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MC9S12A256CPVE

NXP Semiconductors

MC9S12A256CPVE by NXP Semiconductors

MC9S12A256CPVE by NXP Semiconductors is a 16-bit microcontroller with 19-bit address bus width, operating at max 16 MHz. Ideal for industrial applications, it features 262144 ROM words, 12288 RAM bytes, and PWM channels for precise control in various electronic systems.

Median Price

$33.260

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

MC9S12A256CPVE by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,219 parts In-Stock

1+ parts

$24.340

100+ parts

$22.180

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1,219

$24.340

$22.180

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Chip1Stop

Japan . 240 parts In-Stock

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$24.700

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Verical

USA . 240 parts In-Stock

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$30.220

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$30.220

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Future Electronics

Canada . 770 parts In-Stock

1+ parts

$33.190

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$31.610

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770

$33.190

$31.610

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Adafruit Industries

USA . 200 parts In-Stock

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$36.122

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$34.316

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$34.316

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200

$36.122

$34.316

$34.316

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Farnell

UK . 1,055 parts In-Stock

1+ parts

$40.480

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$28.580

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$40.480

$28.580

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Mouser Electronics

USA . 553 parts In-Stock

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$52.220

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$38.850

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553

$52.220

$38.850

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DigiKey

USA . 301 parts In-Stock

1+ parts

$54.470

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$39.682

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301

$54.470

$39.682

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Element14

Singapore . 1,275 parts In-Stock

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$59.880

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$44.890

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$59.880

$44.890

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Avnet

USA . 1,500 parts In-Stock

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EBV Elektronik

Germany . 120 parts In-Stock

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Newark

USA . 42 parts In-Stock

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$30.830

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Rochester

USA . 37 parts In-Stock

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$33.260

1k+ parts

$29.760

10k+ parts

$28.010

37

-

$33.260

$29.760

$28.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,902 parts In-Stock

1+ parts

$26.818

100+ parts

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3,902

$26.818

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Nova Conductors

Japan . 63 parts In-Stock

1+ parts

$33.630

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63

$33.630

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IBS Electronics

USA . 475 parts In-Stock

1+ parts

$46.549

100+ parts

$45.315

1k+ parts

$43.926

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475

$46.549

$45.315

$43.926

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Anansix

USA . 1,840 parts In-Stock

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1,840

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TME

Poland . 1,559 parts In-Stock

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$45.150

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1,559

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$45.150

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NAC Semi

USA . 780 parts In-Stock

1+ parts

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$46.100

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$42.550

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780

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$46.100

$42.550

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Chip Stock

USA . 485 parts In-Stock

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Flip Electronics

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Vyrian

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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J2 Sourcing AB

Sweden . 1 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,583 parts In-Stock

1+ parts

$25.407

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$25.407

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Aranea Global

USA . 100 parts In-Stock

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$32.957

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$31.639

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100

$32.957

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$31.639

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Continental Prestige Electronics

USA . 3,153 parts In-Stock

1+ parts

$33.630

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$32.957

3,153

$33.630

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$32.957

Modulus Dynamics

Lithuania . 519 parts In-Stock

1+ parts

$35.070

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$35.070

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$35.070

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519

$35.070

$35.070

$35.070

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Corohmni

South Africa . 215 parts In-Stock

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$35.070

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$36.122

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$34.316

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$34.316

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$36.122

$34.316

$34.316

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Component Stockers USA

USA . 2,990 parts In-Stock

1+ parts

$41.300

100+ parts

$29.450

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$29.450

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2,990

$41.300

$29.450

$29.450

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Aztec Data Supply Inc.

USA . 1,676 parts In-Stock

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$41.480

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$41.480

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Ampacity Inc.

Singapore . 123 parts In-Stock

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$47.730

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123

$47.730

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Microchip USA

USA . 2,478 parts In-Stock

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$100.234

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2,478

$100.234

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iodParts Technologies Inc.

India . 8,048 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,949 parts In-Stock

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UNI Independent Distributors

Spain . 4,550 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Lixinc

USA . 3,496 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Perfect Parts

USA . 2,093 parts In-Stock

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2,093

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Robosynatics

Brazil . 798 parts In-Stock

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$34.369

1k+ parts

$33.667

10k+ parts

$33.667

798

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$34.369

$33.667

$33.667

Lucentia Tech

USA . 798 parts In-Stock

1+ parts

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$34.369

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$33.667

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$33.667

798

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$34.369

$33.667

$33.667

Kepictronics

USA . 183 parts In-Stock

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Argo Parts USA

USA . 86 parts In-Stock

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Overview

Unlock the power of innovation with the MC9S12A256CPVE microcontroller by NXP Semiconductors. This cutting-edge technology offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. Whether you're designing smart appliances, automotive systems, or industrial machinery, this microcontroller delivers the speed, efficiency, and flexibility you need to bring your ideas to life. Trust in NXP's reputation for quality and craftsmanship, and experience the difference that the MC9S12A256CPVE can make in your next project. Upgrade to superior performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a maximum supply voltage of 2.75 V, making it suitable for low power applications.

Address Bus Width: 19

A wide address bus width of 19 allows for efficient communication and data transfer within the microcontroller.

Bit Size: 16

With a 16-bit size, the microcontroller can process data and instructions in larger chunks, enhancing overall performance.

Power Supplies (V): 2.5,5

Supports multiple power supply options of 2.5V and 5V, providing flexibility in voltage requirements.

No. of Terminals: 112

A high number of terminals allow for versatile connectivity options and interfaces with other components.

Package Style (Meter): FLATPACK, LOW PROFILE

Flatpack, low profile package style saves space and enhances overall design aesthetics.

Minimum Supply Voltage: 2.35 V

Operates efficiently even at a low minimum supply voltage of 2.35V, suitable for power-sensitive applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85°C, making it suitable for industrial environments.

CPU Family: CPU12

Part of the CPU12 family, providing compatibility and familiarity with existing hardware and software systems.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures down to -40°C, suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Integrated ADC channels enable analog input capabilities, expanding the range of sensors and devices that can be connected.

Terminal Position: QUAD

Quad terminal position allows for easy placement and soldering, enhancing manufacturing efficiency.

ROM Words: 262144

Large ROM capacity of 262144 words allows for extensive program storage and flexibility in firmware development.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm saves space and enables compact device designs.

Width: 20 mm

Compact width of 20mm allows for easy integration into various electronic devices and systems.

External Data Bus Width: 16

An external data bus width of 16 ensures fast and efficient data transfer between the microcontroller and external components.

Maximum Clock Frequency: 16 MHz

Operates at a maximum clock frequency of 16 MHz, providing high-speed processing capabilities for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time at peak reflow temperature of 40 seconds, ensures reliable soldering and manufacturing process.

Peak Reflow Temperature °C: 260

Capable of withstanding a peak reflow temperature of 260°C, ensuring robust solder joints and durability.

Length: 20 mm

Compact length of 20mm ensures compatibility with various board sizes and form factors.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, providing versatile computing capabilities for a wide range of embedded system applications.

RAM Bytes: 12288

Large RAM capacity of 12288 bytes allows for efficient data storage and manipulation during program execution.

Technology: CMOS

Utilizes CMOS technology, offering low power consumption, high noise immunity, and compatibility with various digital systems.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections, ensuring reliable electrical contact and mechanical strength.

Maximum Supply Current: 65 mA

Operates within a maximum supply current of 65mA, suitable for low power applications and energy-efficient designs.

Nominal Supply Voltage: 2.5 V

Standard nominal supply voltage of 2.5V ensures compatibility with common power sources and voltage regulators.

PWM Channels: YES

Integrated PWM channels enable precise control of pulse-width modulation signals, ideal for motor control and power management.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates without the need for external programming devices.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for high-density mounting and space-saving PCB layouts.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates device can withstand standard surface mount assembly processes without damage from moisture exposure.

Speed: 25 rpm

Operates at a maximum speed of 25rpm, suitable for a wide range of motor control and motion sensing applications.

No. of I/O Lines: 91

A high number of I/O lines provide extensive input and output capabilities for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MC9S12A256CPVE attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

19

Bit Size:

16

CPU Family:

CPU12

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G112

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

91

No. of Terminals:

112

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP112,.87SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MC9S12A256CPVE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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