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LPC55S14JBD64E

NXP Semiconductors

LPC55S14JBD64E by NXP Semiconductors

LPC55S14JBD64E by NXP Semiconductors is a 32-bit microcontroller with a max clock frequency of 32 MHz. It features 10 ADC channels, DMA channels, and 10-Ch 16-Bit analog to digital converters. Ideal for applications requiring low power consumption and high-speed processing in industrial automation, IoT devices, and consumer electronics.

Median Price

$5.248

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 480 parts In-Stock

1+ parts

$2.650

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480

$2.650

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Farnell

UK . 238 parts In-Stock

1+ parts

$3.010

100+ parts

$2.620

1k+ parts

$2.430

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238

$3.010

$2.620

$2.430

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Arrow

USA . 1,920 parts In-Stock

1+ parts

$5.248

100+ parts

$3.286

1k+ parts

$3.012

10k+ parts

$2.840

1,920

$5.248

$3.286

$3.012

$2.840

Mouser Electronics

USA . 359 parts In-Stock

1+ parts

$5.770

100+ parts

$3.770

1k+ parts

$3.090

10k+ parts

$2.950

359

$5.770

$3.770

$3.090

$2.950

Element14

Singapore . 338 parts In-Stock

1+ parts

$6.790

100+ parts

$4.593

1k+ parts

$4.497

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338

$6.790

$4.593

$4.497

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Verical

USA . 9,920 parts In-Stock

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$5.248

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$5.248

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Avnet

USA . 320 parts In-Stock

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320

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Distributors (In-Stock)

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Digiode

USA . 1,109 parts In-Stock

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$2.118

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$2.118

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Nova Conductors

Japan . 600 parts In-Stock

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$4.103

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600

$4.103

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Flip Electronics

USA . 9,600 parts In-Stock

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9,600

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Vyrian

USA . 2,731 parts In-Stock

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Anansix

USA . 563 parts In-Stock

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563

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Distributors (Availability)

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Semicontronic

India . 329 parts In-Stock

1+ parts

$1.770

100+ parts

$1.726

1k+ parts

$1.717

10k+ parts

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329

$1.770

$1.726

$1.717

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Ampacity Inc.

Singapore . 213 parts In-Stock

1+ parts

$1.770

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213

$1.770

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Corphita

USA . 4,877 parts In-Stock

1+ parts

$2.007

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4,877

$2.007

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Bastille Electronics

Australia . 795 parts In-Stock

1+ parts

$4.103

100+ parts

$3.898

1k+ parts

$3.703

10k+ parts

$3.652

795

$4.103

$3.898

$3.703

$3.652

Argo Parts USA

USA . 1,087 parts In-Stock

1+ parts

$4.103

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1,087

$4.103

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Continental Prestige Electronics

USA . 185 parts In-Stock

1+ parts

$5.350

100+ parts

$3.360

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185

$5.350

$3.360

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Vigor

Singapore . 160 parts In-Stock

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$6.120

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160

$6.120

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Microchip USA

USA . 2,455 parts In-Stock

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$20.692

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2,455

$20.692

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Aztec Data Supply Inc.

USA . 2,452 parts In-Stock

1+ parts

$47.010

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2,452

$47.010

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Corohmni

South Africa . 117 parts In-Stock

1+ parts

$48.161

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117

$48.161

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Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$72.162

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$68.554

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$68.554

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750

$72.162

$68.554

$68.554

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UNI Independent Distributors

Spain . 4,121 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Discover the LPC55S14JBD64E by NXP Semiconductors, a top-tier microcontroller that embodies quality and innovation. With a powerful CORTEX-M33 CPU family, this device offers a wide range of peripherals including PWM, RTC, and DMA channels for unparalleled performance in various applications. From industrial automation to IoT devices, this microcontroller delivers exceptional value with its high-speed processing capabilities, robust connectivity options, and efficient power consumption. Elevate your projects with the LPC55S14JBD64E and experience the difference that superior technology can make.

Feature Benefit Bullets

Surface Mount YES

Surface mount technology allows for a compact design, making it suitable for small electronic devices.

Maximum Supply Voltage 3.6 V

Support for up to 3.6V supply voltage provides flexibility in power requirements for various applications.

Package Shape SQUARE

Square package shape allows for efficient use of board space and easy placement on a PCB.

Bit Size 32

32-bit architecture enables faster processing and better performance compared to lower bit microcontrollers.

No. of Terminals 64

Higher number of terminals provides more connectivity options and interfaces for peripherals.

Package Style (Meter) FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style ensure space-saving and high-density PCB design.

Minimum Supply Voltage 1.8 V

Support for low supply voltage of 1.8V makes it suitable for battery-powered applications.

Maximum Operating Temperature 105 °C

High maximum operating temperature allows the device to function reliably in harsh environments.

CPU Family CORTEX-M33

Based on the advanced Cortex-M33 architecture, offering high performance and energy efficiency.

Minimum Operating Temperature -40 °C

Low minimum operating temperature enables operation in extreme cold conditions without any issues.

Terminal Finish TIN

Tin terminal finish offers good electrical conductivity and corrosion resistance.

ADC Channels YES

Built-in ADC channels allow for analog signal processing, making it suitable for sensor applications.

DMA Channels YES

DMA channels enhance data transfer efficiency and reduce CPU load for optimized performance.

Terminal Position QUAD

Quad terminal position simplifies PCB layout and offers good mechanical stability.

ROM Words 131072

Large ROM size of 131072 words provides ample memory for program storage and data handling.

Width 10 mm

Compact width of 10mm enables integration into space-constrained applications.

Peripherals BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Wide range of peripherals including PWM, ADC, timers, and communication interfaces enhance versatility and functionality.

Maximum Clock Frequency 32 MHz

High maximum clock frequency of 32 MHz supports fast processing and real-time operations.

Maximum Time At Peak Reflow Temperature (s) 30

Short reflow time of 30 seconds at peak temperature ensures reliable solder connections during assembly.

Peak Reflow Temperature °C 260

High peak reflow temperature of 260°C ensures proper soldering and robust connections.

Length 10 mm

Compact length of 10mm enables easy integration into small form factor devices.

Peripheral IC Type MICROCONTROLLER, RISC

RISC architecture and microcontroller type make it suitable for fast and efficient processing tasks.

RAM Bytes 81920

Large RAM size of 81920 bytes enables efficient data handling and multitasking capabilities.

Terminal Form GULL WING

Gull wing terminal form provides good mechanical strength and reliability for solder joints.

Analog To Digital Convertors 10-Ch 16-Bit

Multiple 16-bit ADC converters enable accurate and high-resolution analog to digital conversion for precise measurements.

Nominal Supply Voltage 3 V

Stable nominal supply voltage of 3V ensures consistent and reliable operation.

PWM Channels YES

Support for PWM channels allows for precise control of motor speed, dimming control, and other applications.

Connectivity I2C, I2S, CAN, SPI, UART, USART, USB

Versatile connectivity options including I2C, SPI, CAN, and USB make it compatible with various communication protocols and interfaces.

ROM Programmability FLASH

Flash ROM is programmable, allowing for easy updates and customization of firmware.

Terminal Pitch 0.5 mm

Fine terminal pitch of 0.5mm enables high-density PCB layout and space-saving design.

Moisture Sensitivity Level (MSL) 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard assembly and storage conditions.

Speed 150 rpm

Operating speed of 150 rpm enables efficient data processing and response times for real-time applications.

On Chip Program ROM Width 8

8-bit on-chip program ROM width provides efficient storage and retrieval of program instructions.

No. of I/O Lines 36

Abundance of I/O lines allows for versatile connectivity and peripheral interfacing for various applications.

Technical Specifications

Microcontrollers LPC55S14JBD64E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

81920

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

150 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, CAN, SPI, UART, USART, USB

Peripherals:

BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Analog To Digital Convertors:

10-Ch 16-Bit

Trade Compliance

LPC55S14JBD64E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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