maximum seated height contributes to a slim and compact profile of the FPGA, suitable for space-constrained applications.

Width: 14 mm

With a width of 14mm, the FPGA can fit into various electronic systems and devices without occupying too much space.

Length: 14 mm

Having a length of 14mm makes the FPGA compact and suitable for incorporation into small form factor devices.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CL010YU256C6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of CLBs:

645

Organization:

645 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.5 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

Trade Compliance

10CL010YU256C6G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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