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MC9S12XDP512CAG

NXP Semiconductors

MC9S12XDP512CAG by NXP Semiconductors

MC9S12XDP512CAG by NXP is a 16-bit microcontroller with 144 terminals, operating at up to 80 MHz. It features 32768 bytes of RAM, ADC and DMA channels, and flash ROM programmability. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

$37.002

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 94 parts In-Stock

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$25.800

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Farnell

UK . 194 parts In-Stock

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$29.740

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$23.810

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Arrow

USA . 4 parts In-Stock

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$32.170

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$32.170

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Mouser Electronics

USA . 58 parts In-Stock

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$51.790

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$38.680

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Newark

USA . 174 parts In-Stock

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$53.660

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$39.050

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Element14

Singapore . 711 parts In-Stock

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$62.160

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$42.910

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EBV Elektronik

Germany . 11,700 parts In-Stock

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Avnet

USA . 300 parts In-Stock

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Verical

USA . 300 parts In-Stock

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$37.002

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Distrelec

Netherlands . 40 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,275 parts In-Stock

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$30.590

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$30.590

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Nova Conductors

Japan . 50 parts In-Stock

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$34.321

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50

$34.321

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Component Electronics Inc.

Canada . 2 parts In-Stock

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$103.850

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$77.880

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$67.500

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$103.850

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Anansix

USA . 1,302 parts In-Stock

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Chip Stock

USA . 660 parts In-Stock

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TME

Poland . 340 parts In-Stock

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$43.500

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Flip Electronics

USA . 300 parts In-Stock

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Vyrian

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K-1 Technologies

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ComSIT Distribution GmbH

Germany . 35 parts In-Stock

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EZ Electronic Parts

Israel . 15 parts In-Stock

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Bristol Electronics

USA . 3 parts In-Stock

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Sensible Micro Corp

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Distributors (Availability)

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Corphita

USA . 2,508 parts In-Stock

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$28.980

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2,508

$28.980

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Semicontronic

India . 236 parts In-Stock

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$29.530

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$28.792

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$28.644

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$29.530

$28.792

$28.644

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Ampacity Inc.

Singapore . 29 parts In-Stock

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$29.530

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29

$29.530

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Modulus Dynamics

Lithuania . 2,769 parts In-Stock

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$34.236

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$34.236

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$34.236

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Corohmni

South Africa . 98 parts In-Stock

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$34.236

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Continental Prestige Electronics

USA . 2,466 parts In-Stock

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$34.320

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$33.634

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$35.263

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$33.500

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$33.500

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$35.263

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Aztec Data Supply Inc.

USA . 2,297 parts In-Stock

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$53.349

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Microchip USA

USA . 6,045 parts In-Stock

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$105.248

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iodParts Technologies Inc.

India . 6,882 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,341 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,272 parts In-Stock

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Robosynatics

Brazil . 1,431 parts In-Stock

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$33.551

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$32.867

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$32.867

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$33.551

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$32.867

Lucentia Tech

USA . 1,431 parts In-Stock

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$33.551

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$32.867

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$32.867

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$33.551

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$32.867

Infinite Electronics LLP (Excess)

. 1,202 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Perfect Parts

USA . 874 parts In-Stock

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UNI Independent Distributors

Spain . 679 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$33.635

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$32.605

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$31.919

50

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$33.635

$32.605

$31.919

Overview

Discover the cutting-edge MC9S12XDP512CAG microcontroller from NXP Semiconductors, a leading manufacturer known for top-quality products. This powerful device offers unmatched performance and reliability, making it perfect for a wide range of applications. With advanced features like ADC and DMA channels, as well as PWM capabilities, this microcontroller provides exceptional value to customers looking for high-speed processing and efficient operation. Trust NXP Semiconductors to deliver excellence with the MC9S12XDP512CAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this microcontroller lightweight and durable, ideal for applications where weight and ruggedness are important factors.

Surface Mount: YES

With the ability to be surface mounted, this microcontroller can easily be integrated onto a circuit board, saving space and making it a convenient choice for compact electronic designs.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V allows for a wide range of power supply options, making this microcontroller versatile and compatible with various power sources.

Package Shape: SQUARE

The square package shape provides a compact footprint, saving valuable board space and allowing for efficient placement of components in electronic designs.

Bit Size: 16

With a 16-bit size, this microcontroller offers high computational power and precision, making it suitable for tasks that require complex calculations and data processing.

Power Supplies (V): 2.5,5

This microcontroller is compatible with power supplies of 2.5V and 5V, offering flexibility and compatibility with different power sources commonly used in electronic devices.

No. of Terminals: 144

With 144 terminals, this microcontroller provides plenty of connection points for interfacing with external components, making it suitable for designs that require multiple inputs and outputs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style of this microcontroller allows for easy mounting, efficient use of board space, and compatibility with modern manufacturing processes.

Minimum Supply Voltage: 2.35 V

The minimum supply voltage of 2.35V ensures reliable operation even under low voltage conditions, making this microcontroller suitable for applications where power efficiency is crucial.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand high temperatures, making it suitable for use in industrial environments or where heat dissipation is a concern.

Technical Specifications

Microcontrollers MC9S12XDP512CAG attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

IT ALSO REQUIRES 5 V SUPPLY

Address Bus Width:

0

Bit Size:

16

CPU Family:

CPU12

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

119

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MC9S12XDP512CAG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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