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SPC5517EBMLQ66

NXP Semiconductors

SPC5517EBMLQ66 by NXP Semiconductors

NXP Semiconductors' SPC5517EBMLQ66 microcontroller features 32-bit address bus, 8 DMA channels, and 40 MHz clock frequency. Ideal for automotive applications with CAN, I2C, SCI, SPI connectivity and low power mode support. This CMOS device offers 81920 bytes of RAM and operates b/w -40 to 125°C temperature range.

Median Price

$34.240

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Mouser Electronics

USA . 119 parts In-Stock

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$44.700

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$40.730

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Verical

USA . 600 parts In-Stock

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$33.490

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Avnet

USA . 120 parts In-Stock

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Rochester

USA . 3 parts In-Stock

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$34.240

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$30.630

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$28.830

3

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$34.240

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$28.830

Distributors (In-Stock)

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Digiode

USA . 2,295 parts In-Stock

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$33.678

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$33.678

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Nova Conductors

Japan . 43 parts In-Stock

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$41.520

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Vyrian

USA . 8,635 parts In-Stock

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Chip Stock

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Anansix

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Distributors (Availability)

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AZTECH Wire

Italy . 323 parts In-Stock

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$16.412

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$16.412

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One Stop Electronics

USA . 81 parts In-Stock

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$30.070

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Ampacity Inc.

Singapore . 81 parts In-Stock

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$30.070

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Semicontronic

India . 40 parts In-Stock

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$30.070

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$29.318

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$29.168

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$30.070

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$29.168

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Corphita

USA . 1,703 parts In-Stock

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$31.905

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$31.905

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$40.928

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$37.244

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$33.561

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$40.928

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$33.561

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Continental Prestige Electronics

USA . 6,538 parts In-Stock

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$41.520

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$40.690

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Netroflash

USA . 100 parts In-Stock

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$41.520

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$40.690

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Aztec Data Supply Inc.

USA . 89 parts In-Stock

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$56.293

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Corohmni

South Africa . 405 parts In-Stock

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$72.052

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Modulus Dynamics

Lithuania . 3,215 parts In-Stock

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$77.134

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Vigor

Singapore . 3,106 parts In-Stock

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S.R.D Solutions

India . 72,000 parts In-Stock

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UNI Independent Distributors

Spain . 7,774 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Microchip USA

USA . 2,681 parts In-Stock

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Lixinc

USA . 2,076 parts In-Stock

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Robosynatics

Brazil . 1,318 parts In-Stock

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Lucentia Tech

USA . 1,318 parts In-Stock

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Argo Parts USA

USA . 709 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of innovation with the SPC5517EBMLQ66 by NXP Semiconductors, a cutting-edge microcontroller designed to elevate your projects to new heights. With a strong reputation for quality and reliability, NXP Semiconductors delivers unparalleled performance in automotive applications. This versatile microcontroller boasts a wide range of features and peripherals, including ADC channels, DMA support, and multiple connectivity options. Say goodbye to limitations and hello to endless possibilities with the SPC5517EBMLQ66 - where value meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to damage, ensuring the longevity of the microcontroller.

Maximum Supply Voltage: 5.25 V

Supports a higher supply voltage, providing flexibility in power requirements for various applications.

Address Bus Width: 32

Wide address bus width allows for efficient memory addressing and data processing capabilities.

ADC Channels: YES

Built-in Analog to Digital Converters enable the microcontroller to interface with analog sensors and convert analog signals to digital data.

ROM Words: 196608

Large ROM capacity allows for storing a significant amount of program code and data, enabling complex applications to be run efficiently.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency provides fast processing speed, suitable for applications that require real-time data processing.

Connectivity: CAN(6), I2C, SCI(8), SPI(4)

Multiple connectivity options such as CAN, I2C, SCI, and SPI interfaces allow for communication with a variety of external devices and systems.

Low Power Mode: YES

Support for low power mode enhances energy efficiency and prolongs battery life in portable or battery-operated devices.

Technical Specifications

Microcontrollers SPC5517EBMLQ66 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

MPC5510

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

1

No. of I/O Lines:

111

No. of Serial I/Os:

14

No. of Terminals:

144

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

81920

ROM Words:

196608

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Connectivity:

CAN(6), I2C, SCI(8), SPI(4)

Peripherals:

DMA(16), POR, RTC, TIMER(8)

Analog To Digital Convertors:

40-Ch 12-Bit

Trade Compliance

SPC5517EBMLQ66 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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