Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MC9S08QL4CTG
NXP Semiconductors
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260;
e3
3
260
TIN
40
MICROCONTROLLER
MC9S08QL4CTJ
MICROCONTROLLER; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
MKW35A512VFP4
MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD;
e4
NICKEL PALLADIUM GOLD
MICROCONTROLLER, RISC
MKW35Z512VHT4
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL GOLD;
NICKEL GOLD
MKW36A512VFP4
The NXP Semiconductors MKW36A512VFP4 microcontroller features a 32-bit architecture, 40 terminals, and operates at a max clock frequency of 32 MHz. Ideal for industrial applications requiring high-speed processing and low power consumption. With ADC and DMA channels, it offers versatile functionality in a compact chip carrier package.
YES
0
32
32 MHz
NO
S-PQCC-N40
6 mm
18
8
105 Cel
-40 Cel
PLASTIC/EPOXY
HVQCCN
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLASH
AEC-Q100
1 mm
48 rpm
3.6 V
1.71 V
3 V
CMOS
INDUSTRIAL
NO LEAD
.5 mm
QUAD
MKW36Z512VFP4
MICROCONTROLLER, RISC; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
SPC5745RK1MMT5
Microcontrollers; Terminal Form: BALL; No. of Terminals: 252; Package Code: LFBGA; Package Shape: SQUARE; Maximum Clock Frequency: 40 MHz;
40 MHz
e2
17 mm
252
LFBGA
GRID ARRAY, LOW PROFILE, FINE PITCH
200 rpm
1.32 V
1.2 V
1.25 V
TIN SILVER
BALL
.8 mm
BOTTOM
SPC5746RK1MLU3
Microcontrollers; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LQFP; Package Shape: SQUARE; JESD-609 Code: e3;
24 mm
176
LQFP
FLATPACK, LOW PROFILE
150 rpm
GULL WING
MC56F82748MLH
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE; Bit Size: 32;
50 MHz
10 mm
54
64
QFP
FLATPACK
100 rpm
2.7 V
3.3 V
MKE14Z32VLD4
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE; Surface Mount: YES;
CORTEX-M0
FIXED POINT
S-PQFP-G44
38
44
4
QFP44,.47SQ,32
4096
32768
1.6 mm
9.78 mA
5.5 V
5 V
I2C, SPI, UART(3)
COMPARATOR, POR, RTC, TIMER(11), WDT
12-Ch 12-Bit
MKE14Z64VLD4
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE; Package Equivalence Code: QFP44,.47SQ,32;
8192
65536
MKE15Z32VLD4
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE; Boundary Scan: NO;
MKE15Z64VLD4
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE; Length: 10 mm;
MKE16Z64VLD4
NXP Semiconductors' MKE16Z64VLD4 is a 32-bit microcontroller with 44 terminals, operating at up to 40 MHz. Featuring 12 ADC channels and 12-bit resolution, it's ideal for applications requiring CAN, I2C, SPI, and UART connectivity in a compact package.
CAN, I2C, SPI, UART(3)
MKW35A512VFT4
MICROCONTROLLER, RISC; Terminal Finish: NICKEL PALLADIUM GOLD; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MKW36A512VFT4R
MICROCONTROLLER, RISC; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Length: 7 mm;
7 mm
25
48
MKW36A512VFT4
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL PALLADIUM GOLD; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
K32L2B11VFM0A
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD;
K32L2B11VFT0A
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD;
K32L2B11VLH0A
MICROCONTROLLER, RISC; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;
K32L2B11VMP0A
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER;
e1
TIN SILVER COPPER
K32L2B21VFM0A
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 40;
K32L2B21VFT0A
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: NICKEL PALLADIUM GOLD; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3;
K32L2B21VLH0A
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN;
K32L2B21VMP0A
MICROCONTROLLER, RISC; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3;
K32L2B31VMP0A
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40;
MC9S08PB16MTG
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage: 2.7 V;
20 MHz
5 mm
14
16
TSSOP
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
20 rpm
.65 mm
DUAL
4.4 mm
MC9S08PB16MTJ
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
6.5 mm
20
MC9S08PB8MTJ
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
MC9S08PB8VTJ
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 3 V;
LPC1764FBD100K
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Analog To Digital Convertors: 8-Ch 12-Bit;
CORTEX-M3
25 MHz
14 mm
70
100
85 Cel
LFQFP
FLATPACK, LOW PROFILE, FINE PITCH
131072
2.4 V
30
CAN(2), ETHERNET, I2C(3), UART(4), USB
BOD, DMA, POR, RTC, TIMER(6), WDT
8-Ch 12-Bit
LPC18S37JBD144E
MICROCONTROLLER, RISC; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;
LPC2420FBD208K
MICROCONTROLLER, RISC; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 30;
2
LPC4367JBD208E
MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
LPC43S67JBD208E
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN;
LPC54605J256BD100E
NXP Semiconductors' LPC54605J256BD100E microcontroller features a 32-bit CORTEX-M4 CPU, 139264 bytes of RAM, and 262144 ROM words. With 12-Ch 12-Bit ADCs, it's ideal for applications requiring BOD, DMA(30), RTC, TIMER(8), WDT peripherals and I2C(9), I2S(9), SPI(9), USART(9), USB(2) connectivity. Operating b/w -40 to 85 °C with a max clock frequency of 25 MHz makes it suitable for various industrial automation and IoT projects.
CORTEX-M4
139264
262144
180 rpm
1.8 V
I2C(9), I2S(9), SPI(9), USART(9), USB(2)
BOD, DMA(30), RTC, TIMER(8), WDT
LPC54605J256ET100E
NXP Semiconductors' LPC54605J256ET100E microcontroller features a 32-bit CORTEX-M4 CPU, 262144 ROM words, and 139264 RAM bytes. With 12-Ch 12-Bit ADCs, 64 I/O lines, and connectivity options like I2C, SPI, USART, and USB, it's ideal for applications requiring high-speed processing and multiple peripherals. Operating b/w -40 to +85 °C with a max clock frequency of 25 MHz makes it suitable for various industrial automation and IoT projects.
9 mm
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
LPC54605J256ET180E
NXP Semiconductors LPC54605J256ET180E microcontroller features 32-bit CORTEX-M4 CPU, 14-bit address bus width, and 180 terminals. Ideal for applications requiring up to 25 MHz clock frequency, with peripherals like BOD, DMA(30), RTC, TIMER(8), WDT. Suitable for various uses including IoT devices and industrial automation systems.
12 mm
145
180
I2C(10), I2S(10), SPI(10), USART(10), USB(2)
LPC54605J512ET100E
NXP Semiconductors' LPC54605J512ET100E is a 32-bit microcontroller with Cortex-M4 CPU, offering 12-Ch 12-Bit ADC channels and PWM support. It operates b/w -40 to 85 °C, with a max clock frequency of 25 MHz. Ideal for applications requiring high-speed data processing and connectivity via I2C, I2S, SPI, USART, and USB interfaces.
163840
524288
LPC54606J256BD100E
NXP Semiconductors LPC54606J256BD100E microcontroller features 32-bit CORTEX-M4 CPU, 139264 bytes RAM, and 12-Ch 12-Bit ADC for high-performance applications. With connectivity options like I2C(9), SPI(9), and USB(2), it's ideal for IoT devices. Operating b/w -40 to 85 °C, it offers a clock frequency of up to 25 MHz.
LPC54606J256ET100E
LPC54606J256ET100E by NXP Semiconductors is a 32-bit microcontroller with a max clock frequency of 25 MHz. It features 12-channel, 12-bit analog-to-digital converters and offers connectivity options such as I2C, I2S, SPI, USART, and USB. This microcontroller is commonly used in applications that require high-speed processing and precise analog-to-digital conversion.
LPC54606J256ET180E
NXP Semiconductors' LPC54606J256ET180E microcontroller features a 32-bit CORTEX-M4 CPU, 180 terminals, and 139264 bytes of RAM. With a max clock frequency of 25 MHz, it is suitable for applications requiring high-speed processing such as industrial automation and IoT devices. Additionally, it offers connectivity options like I2C, SPI, USART, and USB for versatile integration.
LPC54606J512BD208E
NXP Semiconductors' LPC54606J512BD208E microcontroller features a 32-bit CORTEX-M4 CPU, 12-Ch 12-Bit ADC, and 171 I/O lines. With a max clock frequency of 25 MHz, it is suitable for applications requiring high-speed data processing and connectivity via I2C, I2S, SPI, USART, and USB interfaces. The microcontroller operates within a temperature range of -40 to 85°C and offers extensive peripheral support including BOD, DMA(30), RTC, TIMER(8), and WDT functionalities.
28 mm
171
208
LPC54606J512ET100E
NXP Semiconductors LPC54606J512ET100E microcontroller features 32-bit CORTEX-M4 CPU, 14-bit address bus, and 16-bit external data bus. With 12-Ch 12-Bit ADCs, it's ideal for applications requiring BOD, DMA(30), RTC, TIMER(8), WDT peripherals and I2C(9), I2S(9), SPI(9), USART(9), USB(2) connectivity. Operating b/w -40 to 85 °C, it offers a clock frequency of up to 25 MHz.
LPC54607J256BD208E
NXP Semiconductors' LPC54607J256BD208E microcontroller features a 32-bit CORTEX-M4 CPU, 12-Ch 12-Bit ADC, and 171 I/O lines. With a max clock frequency of 25 MHz, it is ideal for applications requiring high-speed data processing. This microcontroller supports various connectivity options such as I2C, SPI, USART, and USB for versatile integration in electronic systems.
LPC54607J256ET180E
NXP Semiconductors' LPC54607J256ET180E microcontroller features a 32-bit CORTEX-M4 CPU, 180 terminals, and 139264 bytes of RAM. With a max clock frequency of 25 MHz, it is suitable for applications requiring high-speed processing such as industrial automation and IoT devices. Additionally, its connectivity options include I2C, I2S, SPI, USART, and USB interfaces.
LPC54607J512ET180E
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 180; Package Code: TFBGA; Package Shape: SQUARE; Bit Size: 32;
LPC54608J512BD208E
NXP Semiconductors' LPC54608J512BD208E microcontroller features a 32-bit CORTEX-M4 CPU, 12-Ch 12-Bit ADC, and 171 I/O lines. With CAN, ETHERNET, USB(2), and more connectivity options, it's ideal for applications requiring high-speed data processing and multiple peripherals. Operating b/w -40 to 85 °C, this MCU is suitable for industrial automation and IoT devices.
CAN, ETHERNET, I2C(10), I2S(10), SPI(10), USART(10), USB(2)
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