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LPC55S16JBD64E

NXP Semiconductors

LPC55S16JBD64E by NXP Semiconductors

NXP Semiconductors' LPC55S16JBD64E is a 32-bit microcontroller with Cortex-M33 CPU, offering 262144 ROM words and 98304 RAM bytes. It features 10-Ch 16-Bit ADC channels, PWM support, and various peripherals like BOD, CRC, and RTC. Ideal for applications requiring high-speed processing up to 32 MHz in a compact square package with low profile design.

Median Price

$6.050

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 6 parts In-Stock

1+ parts

$4.830

100+ parts

$3.010

1k+ parts

$2.900

10k+ parts

-

6

$4.830

$3.010

$2.900

-

Chip1Stop

Japan . 210 parts In-Stock

1+ parts

$6.030

100+ parts

$3.810

1k+ parts

$3.430

10k+ parts

$3.290

210

$6.030

$3.810

$3.430

$3.290

Arrow

USA . 75 parts In-Stock

1+ parts

$6.050

100+ parts

$3.850

1k+ parts

$3.619

10k+ parts

$3.462

75

$6.050

$3.850

$3.619

$3.462

Mouser Electronics

USA . 2,949 parts In-Stock

1+ parts

$6.170

100+ parts

$3.870

1k+ parts

$3.860

10k+ parts

$3.760

2,949

$6.170

$3.870

$3.860

$3.760

DigiKey

USA . 141 parts In-Stock

1+ parts

$6.170

100+ parts

$4.368

1k+ parts

$3.633

10k+ parts

$3.473

141

$6.170

$4.368

$3.633

$3.473

Newark

USA . 4 parts In-Stock

1+ parts

$6.230

100+ parts

$4.070

1k+ parts

$3.770

10k+ parts

-

4

$6.230

$4.070

$3.770

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Element14

Singapore . 6 parts In-Stock

1+ parts

$7.700

100+ parts

$5.890

1k+ parts

$5.240

10k+ parts

-

6

$7.700

$5.890

$5.240

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Verical

USA . 3,600 parts In-Stock

1+ parts

-

100+ parts

$3.837

1k+ parts

$3.438

10k+ parts

$3.225

3,600

-

$3.837

$3.438

$3.225

Rochester

USA . 3,600 parts In-Stock

1+ parts

-

100+ parts

$3.070

1k+ parts

$2.750

10k+ parts

$2.580

3,600

-

$3.070

$2.750

$2.580

Avnet

USA . 640 parts In-Stock

1+ parts

-

100+ parts

-

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-

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640

-

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Flip Electronics (Authorized)

USA . 72 parts In-Stock

1+ parts

-

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-

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72

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,944 parts In-Stock

1+ parts

$3.230

100+ parts

-

1k+ parts

-

10k+ parts

-

4,944

$3.230

-

-

-

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$5.570

100+ parts

-

1k+ parts

-

10k+ parts

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450

$5.570

-

-

-

Flip Electronics

USA . 12,872 parts In-Stock

1+ parts

-

100+ parts

-

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12,872

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Vyrian

USA . 863 parts In-Stock

1+ parts

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863

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Anansix

USA . 541 parts In-Stock

1+ parts

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541

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 862 parts In-Stock

1+ parts

$2.890

100+ parts

$2.818

1k+ parts

$2.803

10k+ parts

-

862

$2.890

$2.818

$2.803

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Ampacity Inc.

Singapore . 690 parts In-Stock

1+ parts

$2.890

100+ parts

-

1k+ parts

-

10k+ parts

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690

$2.890

-

-

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Corphita

USA . 340 parts In-Stock

1+ parts

$3.060

100+ parts

-

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-

10k+ parts

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340

$3.060

-

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Continental Prestige Electronics

USA . 167 parts In-Stock

1+ parts

$5.010

100+ parts

$2.760

1k+ parts

-

10k+ parts

-

167

$5.010

$2.760

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-

Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

$5.570

100+ parts

$5.292

1k+ parts

$5.027

10k+ parts

$4.957

200

$5.570

$5.292

$5.027

$4.957

Vigor

Singapore . 1,773 parts In-Stock

1+ parts

$7.210

100+ parts

-

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-

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1,773

$7.210

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$19.905

100+ parts

$18.910

1k+ parts

$18.910

10k+ parts

-

500

$19.905

$18.910

$18.910

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Corohmni

South Africa . 429 parts In-Stock

1+ parts

$66.932

100+ parts

-

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-

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429

$66.932

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Aztec Data Supply Inc.

USA . 3,686 parts In-Stock

1+ parts

$67.590

100+ parts

-

1k+ parts

-

10k+ parts

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3,686

$67.590

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Infinite Electronics LLP (Excess)

. 5,449 parts In-Stock

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5,449

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iodParts Technologies Inc.

India . 5,354 parts In-Stock

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5,354

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UNI Independent Distributors

Spain . 3,858 parts In-Stock

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3,858

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Robosynatics

Brazil . 2,581 parts In-Stock

1+ parts

-

100+ parts

$33.770

1k+ parts

$33.081

10k+ parts

$33.081

2,581

-

$33.770

$33.081

$33.081

Lucentia Tech

USA . 2,581 parts In-Stock

1+ parts

-

100+ parts

$33.770

1k+ parts

$33.081

10k+ parts

$33.081

2,581

-

$33.770

$33.081

$33.081

Argo Parts USA

USA . 1,819 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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1,819

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Overview

Unlock the power of cutting-edge technology with the LPC55S16JBD64E microcontroller by NXP Semiconductors. Designed for optimal performance and reliability, this innovative device is perfect for a wide range of applications. From IoT devices to automotive systems, the LPC55S16JBD64E delivers unparalleled speed and efficiency, ensuring seamless operation in any environment. Trust NXP Semiconductors to provide top-of-the-line quality and unmatched expertise in the field of microcontrollers. Upgrade your projects today with the LPC55S16JBD64E and experience the difference for yourself. Elevate your designs with NXP Semiconductors.

Feature Benefit Bullets

Surface Mount: YES

Surface Mount allows for easy and secure installation on PCBs, making it convenient for assembly in electronic devices.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage provides flexibility in power supply options for the microcontroller.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the PCB layout.

Bit Size: 32

32-bit architecture allows for higher processing speed and system performance.

No. of Terminals: 64

Ample number of terminals enable connectivity to various external components for enhanced functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style facilitates compact design and efficient thermal management.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage enables power-efficient operation and extends battery life in portable electronic devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

CPU Family: CORTEX-M33

The Cortex-M33 CPU family offers advanced processing capabilities for computing-intensive applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in extreme cold environments without compromising performance.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability for reliable connections.

ADC Channels: YES

Integrated ADC channels enable analog signal conversion for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels enhance data transfer speeds and offload CPU processing for improved system efficiency.

Terminal Position: QUAD

Quad terminal position simplifies PCB routing and assembly for streamlined manufacturing.

ROM Words: 262144

Large ROM size allows for storing extensive program code and data for complex applications.

Width: 10 mm

Compact width dimensions save space on the PCB and enable integration in small form factor devices.

Peripherals: BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Rich set of peripherals offer versatile connectivity options and support for various functions to meet diverse application requirements.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency ensures fast processing speed for real-time applications and rapid response times.

Maximum Time At Peak Reflow Temperature (s): 30

Ample time at peak reflow temperature allows for reliable solder joints during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder melting and joint formation for robust connections.

Length: 10 mm

Minimal length dimensions aid in space-saving designs and compact product form factors.

Technical Specifications

Microcontrollers LPC55S16JBD64E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

150 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, CAN, SPI, UART, USART, USB

Peripherals:

BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Analog To Digital Convertors:

10-Ch 16-Bit

Trade Compliance

LPC55S16JBD64E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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