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MC9S08PB8MTJ

NXP Semiconductors

MC9S08PB8MTJ by NXP Semiconductors

MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;

Median Price

$1.580

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 44 parts In-Stock

1+ parts

$1.230

100+ parts

-

1k+ parts

-

10k+ parts

-

44

$1.230

-

-

-

DigiKey

USA . 413 parts In-Stock

1+ parts

$1.930

100+ parts

$1.173

1k+ parts

$1.039

10k+ parts

$0.952

413

$1.930

$1.173

$1.039

$0.952

Mouser Electronics

USA . 73 parts In-Stock

1+ parts

$1.930

100+ parts

$1.110

1k+ parts

$1.030

10k+ parts

$0.952

73

$1.930

$1.110

$1.030

$0.952

Element14

Singapore . 44 parts In-Stock

1+ parts

$2.980

100+ parts

$1.880

1k+ parts

$1.770

10k+ parts

$1.430

44

$2.980

$1.880

$1.770

$1.430

Verical

USA . 9,975 parts In-Stock

1+ parts

-

100+ parts

$0.952

1k+ parts

-

10k+ parts

-

9,975

-

$0.952

-

-

Flip Electronics (Authorized)

USA . 7,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,650

-

-

-

-

Rochester

USA . 144 parts In-Stock

1+ parts

-

100+ parts

$1.130

1k+ parts

$0.938

10k+ parts

$0.836

144

-

$1.130

$0.938

$0.836

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,214 parts In-Stock

1+ parts

$0.880

100+ parts

-

1k+ parts

-

10k+ parts

-

1,214

$0.880

-

-

-

Flip Electronics

USA . 15,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,300

-

-

-

-

Vyrian

USA . 3,162 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,162

-

-

-

-

Anansix

USA . 186 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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186

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 909 parts In-Stock

1+ parts

$0.833

100+ parts

-

1k+ parts

-

10k+ parts

-

909

$0.833

-

-

-

Component Stockers USA

USA . 661 parts In-Stock

1+ parts

$1.040

100+ parts

$0.980

1k+ parts

-

10k+ parts

-

661

$1.040

$0.980

-

-

Continental Prestige Electronics

USA . 44 parts In-Stock

1+ parts

$1.520

100+ parts

$0.939

1k+ parts

$0.742

10k+ parts

-

44

$1.520

$0.939

$0.742

-

Microchip USA

USA . 2,916 parts In-Stock

1+ parts

$15.405

100+ parts

-

1k+ parts

-

10k+ parts

-

2,916

$15.405

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$32.157

100+ parts

$29.263

1k+ parts

$26.369

10k+ parts

-

5,000

$32.157

$29.263

$26.369

-

UNI Independent Distributors

Spain . 2,673 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,673

-

-

-

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Technical Specifications

Microcontrollers MC9S08PB8MTJ attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

20 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

18

No. of Terminals:

20

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Speed:

20 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

MC9S08PB8MTJ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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