Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FS32K148HAT0VLQR
NXP Semiconductors
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; No. of I/O Lines: 128;
YES
32
CORTEX-M4F
40 MHz
NO
FLOATING-POINT
S-PQFP-G144
20 mm
16
128
3
144
66
8
105 Cel
-40 Cel
PLASTIC/EPOXY
LFQFP
QFP144,.87SQ,20
SQUARE
FLATPACK, LOW PROFILE, FINE PITCH
262144
2097152
FLASH
ISO 26262
1.6 mm
80 rpm
5.5 V
2.7 V
5 V
CMOS
GULL WING
.5 mm
QUAD
MICROCONTROLLER, RISC
4096
CAN(3), I2C(2), LIN(3), LPUART(3), SAI(2), SPI(3)
BOR, COMPARATOR, POR, RTC, TIMER(66), WDT
32-Ch 12-Bit
1-Ch 8-Bit
FS32K148HAT0VLQT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; No. of DMA Channels: 16;
e3
260
TIN
40
FS32K148HAT0VLUT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; ROM Words: 2097152;
S-PQFP-G176
24 mm
156
176
QFP176,1.0SQ,20
FS32K148HET0CLQR
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; External Data Bus Width: 0;
0
50 MHz
3.3 V
FS32K148HET0CLQT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Width: 20 mm;
FS32K148HET0MLQR
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Nominal Supply Voltage: 5 V;
125 Cel
FS32K148HET0MLQT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; ROM Programmability: FLASH;
FS32K148HET0MLUT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; No. of I/O Lines: 156;
FS32K148HET0VLQT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Technology: CMOS;
FS32K148HFT0MLQR
FS32K148HFT0MLQT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES;
FS32K148HFT0MLUR
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Connectivity: CAN(3), I2C(2), LIN(3), LPUART(3), SAI(2), SPI(3);
FS32K148HFT0MLUT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
FS32K148HFT0VLQR
FS32K148HFT0VLQT
The NXP Semiconductors FS32K148HFT0VLQT microcontroller features a 32-bit CPU, 262144 bytes of RAM, and 2097152 ROM words. It is suitable for applications requiring CAN, I2C, LIN connectivity and offers low power mode with a max clock frequency of 40 MHz. This Cortex-M4F family device operates b/w -40 to 105°C temperature range.
FS32K148HNT0VLUR
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
FS32K148HNT0VLUT
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
FS32K148HRT0VLQR
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LQFP; Package Shape: SQUARE; Minimum Supply Voltage: 2.7 V;
LQFP
FLATPACK, LOW PROFILE
FS32K148HRT0VLQT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LQFP; Package Shape: SQUARE; Nominal Supply Voltage: 5 V;
FS32K148HRT0VLUT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LQFP; Package Shape: SQUARE; External Data Bus Width: 0;
112 rpm
FS32K148HST0MLQT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Nominal Supply Voltage: 3.3 V;
FS32K148UAT0VLQR
NXP Semiconductors' FS32K148UAT0VLQR microcontroller features a 32-bit CPU, 262144 bytes of RAM, and 2097152 ROM words. Ideal for applications requiring CAN, I2C, LIN connectivity and 66 timers. Operating temperature range from -40 to 105 °C with low power mode support.
FS32K148UAT0VLQT
The NXP Semiconductors FS32K148UAT0VLQT microcontroller features a 32-bit CPU, 262144 bytes of RAM, and 2097152 ROM words. It is ideal for applications requiring CAN, I2C, LIN connectivity and offers low power mode with a max clock frequency of 40 MHz.
FS32K148UAT0VLUR
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Nominal Supply Voltage: 5 V;
FS32K148UAT0VLUT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Maximum Supply Voltage: 5.5 V;
FS32K148UJT0VLQR
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Digital To Analog Convertors: 1-Ch 8-Bit;
FS32K148UJT0VLUR
FS32K148UJT0VLUT
The NXP Semiconductors FS32K148UJT0VLUT microcontroller features a 32-bit CPU with Cortex-M4F family, 176 terminals, and 262144 bytes of RAM. It is suitable for applications requiring CAN, I2C, LIN connectivity, with low power mode and integrated cache for enhanced performance.
FS32K148URT0VLQR
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LQFP; Package Shape: SQUARE; Maximum Supply Voltage: 5.5 V;
FS32K148URT0VLQT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LQFP; Package Shape: SQUARE; Length: 20 mm;
FS32K148URT0VLUR
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LQFP; Package Shape: SQUARE; Maximum Clock Frequency: 40 MHz;
FS32K148URT0VLUT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LQFP; Package Shape: SQUARE; No. of I/O Lines: 156;
FS32K116BRT0MFMR
MICROCONTROLLER, RISC; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;
e4
5 mm
28
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
48 rpm
Nickel/Palladium/Gold (Ni/Pd/Au)
NO LEAD
FS32K116BRT0MFMT
MICROCONTROLLER, RISC; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
FS32K116BRT0MLFR
NXP Semiconductors' FS32K116BRT0MLFR is a 32-bit microcontroller with 48 I/O lines, PWM channels, and ADC channels. Operating at a max clock frequency of 40 MHz, it is ideal for applications requiring high-speed processing such as industrial automation and automotive control systems. With a low profile flatpack package style and gull wing terminal form, this microcontroller offers versatile integration options in compact designs.
7 mm
43
48
FS32K116BRT0MLFT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LQFP; Package Shape: SQUARE; ADC Channels: YES;
FS32K116BRT0VFMT
NXP Semiconductors' FS32K116BRT0VFMT is a 32-bit microcontroller with 40 MHz clock frequency, 28 I/O lines, and PWM channels. Ideal for applications requiring high-speed processing and precise control such as motor control systems or industrial automation equipment. Features include ADC channels, low supply voltage of 2.7V, and compact square package design for space-constrained designs.
FS32K116BRT0VLFR
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
CORTEX-M0
FIXED POINT
R-PQFP-G48
2
QFP48,.35SQ,20
17408
131072
INDUSTRIAL
2K
FLEXCAN, I2C, SPI, LPUART(2)
POR, RTC, TIMER(13), WDT
13-Ch 12-Bit
FS32K116BRT0VLFT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LQFP; Package Shape: SQUARE; No. of I/O Lines: 43;
FS32K118BRT0VLHR
The NXP Semiconductors FS32K118BRT0VLHR is a 32-bit microcontroller with 64 terminals, operating at a max clock frequency of 40 MHz. It features ADC and PWM channels, suitable for applications requiring high-speed processing and precise analog-to-digital conversion. Ideal for compact designs due to its square package shape and low profile flatpack style.
10 mm
58
64
FS32K118BRT0VLHT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
FS32R274KSK2VMM
MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 260; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
e2
TIN SILVER
S9S12VRP64F0MLF
MICROCONTROLLER; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Peak Reflow Temperature (C): 260;
MICROCONTROLLER
MC9S08PL16CTJ
MICROCONTROLLER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;
MC9S08PL60CLD
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
MC9S08PL8CTG
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3;
MC9S08PL8CTJ
MICROCONTROLLER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN;
MC9S08QL8CTG
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage: 1.8 V;
16 MHz
14
TSSOP
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
20 rpm
3.6 V
1.8 V
3 V
.65 mm
DUAL
4.4 mm
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