Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MKL17Z256CAL4R
NXP Semiconductors
NXP Semiconductors' MKL17Z256CAL4R microcontroller features a Cortex-M0+ CPU, 48 MHz clock frequency, and 32768 bytes of RAM. Ideal for applications requiring low power consumption, it supports various peripherals like DMA(4), TIMER(9), and WDT, with connectivity options including I2C, SPI, and UART(2).
YES
0
NO
Cortex-M0+
48 MHz
FLOATING POINT
2.8 mm
1
26
2
36
9
8
105 Cel
-40 Cel
PLASTIC/EPOXY
BGA
RECTANGULAR
GRID ARRAY
260
32768
262144
FLASH
48 rpm
3.6 V
1.71 V
3 V
CMOS
BALL
.4 mm
BOTTOM
40
2.7 mm
MICROCONTROLLER, RISC
I2C, SPI, UART(2)
DMA(4), TIMER(9), WDT
MKV30F128VLF10P
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Address Bus Width: 0;
32
32 MHz
7 mm
3
35
48
LFQFP
SQUARE
FLATPACK, LOW PROFILE, FINE PITCH
100 rpm
3.3 V
GULL WING
.5 mm
QUAD
MKV31F128VLH10P
NXP Semiconductors' MKV31F128VLH10P is a 32-bit microcontroller with 122880 ROM words, 24576 RAM bytes, and 2 ADC channels. Ideal for industrial applications, it features a max clock frequency of 50 MHz, peripherals like comparators and timers, and connectivity options such as I2C and SPI interfaces.
50 MHz
S-PQFP-G64
10 mm
46
64
QFP
FLATPACK
24576
122880
INDUSTRIAL
I2C(2), SPI(2), UART(4)
COMPARATOR(2), DMA(4), POR, PWM(12), TIMER(12), WDT
2-Ch 16-Bit
1-Ch 12-Bit
MKV31F256VLH12P
NXP Semiconductors' MKV31F256VLH12P is a 32-bit microcontroller with 64 terminals, operating at a max clock frequency of 50 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed data processing and control functions. With a low profile flatpack package style, it is ideal for compact electronic devices needing efficient performance.
120 rpm
MKV31F512VLL12P
NXP Semiconductors' MKV31F512VLL12P is a 32-bit microcontroller with 100 terminals, operating at a max clock frequency of 50 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed data processing and control tasks. The device has a low profile flatpack package style, making it ideal for compact electronic designs.
14 mm
70
100
SPC5674FAMVY3R
MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: HBGA; Package Shape: SQUARE;
MS-034AAL-1
S-PBGA-B516
e2
27 mm
516
125 Cel
HBGA
GRID ARRAY, HEAT SINK/SLUG
2.55 mm
270 rpm
5.5 V
4.5 V
5 V
AUTOMOTIVE
TIN SILVER
1 mm
SC68376BACAB20
NXP SC68376BACAB20 is a 32-bit microcontroller with 160 terminals in a square package. It features ADC channels, MROM ROM programmability, and CMOS technology. Ideal for applications requiring a flatpack style microcontroller with gull wing terminal form and 0.65 mm pitch.
S-PQFP-G160
e3
28 mm
160
245
MROM
3.85 mm
TIN
.65 mm
30
MICROCONTROLLER
SPC5743RK1MLQ5
NXP Semiconductors' SPC5743RK1MLQ5 microcontroller features 32-bit architecture, 40 MHz clock frequency, and ADC/DMA channels. Ideal for automotive applications due to its low profile flatpack package style and quad terminal position.
40 MHz
20 mm
144
LQFP
FLATPACK, LOW PROFILE
200 rpm
1.32 V
1.2 V
1.25 V
SPC5745RK1MLU3
Microcontrollers; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LQFP; Package Shape: SQUARE; Bit Size: 32;
24 mm
176
150 rpm
SPC5746RK1MMT5
Microcontrollers; Terminal Form: BALL; No. of Terminals: 252; Package Code: LFBGA; Package Shape: SQUARE; Maximum Clock Frequency: 40 MHz;
17 mm
252
LFBGA
GRID ARRAY, LOW PROFILE, FINE PITCH
.8 mm
SPC5777CCK3MME3R
NXP Semiconductors' SPC5777CCK3MME3R microcontroller features 32-bit architecture, 8388608 ROM words, and 524288 RAM bytes. Ideal for automotive applications with CAN(6), DSPI(5), EBI, ETHERNET connectivity, and peripherals like DMA(128) and PWM channels. Operating temperature ranges from -40 to 125 °C with a max clock frequency of 40 MHz.
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.
S-PBGA-B416
416
524288
8388608
2.02 mm
264 rpm
CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)
DMA(128), PWM, TEMPERATURE SENSOR
SPC5777CCK3MME3
NXP Semiconductors' SPC5777CCK3MME3 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 524288 RAM bytes. Ideal for automotive applications with CAN, SCI, SPI connectivity and low power mode support. This CMOS technology-based chip offers high performance in a compact square package.
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.
E200Z7
FLOATING-POINT
128
5
BGA416,26X26,40
1350 mA
CAN(4), SCI(5), SPI(5)
POR
SPC5777CCK3MMO3R
NXP Semiconductors' SPC5777CCK3MMO3R is a 32-bit microcontroller with 8388608 ROM words and 524288 RAM bytes. It features CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) connectivity and peripherals like DMA(128) and PWM. Ideal for automotive applications due to its temperature grade, it operates at a max clock frequency of 40 MHz.
SPC5777CCK3MMO3
NXP Semiconductors' SPC5777CCK3MMO3 microcontroller features a 32-bit CPU with E200Z7 family, 8KB cache, and 524KB RAM. Ideal for automotive applications, it offers CAN(4), SCI(5), SPI(5) connectivity and operates at up to 40MHz clock frequency. With low power mode and FLASH ROM programmability, this CMOS technology-based chip is suitable for various automotive control systems.
BGA516,26X26,40
SPC5777CK3MME3R
The NXP Semiconductors SPC5777CK3MME3R is a 32-bit microcontroller with a max clock frequency of 40 MHz. It features 416 terminals, CAN and DSPI connectivity, and on-chip program ROM width of 8. This automotive-grade microcontroller is suitable for applications requiring high-speed processing and advanced connectivity capabilities.
SPC5777CK3MME3
NXP Semiconductors' SPC5777CK3MME3 microcontroller features a 32-bit CPU with E200Z7 family, 524288 RAM bytes, and 8388608 ROM words. It is designed for automotive applications with CAN(4), SCI(5), SPI(5) connectivity, PWM channels, and low power mode support. The microcontroller operates at a max clock frequency of 40 MHz and has a temperature grade suitable for automotive environments.
SPC5777CK3MMO3R
The NXP Semiconductors SPC5777CK3MMO3R microcontroller features a 32-bit architecture, with 8388608 ROM words and 524288 RAM bytes. It offers connectivity options like CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) and peripherals including DMA(128), PWM, and a temperature sensor. Ideal for automotive applications due to its temperature grade of AUTOMOTIVE and max operating temperature of 125°C.
SPC5777CK3MMO3
NXP Semiconductors' SPC5777CK3MMO3 microcontroller features a 32-bit CPU with E200Z7 family, 8KB integrated cache, and 524KB RAM. Ideal for automotive applications, it offers connectivity via CAN(4), SCI(5), SPI(5) interfaces and operates at a max clock frequency of 40MHz.
MC908KX2MDWER
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
ALSO OPERATES AT 3V SUPPLY AT 4MHZ
R-PDSO-G16
10.3 mm
13
16
SOP
SMALL OUTLINE
2.65 mm
8 rpm
1.27 mm
DUAL
7.5 mm
SPC5777MK0MVA8R
MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 512; Package Code: FBGA; Package Shape: SQUARE;
INCLUDES GTM104, ETHERNET SUPPORT, 74KB(ADDITIONAL RAM)
S-PBGA-B512
25 mm
512
FBGA
GRID ARRAY, FINE PITCH
413696
ISO 26262
2.36 mm
300 rpm
1.38 V
1.19 V
1.325 V
544K
CAN(5), DSPI(8), I2C(2), PSI5(5), SENT(15), UART(3)
DMA(128), TIMER(8), WDT(4)
12-Ch 12-Bit, 10-Ch 16-Bit
SPC5777MK0MVA8
SPC5777MK0MVU8R
NXP Semiconductors' SPC5777MK0MVU8R microcontroller features 32-bit address bus, 544K data EEPROM size, and 40 MHz max clock frequency. Ideal for automotive applications with ISO 26262 screening level, it offers connectivity options like CAN(5), DSPI(8), I2C(2), PSI5(5), SENT(15), UART(3).
e1
TIN SILVER COPPER
SPC5777MK0MVU8
NXP Semiconductors' SPC5777MK0MVU8 microcontroller features 32-bit address bus, 544K data EEPROM size, and 40 MHz max clock frequency. Ideal for automotive applications with ISO 26262 screening level, it offers connectivity options like CAN(5), DSPI(8), I2C(2), PSI5(5), SENT(15), UART(3).
SPC5634MF1MLU80
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G176;
80 MHz
S-PQFP-G176
73
1.6 mm
80 rpm
1.14 V
S9S08DV60F2MLH
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
16 MHz
54
40 rpm
2.7 V
MKS22FN128VLH12
MICROCONTROLLER, RISC; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MKS22FN256VLH12
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
LPC824M201JHI33E
NXP Semiconductors' LPC824M201JHI33E is a 32-bit microcontroller with 12-Ch 12-Bit ADC channels, 8192 bytes of RAM, and max clock frequency of 25 MHz. Ideal for industrial applications, it offers connectivity through I2C(4), SPI(2), USART(3) interfaces and features peripherals like BOD, CRC, DMA(18), PMU.
SEATED HGT-NOM
25 MHz
S-PQCC-N33
5 mm
29
33
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
8192
.85 mm
30 rpm
1.8 V
NO LEAD
I2C(4), SPI(2), USART(3)
BOD, COMPARATOR, CRC, DMA(18), MRT(4), PMU, POR, PWM, WDT
12-Ch 12-Bit
MK22FN512VFX12
NXP Semiconductors' MK22FN512VFX12 is a CMOS microcontroller with RISC architecture. It has a peak reflow temperature of 260°C and can withstand up to 40 seconds at this temperature. Ideal for applications requiring high processing power in compact designs, such as IoT devices and industrial automation systems.
MKE14F256VLH16
MICROCONTROLLER, RISC; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
MKE14Z128VLL7
NXP Semiconductors MKE14Z128VLL7 is a 32-bit microcontroller with Cortex-M0 CPU, 131072 ROM words, and 16384 RAM bytes. It features 28-Ch 12-Bit ADC channels, 8 DMA channels, and PWM support. Ideal for industrial applications requiring low power consumption and high-speed processing up to 40 MHz.
FLEXRAM WITH 2KB FOR EEPROM EMULATION
CORTEX-M0
FIXED POINT
S-PQFP-G100
89
QFP100,.63SQ,20
16384
131072
1.7 mm
72 rpm
60 mA
I2C(2), SPI(2), UART(3)
COMPARATOR(2), DMA(8), POR, RTC, TIMER(21), WDT
28-Ch 12-Bit
MKE14Z256VLL7
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
MKE15Z256VLL7
NXP Semiconductors' MKE15Z256VLL7 microcontroller features a 32-bit CPU with Cortex-M0 family, 262144 ROM words, and 32768 RAM bytes. It is suitable for industrial applications requiring low power mode, with connectivity options like I2C(2), SPI(2), UART(3) and peripherals including DMA(8) and RTC. Operating temperature ranges from -40 to 105 °C.
MC56F82746MLF
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
S-PQFP-G48
39
65536
AEC-Q100
CAN, I2C, SCI(2), SMBUS, SPI
BOR, COMPARATOR(4), DMA, POR, PWM(12), TIMER(6), WDT
10-Ch 12-Bit
2-Ch 12-Bit
SPC5634MF1MLQ80
NXP Semiconductors' SPC5634MF1MLQ80 is a 32-bit microcontroller with 144 terminals, 96256 bytes of RAM, and 1572864 ROM words. It features 32 ADC channels, DMA channels, and PWM channels for applications like automotive control systems due to its CAN, LIN, SCI, SPI, and UART connectivity options. Operating at a max clock frequency of 80 MHz with on-chip program ROM width of 8 bits makes it suitable for high-speed processing tasks.
S-PQFP-G144
96256
1572864
CAN(2), LIN, SCI(2), SPI(2), UART
DMA(32), POR, PWM, TEMPERATURE SENSOR, TIMER(24), TPU(32), WDT
32-Ch 12-Bit
SPC5674FAMVR3R
MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: HBGA; Package Shape: SQUARE;
4194304
CAN(4), SCI(3), SPI(4)
DMA(96), POR, PWM(32), TIMER(64)
64-Ch 12-Bit
SPC5674FAMVR3
MKV10Z64VFM7P
MICROCONTROLLER, RISC; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Nominal Supply Voltage: 3.3 V;
28
75 rpm
MKV10Z64VLF7P
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
IT HAS TWO 16 BIT ADC AND ONE 12 BIT DAC
MKV10Z64VLH7P
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE; Maximum Clock Frequency: 50 MHz;
MKV11Z128VFM7P
The NXP Semiconductors MKV11Z128VFM7P microcontroller operates at a max clock frequency of 50 MHz with 28 I/O lines. It features ADC and DMA channels, suitable for applications requiring a peak reflow temperature of 260°C. With a square package shape and terminal pitch of 0.5 mm, it is ideal for compact electronic designs.
MKV11Z128VLF7P
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE; Terminal Pitch: .5 mm;
MKV11Z128VLH7P
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE; Width: 10 mm;
SPC5777CAK3MMO3R
The NXP Semiconductors SPC5777CAK3MMO3R microcontroller features a 32-bit architecture, 22-bit address bus width, and 16-bit external data bus width. Ideal for automotive applications with ISO 26262 screening level, it offers CAN, Ethernet, and multiple serial communication interfaces for connectivity. With a max clock frequency of 40 MHz and on-chip Flash ROM programmability, this microcontroller is suitable for high-performance automotive systems.
ALSO OPERATES @ 1.2V TO 1.38V, 70-CH ADC INPUT LINES AVAILABLE
22
CAN(6), ETHERNET, LFAST, PSI5(2), SCI(5), SENT(12), SIPI, SPI(5)
DMA(128), POR
4-Ch 16-Bit
SPC5777CAK3MMO3
NXP Semiconductors' SPC5777CAK3MMO3 microcontroller features 32-bit architecture, 22-bit address bus width, and 16-bit external data bus. Ideal for automotive applications with ISO 26262 screening level, it offers CAN, Ethernet, and SPI connectivity along with 4-Ch 16-Bit ADCs and PWM channels.
LPC11U68JBD100E
NXP Semiconductors' LPC11U68JBD100E microcontroller features a 32-bit CPU, 262144 ROM words, and 12-Ch 12-Bit ADC channels. Ideal for industrial applications, it offers connectivity via I2C, SSP, USART, and USB interfaces. With a max clock frequency of 25 MHz and operating temperature range from -40 to 105 °C, this microcontroller is suitable for various embedded systems requiring high-speed processing and reliable performance.
80
36864
50 rpm
2.4 V
4096
I2C(2), SSP(2), USART(5), USB
BOD, CRC, DMA(16), POR, PWM(6), RTC, TIMER(7), WDT
FS32R274KCK2MMM
MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e2; Peak Reflow Temperature (C): 260;
FS32R274KCK2VMM
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2;
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