Loading...

SPC5743RK1MLQ5

NXP Semiconductors

SPC5743RK1MLQ5 by NXP Semiconductors

NXP Semiconductors' SPC5743RK1MLQ5 microcontroller features 32-bit architecture, 40 MHz clock frequency, and ADC/DMA channels. Ideal for automotive applications due to its low profile flatpack package style and quad terminal position.

Median Price

$24.268

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$25.886

10k+ parts

-

9,900

-

-

$25.886

-

Rochester

USA . 813 parts In-Stock

1+ parts

-

100+ parts

$22.650

1k+ parts

$20.260

10k+ parts

$19.070

813

-

$22.650

$20.260

$19.070

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,295 parts In-Stock

1+ parts

$23.912

100+ parts

-

1k+ parts

-

10k+ parts

-

4,295

$23.912

-

-

-

Vyrian

USA . 2,369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,369

-

-

-

-

Anansix

USA . 1,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,517

-

-

-

-

TME

Poland . 237 parts In-Stock

1+ parts

-

100+ parts

$34.860

1k+ parts

-

10k+ parts

-

237

-

$34.860

-

-

Nova Conductors

Japan . 36 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

36

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 754 parts In-Stock

1+ parts

$14.650

100+ parts

-

1k+ parts

-

10k+ parts

-

754

$14.650

-

-

-

Modulus Dynamics

Lithuania . 2,596 parts In-Stock

1+ parts

$16.563

100+ parts

$16.563

1k+ parts

$16.563

10k+ parts

-

2,596

$16.563

$16.563

$16.563

-

Ampacity Inc.

Singapore . 433 parts In-Stock

1+ parts

$21.390

100+ parts

-

1k+ parts

-

10k+ parts

-

433

$21.390

-

-

-

Corphita

USA . 2,259 parts In-Stock

1+ parts

$22.653

100+ parts

-

1k+ parts

-

10k+ parts

-

2,259

$22.653

-

-

-

Vigor

Singapore . 2,480 parts In-Stock

1+ parts

$42.080

100+ parts

-

1k+ parts

-

10k+ parts

-

2,480

$42.080

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$49.034

100+ parts

$44.621

1k+ parts

$40.208

10k+ parts

-

2,500

$49.034

$44.621

$40.208

-

Microchip USA

USA . 1,190 parts In-Stock

1+ parts

$64.590

100+ parts

$63.460

1k+ parts

$62.900

10k+ parts

$62.340

1,190

$64.590

$63.460

$62.900

$62.340

Corohmni

South Africa . 35 parts In-Stock

1+ parts

$70.273

100+ parts

-

1k+ parts

-

10k+ parts

-

35

$70.273

-

-

-

Lixinc

USA . 15,602 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,602

-

-

-

-

Argo Parts USA

USA . 8,535 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,535

-

-

-

-

UNI Independent Distributors

Spain . 5,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,220

-

-

-

-

Continental Prestige Electronics

USA . 3,473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,473

-

-

-

-

Perfect Parts

USA . 1,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,680

-

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Discover the cutting-edge SPC5743RK1MLQ5 microcontroller by NXP Semiconductors, a leading manufacturer known for its top-quality products. Designed for a wide range of applications, this advanced device offers customers unparalleled value and benefits. With features like ADC and DMA channels, high clock frequency, and low power consumption, this microcontroller provides superior performance and efficiency. Trust NXP Semiconductors to deliver innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact integration on PCBs, saving space and reducing assembly costs.

Maximum Supply Voltage: 1.32 V

Wide range of supply voltage allows for flexibility in power supply options.

Package Shape: SQUARE

Square package shape ensures uniformity and ease of handling during assembly.

Bit Size: 32

32-bit architecture allows for high processing power and capability.

No. of Terminals: 144

Large number of terminals provide ample connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile package style helps in space-constrained applications and improves heat dissipation.

Minimum Supply Voltage: 1.2 V

Low minimum supply voltage helps in reducing power consumption and heat dissipation.

Terminal Finish: TIN

Tin terminal finish ensures good conductivity and helps in preventing oxidation for better reliability.

ADC Channels: YES

Presence of ADC channels allows for analog signal processing and interfacing with sensors and other analog devices.

DMA Channels: YES

DMA channels enable efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: QUAD

Quad terminal position provides stable and secure mounting on the PCB, reducing chances of mechanical failure.

Width: 20 mm

Compact width allows for space-efficient placement on the PCB.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast and efficient processing of instructions, suitable for performance-critical applications.

Maximum Time At Peak Reflow Temperature (s): 40

Long peak reflow temperature time allows for proper soldering and ensures good mechanical strength.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints and prevents solder defects.

Length: 20 mm

Compact length complements the width for efficient space utilization on the PCB.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of handling during assembly.

Nominal Supply Voltage: 1.25 V

Stable nominal supply voltage ensures consistent performance and reliability of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high density integration on the PCB, enabling complex designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has a moderate level of moisture sensitivity, suitable for standard assembly processes.

Speed: 200 rpm

High speed capability enables fast data processing and efficient operation of the microcontroller.

Technical Specifications

Microcontrollers SPC5743RK1MLQ5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

PWM Channels:

NO

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Speed:

200 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Trade Compliance

SPC5743RK1MLQ5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20