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SPC5604PGF1MLQ6

NXP Semiconductors

SPC5604PGF1MLQ6 by NXP Semiconductors

NXP Semiconductors' SPC5604PGF1MLQ6 microcontroller features 32-bit CPU, 144 terminals, and 40 MHz clock frequency. Ideal for automotive applications due to AEC-Q100 screening level, with ADC and DMA channels for efficient data processing in a compact FLATPACK package.

Median Price

$48.059

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

SPC5604PGF1MLQ6 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 2,000 parts In-Stock

1+ parts

$80.688

100+ parts

$76.654

1k+ parts

$76.654

10k+ parts

-

2,000

$80.688

$76.654

$76.654

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Rochester

USA . 4,654 parts In-Stock

1+ parts

-

100+ parts

$15.430

1k+ parts

$13.800

10k+ parts

$12.990

4,654

-

$15.430

$13.800

$12.990

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,114 parts In-Stock

1+ parts

$13.566

100+ parts

-

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3,114

$13.566

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$16.860

100+ parts

-

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100

$16.860

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Flip Electronics

USA . 4,500 parts In-Stock

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4,500

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Vyrian

USA . 602 parts In-Stock

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602

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Anansix

USA . 483 parts In-Stock

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483

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 700 parts In-Stock

1+ parts

$12.140

100+ parts

-

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700

$12.140

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Semicontronic

India . 630 parts In-Stock

1+ parts

$12.140

100+ parts

$11.836

1k+ parts

$11.776

10k+ parts

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630

$12.140

$11.836

$11.776

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Ampacity Inc.

Singapore . 602 parts In-Stock

1+ parts

$12.140

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602

$12.140

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Corphita

USA . 1,482 parts In-Stock

1+ parts

$12.852

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1,482

$12.852

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Continental Prestige Electronics

USA . 6,509 parts In-Stock

1+ parts

$16.860

100+ parts

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1k+ parts

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10k+ parts

$16.523

6,509

$16.860

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$16.523

Netroflash

USA . 50 parts In-Stock

1+ parts

$16.860

100+ parts

$16.523

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-

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50

$16.860

$16.523

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Corohmni

South Africa . 966 parts In-Stock

1+ parts

$17.063

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966

$17.063

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Microchip USA

USA . 1,731 parts In-Stock

1+ parts

$46.458

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1,731

$46.458

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Aztec Data Supply Inc.

USA . 134 parts In-Stock

1+ parts

$59.024

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134

$59.024

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$80.688

100+ parts

$76.654

1k+ parts

$76.654

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2,000

$80.688

$76.654

$76.654

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UNI Independent Distributors

Spain . 5,057 parts In-Stock

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Argo Parts USA

USA . 3,780 parts In-Stock

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3,780

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Kepictronics

USA . 129 parts In-Stock

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129

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Overview

Experience unmatched performance and reliability with the SPC5604PGF1MLQ6 microcontroller by NXP Semiconductors. Crafted with precision using cutting-edge technology, this automotive-grade device is perfect for a wide range of applications. From advanced driver-assistance systems to industrial automation, this versatile microcontroller offers 32-bit processing power, robust connectivity options, and efficient power management. Trust NXP Semiconductors to deliver top-of-the-line quality and innovation, ensuring you stay ahead in today's fast-paced tech landscape. Elevate your projects with the SPC5604PGF1MLQ6 and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easy to mount on PCBs, saving space and allowing for automated assembly.

Maximum Supply Voltage: 5.5 V

Supports a wide range of power supplies, making it versatile.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality.

Package Shape: SQUARE

Compact design, ideal for space-constrained applications.

Bit Size: 32

High-performance processor suitable for a wide range of tasks.

Power Supplies (V): 3.3/5

Compatible with common power supply voltages, making it easy to integrate.

No. of Terminals: 144

Sufficient terminals for connecting to peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Streamlined packaging design for efficient PCB layout and heat dissipation.

Minimum Supply Voltage: 4.5 V

Wide operating voltage range for flexibility in power sources.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for automotive and industrial environments.

CPU Family: E200

High-performance CPU architecture for demanding applications.

Minimum Operating Temperature: -40 °C

Operates reliably in low-temperature environments.

ADC Channels: YES

Integrated analog-to-digital converters for sensor interfacing.

DMA Channels: YES

Supports direct memory access for efficient data transfer.

Terminal Position: QUAD

Arrangement of terminals for easy PCB routing and signal integrity.

ROM Words: 524288

Large memory capacity for storing program code and data.

Width: 20 mm

Compact form factor suitable for small-scale applications or PCB designs.

External Data Bus Width: 32

Wide data bus for efficient data transfer between memory and peripherals.

Maximum Clock Frequency: 40 MHz

High clock speed for quick task execution and real-time processing.

Maximum Time At Peak Reflow Temperature (s): 40

Reliable soldering process with defined reflow duration.

Peak Reflow Temperature °C: 260

High melting point ensures stable solder joints during assembly.

Length: 20 mm

Symmetrical design for uniform PCB layout and component placement.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for temperature and reliability requirements.

Peripheral IC Type: MICROCONTROLLER

All-in-one integrated circuit for controlling various functions in electronic systems.

RAM Bytes: 40960

Sufficient random access memory for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity characteristics.

Terminal Form: GULL WING

Strong mechanical bonding for reliable electrical connections.

Maximum Supply Current: 89 mA

Low power consumption for energy-efficient operation.

Nominal Supply Voltage: 5 V

Common voltage standard for compatibility with various electronic components.

PWM Channels: YES

Supports pulse-width modulation for precise control of output signals.

ROM Programmability: FLASH

Reprogrammable memory for easy firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine pitch spacing for high-density PCB designs and miniaturization.

Moisture Sensitivity Level (MSL): 3

Moderate sensitivity to moisture for reliable performance in varied environmental conditions.

Speed: 64 rpm

Efficient processing speed for real-time control and data handling tasks.

Technical Specifications

Microcontrollers SPC5604PGF1MLQ6 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

CPU Family:

E200

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

89 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC5604PGF1MLQ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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