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MC9S12DG256CPVE

NXP Semiconductors

MC9S12DG256CPVE by NXP Semiconductors

MC9S12DG256CPVE by NXP Semiconductors is a 16-bit microcontroller with 262144 ROM words, 12288 RAM bytes, and 91 I/O lines. It operates at a max clock frequency of 16 MHz and has PWM channels for various industrial applications.

Median Price

$38.850

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 235 parts In-Stock

1+ parts

$18.710

100+ parts

$18.340

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$17.960

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235

$18.710

$18.340

$17.960

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Future Electronics

Canada . 1,619 parts In-Stock

1+ parts

$35.590

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$33.900

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1,619

$35.590

$33.900

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Farnell

UK . 105 parts In-Stock

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$36.550

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$27.200

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105

$36.550

$27.200

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Chip1Stop

Japan . 437 parts In-Stock

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$36.820

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$25.380

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437

$36.820

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Arrow

USA . 180 parts In-Stock

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$38.850

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180

$38.850

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Verical

USA . 180 parts In-Stock

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$38.850

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$38.850

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Mouser Electronics

USA . 678 parts In-Stock

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$57.190

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$41.480

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678

$57.190

$41.480

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DigiKey

USA . 421 parts In-Stock

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$57.190

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$42.661

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$41.470

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421

$57.190

$42.661

$41.470

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Newark

USA . 105 parts In-Stock

1+ parts

$57.730

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$42.470

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$41.870

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105

$57.730

$42.470

$41.870

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Element14

Singapore . 109 parts In-Stock

1+ parts

$65.960

100+ parts

$47.830

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109

$65.960

$47.830

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EBV Elektronik

Germany . 840 parts In-Stock

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Flip Electronics (Authorized)

USA . 200 parts In-Stock

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Avnet

USA . 60 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 3,807 parts In-Stock

1+ parts

$29.156

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3,807

$29.156

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Nova Conductors

Japan . 17 parts In-Stock

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$35.440

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17

$35.440

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IBS Electronics

USA . 300 parts In-Stock

1+ parts

$49.915

100+ parts

$47.545

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$48.344

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300

$49.915

$47.545

$48.344

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Chip Stock

USA . 3,900 parts In-Stock

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3,900

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Anansix

USA . 2,530 parts In-Stock

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2,530

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NAC Semi

USA . 1,200 parts In-Stock

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$50.570

10k+ parts

$46.680

1,200

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$50.570

$46.680

Flip Electronics

USA . 343 parts In-Stock

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343

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Vyrian

USA . 322 parts In-Stock

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322

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TME

Poland . 93 parts In-Stock

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$47.150

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93

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$47.150

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Zilex Electronics Inc.

Canada . 20 parts In-Stock

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20

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ComSIT Distribution GmbH

Germany . 19 parts In-Stock

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Prism Electronics

USA . 8 parts In-Stock

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J2 Sourcing AB

Sweden . 6 parts In-Stock

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Greenchips

USA . 6 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 3 parts In-Stock

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3

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Ack Elektronik San.Tic.Ltd.Sti

. 1 parts In-Stock

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1

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Distributors (Availability)

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Ampacity Inc.

Singapore . 123 parts In-Stock

1+ parts

$23.790

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123

$23.790

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Semicontronic

India . 77 parts In-Stock

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$26.090

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$25.438

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$25.307

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77

$26.090

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$25.307

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Corphita

USA . 402 parts In-Stock

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$27.621

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402

$27.621

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Component Stockers USA

USA . 1,964 parts In-Stock

1+ parts

$30.800

100+ parts

$29.340

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$29.340

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1,964

$30.800

$29.340

$29.340

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Continental Prestige Electronics

USA . 6,115 parts In-Stock

1+ parts

$34.667

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$33.974

6,115

$34.667

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$33.974

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$35.440

100+ parts

$34.731

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1,000

$35.440

$34.731

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Corohmni

South Africa . 66 parts In-Stock

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$36.960

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66

$36.960

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Aztec Data Supply Inc.

USA . 2,650 parts In-Stock

1+ parts

$37.636

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2,650

$37.636

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Modulus Dynamics

Lithuania . 200 parts In-Stock

1+ parts

$39.336

100+ parts

$38.943

1k+ parts

$37.763

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200

$39.336

$38.943

$37.763

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$64.289

100+ parts

$58.503

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$52.717

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50

$64.289

$58.503

$52.717

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Microchip USA

USA . 1,925 parts In-Stock

1+ parts

$105.639

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$105.639

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GreenTree Electronics

Israel . 31,280 parts In-Stock

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31,280

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iodParts Technologies Inc.

India . 8,037 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,314 parts In-Stock

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Perfect Parts

USA . 3,360 parts In-Stock

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UNI Independent Distributors

Spain . 2,709 parts In-Stock

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Argo Parts USA

USA . 2,587 parts In-Stock

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2,587

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Infinite Electronics LLP (Excess)

. 307 parts In-Stock

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307

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Authorized Procurement Solutions

USA . 300 parts In-Stock

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300

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Futuretech Components

Singapore . 248 parts In-Stock

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248

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Overview

Enhance your electronic designs with the MC9S12DG256CPVE microcontroller from NXP Semiconductors. Known for their top-quality products, NXP Semiconductors brings you a high-performing and reliable solution for a wide range of applications. With its advanced features and versatile capabilities, this microcontroller offers unparalleled value and benefits to customers looking to streamline their projects. Experience the advantages of cutting-edge technology and unleash the potential of your designs with the MC9S12DG256CPVE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the microcontroller package, ensuring long-term performance and protection against environmental factors.

Bit Size: 16

A 16-bit microcontroller allows for more complex operations and calculations compared to lower bit sizes, making it suitable for a wide range of applications that require higher processing capabilities.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand high temperatures, making it suitable for industrial applications where heat may be a concern.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows the microcontroller to convert analog signals into digital data, making it versatile for applications that require interfacing with analog sensors.

ROM Words: 262144

With a ROM capacity of 262144 words, this microcontroller has ample storage space for program code, enabling complex algorithms and functions to be implemented effectively.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable the microcontroller to generate variable-width pulses, making it suitable for applications such as motor control, LED dimming, and audio synthesis.

Technical Specifications

Microcontrollers MC9S12DG256CPVE attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

19

Bit Size:

16

CPU Family:

CPU12

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G112

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

91

No. of Terminals:

112

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP112,.87SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MC9S12DG256CPVE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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