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SPC5604PGF1MLL6

NXP Semiconductors

SPC5604PGF1MLL6 by NXP Semiconductors

NXP Semiconductors' SPC5604PGF1MLL6 microcontroller features 32-bit CPU, 524288 ROM words, and 40960 RAM bytes. Ideal for automotive applications with AEC-Q100 screening level, it operates b/w -40 to 125 °C at a max clock frequency of 40 MHz.

Median Price

$17.319

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1k+

SPC5604PGF1MLL6 by NXP Semiconductors
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Flip Electronics (Authorized)

USA . 450 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

USA . 8,855 parts In-Stock

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Anansix

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Digiode

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AZTECH Wire

Italy . 837 parts In-Stock

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Semicontronic

India . 289 parts In-Stock

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$9.000

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$8.775

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$8.730

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Continental Prestige Electronics

USA . 4,321 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$16.453

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$16.107

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Vigor

Singapore . 2,134 parts In-Stock

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Ampacity Inc.

Singapore . 272 parts In-Stock

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One Stop Electronics

USA . 364 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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Microchip USA

USA . 2,297 parts In-Stock

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Corohmni

South Africa . 1,170 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,072 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,334 parts In-Stock

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Corphita

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Argo Parts USA

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Overview

Discover the power and reliability of the SPC5604PGF1MLL6 microcontroller by NXP Semiconductors. This cutting-edge device offers unmatched quality and performance in a compact package, making it ideal for a wide range of applications in the automotive industry. With advanced features such as ADC and DMA channels, along with a high clock frequency, this microcontroller delivers exceptional value and efficiency to customers looking to take their projects to the next level. Trust NXP Semiconductors for superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product suitable for a wide range of applications.

Surface Mount: YES

The ability to be surface mounted allows for easy integration into PCB designs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power input levels, increasing its versatility.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures that the product meets stringent automotive quality standards, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, enabling compact designs.

Bit Size: 32

A 32-bit architecture provides high processing power and efficiency, making the microcontroller suitable for complex applications.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages gives flexibility in design and compatibility with various power sources.

No. of Terminals: 100

Having a high number of terminals allows for a greater number of interfacing options and features, enhancing the functionality of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a combination of compactness, low profile, and fine pitch, enabling high-density PCB designs and efficient thermal management.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures that the microcontroller can operate reliably even under low power conditions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the microcontroller to withstand harsh environmental conditions, ensuring long-term reliability.

CPU Family: E200

Belonging to the E200 CPU family indicates that the microcontroller is based on a proven and efficient processor architecture, offering high performance.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40°C to 125°C allows the microcontroller to operate in extreme temperature conditions, suitable for automotive and industrial applications.

Terminal Finish: TIN

Tin finish provides good solderability and corrosion resistance, ensuring robust connections and long-term reliability.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to interface with analog sensors and signals, expanding its range of possible applications.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory, optimizing the microcontroller's overall performance.

Terminal Position: QUAD

The quad terminal position offers a good balance between connectivity and space efficiency, facilitating PCB layout and assembly.

ROM Words: 524288

With a large ROM capacity, the microcontroller can store extensive program code and data, suitable for applications requiring complex algorithms and processing.

Width: 14 mm

A compact width of 14 mm allows for space-efficient PCB designs, ideal for applications with size constraints.

External Data Bus Width: 32

A wide external data bus of 32 bits enables high-speed data transfer and processing, enhancing the microcontroller's performance.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency of 40 MHz provides fast processing speeds, making the microcontroller suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

The ability to withstand peak reflow temperatures for up to 40 seconds ensures reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for lead-free soldering processes, meeting modern environmental regulations.

Length: 14 mm

A compact length of 14 mm complements the overall dimensions of the microcontroller, enabling space-efficient PCB designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets the strict temperature, reliability, and quality requirements of the automotive industry.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and functions on a single chip, offering a cost-effective and space-efficient solution for embedded systems.

RAM Bytes: 40960

With a large RAM capacity, the microcontroller can efficiently store and access data during operation, enabling smooth and reliable performance.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

The gull wing terminal form offers good solder joint reliability and coplanarity, ensuring robust connections and ease of soldering during assembly.

Maximum Supply Current: 89 mA

With a maximum supply current of 89 mA, the microcontroller operates efficiently within power constraints, making it suitable for battery-powered applications.

Nominal Supply Voltage: 5 V

Having a standard nominal supply voltage of 5 V simplifies power supply design and compatibility with existing systems and components.

PWM Channels: YES

Integrated PWM channels enable the microcontroller to generate precise analog output signals, supporting applications such as motor control and power management.

ROM Programmability: FLASH

Using flash ROM allows for easy and flexible programming of the microcontroller, enabling firmware updates and customization without requiring specialized equipment.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm facilitates high-density PCB layout and assembly, enabling compact and efficient designs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the microcontroller requires standard handling and storage procedures to prevent moisture-induced damage during assembly.

Speed: 64 rpm

With a speed of 64 rotations per minute, this microcontroller offers fast processing capabilities, suitable for applications requiring rapid data processing and response times.

Technical Specifications

Microcontrollers SPC5604PGF1MLL6 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

CPU Family:

E200

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

89 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC5604PGF1MLL6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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