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SPC5777CAK3MMO3

NXP Semiconductors

SPC5777CAK3MMO3 by NXP Semiconductors

NXP Semiconductors' SPC5777CAK3MMO3 microcontroller features 32-bit architecture, 22-bit address bus width, and 16-bit external data bus. Ideal for automotive applications with ISO 26262 screening level, it offers CAN, Ethernet, and SPI connectivity along with 4-Ch 16-Bit ADCs and PWM channels.

Median Price

$80.960

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 36 parts In-Stock

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$80.960

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$59.310

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Flip Electronics (Authorized)

USA . 600 parts In-Stock

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600

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Nova Conductors

Japan . 45 parts In-Stock

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$43.627

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Digiode

USA . 1,763 parts In-Stock

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$57.808

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Vyrian

USA . 8,764 parts In-Stock

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Anansix

USA . 884 parts In-Stock

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Flip Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 686 parts In-Stock

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$13.847

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Corohmni

South Africa . 540 parts In-Stock

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$30.684

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Advanced Electronics

New Zealand . 99 parts In-Stock

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$38.439

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$34.979

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$31.520

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Ampacity Inc.

Singapore . 161 parts In-Stock

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$51.720

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Corphita

USA . 429 parts In-Stock

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$54.765

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Vigor

Singapore . 1,357 parts In-Stock

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Microchip USA

USA . 1,783 parts In-Stock

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UNI Independent Distributors

Spain . 4,994 parts In-Stock

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Argo Parts USA

USA . 3,405 parts In-Stock

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Continental Prestige Electronics

USA . 1,134 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$42.754

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$41.445

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$40.573

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$42.754

$41.445

$40.573

Overview

Unlock the power of cutting-edge technology with the SPC5777CAK3MMO3 microcontroller by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch quality and reliability. This microcontroller is perfect for automotive applications, offering advanced features like ADC channels, DMA support, and PWM channels. With a wide range of connectivity options and high-speed performance, this product provides unparalleled value to customers seeking efficient and innovative solutions for their projects. Trust NXP Semiconductors to drive your success with the SPC5777CAK3MMO3 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy is a common and cost-effective material for packaging microcontrollers, making this product affordable and widely available.

Maximum Supply Voltage: 1.32 V

The low maximum supply voltage of 1.32V makes this microcontroller energy efficient and suitable for applications where power consumption is a concern.

Bit Size: 32

With a 32-bit architecture, this microcontroller is capable of handling more complex algorithms and computations, making it suitable for advanced applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller ensures high performance and efficient execution of instructions, making it a reliable choice for demanding applications.

Connectivity: CAN(6), ETHERNET, LFAST, PSI5(2), SCI(5), SENT(12), SIPI, SPI(5)

The multiple connectivity options such as CAN, Ethernet, and SPI make this microcontroller versatile and suitable for a wide range of communication protocols and interfaces.

Technical Specifications

Microcontrollers SPC5777CAK3MMO3 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES @ 1.2V TO 1.38V, 70-CH ADC INPUT LINES AVAILABLE

Address Bus Width:

22

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

ROM Words:

8388608

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

2.02 mm

Speed:

264 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), ETHERNET, LFAST, PSI5(2), SCI(5), SENT(12), SIPI, SPI(5)

Peripherals:

DMA(128), POR

Analog To Digital Convertors:

4-Ch 16-Bit

Trade Compliance

SPC5777CAK3MMO3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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