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MKE15Z32VLD4

NXP Semiconductors

MKE15Z32VLD4 by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE; Boundary Scan: NO;

Median Price

$3.800

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 800 parts In-Stock

1+ parts

$3.800

100+ parts

$2.626

1k+ parts

$2.149

10k+ parts

$2.045

800

$3.800

$2.626

$2.149

$2.045

Mouser Electronics

USA . 800 parts In-Stock

1+ parts

$3.800

100+ parts

$2.310

1k+ parts

$1.980

10k+ parts

$1.930

800

$3.800

$2.310

$1.980

$1.930

Flip Electronics (Authorized)

USA . 14,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,045

-

-

-

-

Verical

USA . 595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.198

10k+ parts

-

595

-

-

$2.198

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 781 parts In-Stock

1+ parts

$2.746

100+ parts

-

1k+ parts

-

10k+ parts

-

781

$2.746

-

-

-

Flip Electronics

USA . 18,845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,845

-

-

-

-

Vyrian

USA . 7,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,970

-

-

-

-

Anansix

USA . 190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

190

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,292 parts In-Stock

1+ parts

$2.601

100+ parts

-

1k+ parts

-

10k+ parts

-

4,292

$2.601

-

-

-

Microchip USA

USA . 3,252 parts In-Stock

1+ parts

$18.591

100+ parts

-

1k+ parts

-

10k+ parts

-

3,252

$18.591

-

-

-

UNI Independent Distributors

Spain . 2,238 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,238

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-

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-

Technical Specifications

Microcontrollers MKE15Z32VLD4 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Serial I/Os:

3

No. of Terminals:

44

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Current:

9.78 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, UART(3)

Peripherals:

COMPARATOR, POR, RTC, TIMER(11), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MKE15Z32VLD4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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