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SPC5517EBMLQ66R

NXP Semiconductors

SPC5517EBMLQ66R by NXP Semiconductors

NXP Semiconductors' SPC5517EBMLQ66R microcontroller features 32-bit architecture, 5V power supply, and 40MHz clock frequency. Ideal for automotive applications with CAN, I2C, SCI, SPI connectivity and AEC-Q100 screening level. Offers low power mode and extensive peripherals like DMA(16), RTC, POR.

Median Price

$42.329

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Verical

USA . 2,500 parts In-Stock

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$42.329

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$42.329

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Nova Conductors

Japan . 10 parts In-Stock

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$41.330

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$41.330

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TME

Poland . 3,500 parts In-Stock

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$49.910

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Vyrian

USA . 1,515 parts In-Stock

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Digiode

USA . 883 parts In-Stock

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Anansix

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Chip Stock

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One Stop Electronics

USA . 1,576 parts In-Stock

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$2.000

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Semicontronic

India . 994 parts In-Stock

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$2.000

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$1.950

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$1.940

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$2.000

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AZTECH Wire

Italy . 283 parts In-Stock

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$8.217

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$11.027

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$10.035

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$9.042

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Ampacity Inc.

Singapore . 1,450 parts In-Stock

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$31.000

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Aztec Data Supply Inc.

USA . 263 parts In-Stock

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$40.044

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Continental Prestige Electronics

USA . 6,392 parts In-Stock

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$39.532

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Netroflash

USA . 50 parts In-Stock

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$41.330

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$39.263

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$38.437

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$38.437

Modulus Dynamics

Lithuania . 69 parts In-Stock

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$45.766

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$45.308

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$43.935

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Corohmni

South Africa . 924 parts In-Stock

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Vigor

Singapore . 1,251 parts In-Stock

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Microchip USA

USA . 5,341 parts In-Stock

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Component Stockers USA

USA . 121 parts In-Stock

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Lixinc

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Corphita

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

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UNI Independent Distributors

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Overview

Experience unmatched performance and reliability with the SPC5517EBMLQ66R microcontroller by NXP Semiconductors. Ideal for automotive applications, this cutting-edge device offers a wide range of features such as 40 MHz maximum clock frequency, 8 timers, and 40 analog-to-digital converters. With a focus on quality and innovation, NXP Semiconductors ensures that this product delivers exceptional value and benefits to customers looking for high-speed processing, low power consumption, and robust connectivity options. Upgrade your projects with the SPC5517EBMLQ66R and unlock a world of possibilities in the automotive electronics industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging.

Surface Mount: YES

Simplifies installation and allows for compact design.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage requirements for robust performance.

Bit Size: 32

High bit size allows for complex calculations and processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses RISC architecture for efficient processing and reduced power consumption.

RAM Bytes: 81920

Ample RAM storage for multitasking and data manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Connectivity: CAN(6), I2C, SCI(8), SPI(4)

Multiple connectivity options for versatile interfacing with other devices.

ROM Programmability: FLASH

Flash ROM allows for easy and quick reprogramming of the microcontroller.

Low Power Mode: YES

Enables energy-efficient operation for battery-powered applications.

Technical Specifications

Microcontrollers SPC5517EBMLQ66R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

MPC5510

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

1

No. of I/O Lines:

111

No. of Serial I/Os:

14

No. of Terminals:

144

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

81920

ROM Words:

196608

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Connectivity:

CAN(6), I2C, SCI(8), SPI(4)

Peripherals:

DMA(16), POR, RTC, TIMER(8)

Analog To Digital Convertors:

40-Ch 12-Bit

Trade Compliance

SPC5517EBMLQ66R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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