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LPC54605J256ET180E

NXP Semiconductors

LPC54605J256ET180E by NXP Semiconductors

NXP Semiconductors LPC54605J256ET180E microcontroller features 32-bit CORTEX-M4 CPU, 14-bit address bus width, and 180 terminals. Ideal for applications requiring up to 25 MHz clock frequency, with peripherals like BOD, DMA(30), RTC, TIMER(8), WDT. Suitable for various uses including IoT devices and industrial automation systems.

Median Price

$11.290

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 176 parts In-Stock

1+ parts

$11.290

100+ parts

$8.212

1k+ parts

$6.988

10k+ parts

$6.834

176

$11.290

$8.212

$6.988

$6.834

Mouser Electronics

USA . 159 parts In-Stock

1+ parts

$12.750

100+ parts

$8.580

1k+ parts

$7.280

10k+ parts

-

159

$12.750

$8.580

$7.280

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Flip Electronics (Authorized)

USA . 1,843 parts In-Stock

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1,843

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Verical

USA . 898 parts In-Stock

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-

100+ parts

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$6.706

10k+ parts

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898

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-

$6.706

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,162 parts In-Stock

1+ parts

$9.272

100+ parts

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4,162

$9.272

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Vyrian

USA . 3,378 parts In-Stock

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3,378

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Anansix

USA . 2,834 parts In-Stock

1+ parts

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2,834

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Flip Electronics

USA . 898 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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898

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ComSIT Distribution GmbH

Germany . 207 parts In-Stock

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207

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Nova Conductors

Japan . 71 parts In-Stock

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71

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 675 parts In-Stock

1+ parts

$8.300

100+ parts

$8.092

1k+ parts

$8.051

10k+ parts

-

675

$8.300

$8.092

$8.051

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Ampacity Inc.

Singapore . 440 parts In-Stock

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$8.300

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440

$8.300

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Corohmni

South Africa . 73 parts In-Stock

1+ parts

$8.680

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73

$8.680

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Corphita

USA . 4,350 parts In-Stock

1+ parts

$8.784

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4,350

$8.784

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Vigor

Singapore . 4,994 parts In-Stock

1+ parts

$9.820

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4,994

$9.820

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Microchip USA

USA . 2,390 parts In-Stock

1+ parts

$34.940

100+ parts

$34.440

1k+ parts

$34.200

10k+ parts

$33.950

2,390

$34.940

$34.440

$34.200

$33.950

Aztec Data Supply Inc.

USA . 1,092 parts In-Stock

1+ parts

$47.262

100+ parts

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1,092

$47.262

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QUARKTWIN TECHNOLOGY LTD

USA . 12,396 parts In-Stock

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12,396

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Continental Prestige Electronics

USA . 6,956 parts In-Stock

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6,956

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Lixinc

USA . 3,842 parts In-Stock

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3,842

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UNI Independent Distributors

Spain . 2,071 parts In-Stock

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2,071

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Bastille Electronics

Australia . 600 parts In-Stock

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600

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Argo Parts USA

USA . 532 parts In-Stock

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532

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Overview

Unleash the power of innovation with the LPC54605J256ET180E by NXP Semiconductors. This top-of-the-line microcontroller offers unparalleled quality and reliability, backed by a trusted manufacturer renowned for cutting-edge technology. Ideal for a wide range of applications, this product delivers exceptional value with its advanced features and performance. Experience seamless connectivity, efficient operation, and endless possibilities with the LPC54605J256ET180E - the ultimate choice for those who demand excellence in their designs. Elevate your projects to new heights with this high-performance microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Easy for soldering and compact design.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options.

Address Bus Width: 14

Allows for efficient data retrieval and processing.

Package Shape: SQUARE

Space-saving and aesthetically pleasing.

Bit Size: 32

Higher processing capability and memory capacity.

No. of Terminals: 180

Sufficient connectivity options for peripherals.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

Allows for high-density packaging and efficient signal routing.

Minimum Supply Voltage: 1.71 V

Allows for low-power operation.

Maximum Operating Temperature: 85 °C

Suitable for a wide range of operating environments.

CPU Family: CORTEX-M4

Known for high performance and energy efficiency.

Minimum Operating Temperature: -40 °C

Suitable for harsh operating conditions.

ADC Channels: YES

Enables analog to digital conversion for sensor interactions.

DMA Channels: YES

Enhances data transfer efficiency for peripherals.

Terminal Position: BOTTOM

Facilitates easy board layout and component mounting.

ROM Words: 262144

Sufficient memory capacity for program storage.

Width: 12 mm

Compact size for space-constrained applications.

External Data Bus Width: 16

Supports fast data transfer between components.

Peripherals: BOD, DMA(30), RTC, TIMER(8), WDT

Provides a wide range of peripheral options for diverse applications.

Maximum Clock Frequency: 25 MHz

Enables fast operation and real-time data processing.

Peak Reflow Temperature °C: 260

Ensures reliability during the manufacturing process.

Length: 12 mm

Compact form factor for small design requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

Suitable for embedded system applications requiring high performance.

RAM Bytes: 139264

Sufficient memory for data storage and processing.

Terminal Form: BALL

Easy for soldering and durability.

Analog To Digital Convertors: 12-Ch 12-Bit

Supports multi-channel analog input conversion with high resolution.

Nominal Supply Voltage: 1.8 V

Ideal for low-power applications.

PWM Channels: YES

Enables precise control of analog outputs.

Connectivity: I2C(10), I2S(10), SPI(10), USART(10), USB(2)

Versatile communication interfaces for connectivity with external devices.

ROM Programmability: FLASH

Allows for flexibility in program storage and updates.

Terminal Pitch: 0.8 mm

Suitable for high-density mounting and compact PCB design.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure.

Speed: 180 rpm

Suitable for applications requiring fast data processing.

On Chip Program ROM Width: 8

Efficient storage of program code on the chip.

No. of I/O Lines: 145

Provides ample input/output options for peripheral connectivity.

Technical Specifications

Microcontrollers LPC54605J256ET180E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

14

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

145

No. of Terminals:

180

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

139264

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(10), I2S(10), SPI(10), USART(10), USB(2)

Peripherals:

BOD, DMA(30), RTC, TIMER(8), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LPC54605J256ET180E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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