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LPC54618J512ET180E

NXP Semiconductors

LPC54618J512ET180E by NXP Semiconductors

NXP Semiconductors' LPC54618J512ET180E microcontroller features a 32-bit Cortex-M4 CPU, 12 ADC channels, and 163840 bytes of RAM. With connectivity options like CAN, Ethernet, and USB, it is ideal for applications requiring high-speed processing and multiple peripherals. Operating b/w -40°C to 85°C with a max clock frequency of 25 MHz, this microcontroller is suitable for industrial automation and IoT devices.

Median Price

$13.678

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 1,867 parts In-Stock

1+ parts

$11.175

100+ parts

$8.502

1k+ parts

$8.338

10k+ parts

-

1,867

$11.175

$8.502

$8.338

-

Farnell

UK . 643 parts In-Stock

1+ parts

$11.760

100+ parts

$7.560

1k+ parts

$7.240

10k+ parts

-

643

$11.760

$7.560

$7.240

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Chip1Stop

Japan . 268 parts In-Stock

1+ parts

$12.358

100+ parts

$7.494

1k+ parts

-

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268

$12.358

$7.494

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-

Arrow

USA . 97 parts In-Stock

1+ parts

$13.678

100+ parts

$8.501

1k+ parts

$7.822

10k+ parts

-

97

$13.678

$8.501

$7.822

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Verical

USA . 97 parts In-Stock

1+ parts

$13.678

100+ parts

$8.501

1k+ parts

$7.822

10k+ parts

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97

$13.678

$8.501

$7.822

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Newark

USA . 643 parts In-Stock

1+ parts

$14.710

100+ parts

$9.450

1k+ parts

$9.050

10k+ parts

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643

$14.710

$9.450

$9.050

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Mouser Electronics

USA . 203 parts In-Stock

1+ parts

$15.550

100+ parts

$10.000

1k+ parts

$9.320

10k+ parts

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203

$15.550

$10.000

$9.320

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,526 parts In-Stock

1+ parts

$9.282

100+ parts

-

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-

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4,526

$9.282

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Nova Conductors

Japan . 66 parts In-Stock

1+ parts

$10.325

100+ parts

-

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66

$10.325

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Vyrian

USA . 12,524 parts In-Stock

1+ parts

-

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12,524

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Chip Stock

USA . 2,634 parts In-Stock

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2,634

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Anansix

USA . 278 parts In-Stock

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278

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Distributors (Availability)

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Corphita

USA . 3,986 parts In-Stock

1+ parts

$8.793

100+ parts

-

1k+ parts

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3,986

$8.793

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Ampacity Inc.

Singapore . 1,503 parts In-Stock

1+ parts

$9.200

100+ parts

-

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1,503

$9.200

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Semicontronic

India . 1,457 parts In-Stock

1+ parts

$9.200

100+ parts

$8.970

1k+ parts

$8.924

10k+ parts

-

1,457

$9.200

$8.970

$8.924

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Netroflash

USA . 500 parts In-Stock

1+ parts

$10.325

100+ parts

-

1k+ parts

$9.808

10k+ parts

$9.602

500

$10.325

-

$9.808

$9.602

Continental Prestige Electronics

USA . 945 parts In-Stock

1+ parts

$12.330

100+ parts

$7.810

1k+ parts

-

10k+ parts

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945

$12.330

$7.810

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Microchip USA

USA . 2,271 parts In-Stock

1+ parts

$26.410

100+ parts

$26.030

1k+ parts

$25.840

10k+ parts

$25.650

2,271

$26.410

$26.030

$25.840

$25.650

Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$31.095

100+ parts

$29.540

1k+ parts

$29.540

10k+ parts

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870

$31.095

$29.540

$29.540

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Modulus Dynamics

Lithuania . 2,229 parts In-Stock

1+ parts

$49.325

100+ parts

$49.325

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$49.325

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2,229

$49.325

$49.325

$49.325

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Corohmni

South Africa . 123 parts In-Stock

1+ parts

$66.764

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123

$66.764

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Aztec Data Supply Inc.

USA . 4,630 parts In-Stock

1+ parts

$83.490

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4,630

$83.490

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Lixinc

USA . 10,052 parts In-Stock

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10,052

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Futuretech Components

Singapore . 3,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,678 parts In-Stock

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2,678

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Argo Parts USA

USA . 2,475 parts In-Stock

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2,475

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Overview

Unleash the power of cutting-edge technology with the LPC54618J512ET180E by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality microcontrollers that are versatile and reliable. Ideal for a wide range of applications, this product offers unparalleled value to customers, providing advanced features, high performance, and seamless connectivity. Elevate your projects with the LPC54618J512ET180E and experience the innovative solutions that NXP Semiconductors brings to the table.

Feature Benefit Bullets

Surface Mount: YES

SMT components are easier to manufacture, assemble and are more reliable compared to through-hole components.

Maximum Supply Voltage: 3.6 V

Can handle a wide range of supply voltages, making it versatile for different applications.

Address Bus Width: 14

Allows for larger memory addressing capabilities, which is useful for complex applications.

Package Shape: SQUARE

Square package shape is easier to handle during assembly and can be more space-efficient.

Bit Size: 32

32-bit architecture provides higher processing power and efficiency compared to lower bit sizes.

No. of Terminals: 180

Large number of terminals allow for more connectivity options and peripheral attachments.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array package style provides better thermal and electrical performance, while thin profile and fine pitch save space.

Minimum Supply Voltage: 1.71 V

Can operate at low supply voltages, making it suitable for power-sensitive applications.

Maximum Operating Temperature: 85 °C

Operates reliably at high temperatures, ideal for industrial and automotive applications.

CPU Family: CORTEX-M4

Cortex-M4 architecture offers high performance and efficiency for embedded applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, suitable for a wide range of environments.

ADC Channels: YES

Analog-to-Digital Converters allow the microcontroller to interface with analog sensors and devices.

DMA Channels: YES

Direct Memory Access channels improve data transfer speeds and reduce CPU load during data transfers.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly.

ROM Words: 524288

Large ROM size allows for storing firmware and program data in the microcontroller.

Width: 12 mm

Compact size makes it suitable for space-constrained applications.

External Data Bus Width: 16

16-bit external data bus provides faster data transfer rates for external memory access.

Peripherals: BOD, DMA(30), RTC, TIMER(8), WDT

Rich set of peripherals provide additional functionality and features for diverse applications.

Maximum Clock Frequency: 25 MHz

Operates at high clock frequencies for swift data processing and task execution.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes during manufacturing.

Length: 12 mm

Symmetrical dimensions facilitate uniform placement on PCBs and enhance thermal management.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient and optimized instruction execution for faster processing.

RAM Bytes: 163840

Large RAM size enables efficient data storage and manipulation during program execution.

Terminal Form: BALL

Ball terminal form simplifies soldering and ensures reliable electrical connections.

Analog To Digital Convertors: 12-Ch 12-Bit

Multiple ADC channels with high resolution for accurate analog signal acquisition.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage for consistent performance across operating conditions.

PWM Channels: YES

Pulse Width Modulation channels for precise control over analog outputs, suitable for motor control and power management.

Connectivity: CAN, ETHERNET, I2C(10), I2S(10), SPI(10), USART(10), USB(2)

A variety of connectivity options provide versatile communication interfaces for different devices and protocols.

ROM Programmability: FLASH

Flash-ROM allows for easy and efficient programming and updating of firmware and application code.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density mounting and connectivity on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL rating indicates the sensitivity of the component to moisture during storage and handling.

Speed: 180 rpm

Operates at a moderate speed suitable for various real-time control and processing applications.

On Chip Program ROM Width: 8

Dedicated on-chip ROM for storing boot code and critical program instructions.

No. of I/O Lines: 145

Abundant I/O lines for interfacing with external sensors, actuators, and peripherals for comprehensive system control.

Technical Specifications

Microcontrollers LPC54618J512ET180E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

14

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

145

No. of Terminals:

180

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

163840

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, ETHERNET, I2C(10), I2S(10), SPI(10), USART(10), USB(2)

Peripherals:

BOD, DMA(30), RTC, TIMER(8), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LPC54618J512ET180E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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