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LPC54608J512BD208E

NXP Semiconductors

LPC54608J512BD208E by NXP Semiconductors

NXP Semiconductors' LPC54608J512BD208E microcontroller features a 32-bit CORTEX-M4 CPU, 12-Ch 12-Bit ADC, and 171 I/O lines. With CAN, ETHERNET, USB(2), and more connectivity options, it's ideal for applications requiring high-speed data processing and multiple peripherals. Operating b/w -40 to 85 °C, this MCU is suitable for industrial automation and IoT devices.

Median Price

$7.375

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Adafruit Industries

USA . 600 parts In-Stock

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$6.181

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$6.181

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$6.181

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$6.181

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Arrow

USA . 358 parts In-Stock

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$7.375

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Verical

USA . 358 parts In-Stock

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358

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Distributors (In-Stock)

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Digiode

USA . 4,794 parts In-Stock

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$5.872

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Nova Conductors

Japan . 15 parts In-Stock

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$6.061

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Chip Stock

USA . 8,700 parts In-Stock

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Vyrian

USA . 3,818 parts In-Stock

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Anansix

USA . 1,753 parts In-Stock

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Flip Electronics

USA . 1,584 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 377 parts In-Stock

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$5.250

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Corphita

USA . 2,373 parts In-Stock

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$5.563

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Corohmni

South Africa . 72 parts In-Stock

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$6.060

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Continental Prestige Electronics

USA . 4,259 parts In-Stock

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$6.061

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$5.939

4,259

$6.061

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$5.939

Advanced Electronics

New Zealand . 600 parts In-Stock

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$6.181

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$6.181

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Vigor

Singapore . 2,389 parts In-Stock

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$9.310

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Semicontronic

India . 281 parts In-Stock

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$11.430

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$11.144

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$11.087

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AZTECH Wire

Italy . 269 parts In-Stock

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$11.720

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Aztec Data Supply Inc.

USA . 991 parts In-Stock

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$27.040

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Microchip USA

USA . 2,719 parts In-Stock

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UNI Independent Distributors

Spain . 4,093 parts In-Stock

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Lixinc

USA . 929 parts In-Stock

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Argo Parts USA

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Netroflash

USA . 500 parts In-Stock

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$5.757

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$5.636

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Perfect Parts

USA . 7 parts In-Stock

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Overview

Unleash the power of innovation with the LPC54608J512BD208E by NXP Semiconductors. As a leader in microcontrollers, NXP delivers cutting-edge technology that exceeds expectations. This versatile device opens up endless possibilities across various applications, providing unparalleled performance and reliability. Experience seamless connectivity and advanced features while maximizing efficiency and productivity. Elevate your projects with the LPC54608J512BD208E and stay ahead in the fast-paced world of technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability makes it easier to integrate into PCB designs and saves space on the board.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in the power supply design.

Address Bus Width: 14

A wider address bus allows for larger memory addressing capabilities, enabling more complex applications.

Package Shape: SQUARE

Square package shape facilitates easier placement on the PCB and allows for efficient use of space.

Bit Size: 32

32-bit architecture enables faster processing speeds and enhanced computational capabilities.

No. of Terminals: 208

Large number of terminals provide ample connectivity options for peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers compact size, low profile, and fine pitch for high-density mounting and space efficiency.

Minimum Supply Voltage: 1.71 V

Support for low supply voltages allows for energy-efficient operation and extended battery life.

Maximum Operating Temperature: 85 °C

Operates reliably at high temperatures, making it suitable for industrial and automotive applications.

CPU Family: CORTEX-M4

Utilizes efficient Cortex-M4 architecture for optimized performance and power efficiency.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, suitable for outdoor or harsh environments.

ADC Channels: YES

Integrated ADC channels enable analog sensor interfacing and signal processing capabilities.

DMA Channels: YES

DMA channels enhance data transfer speeds and offload CPU for improved system performance.

Terminal Position: QUAD

Quad terminal position ensures stable and secure connections for reliable operation.

ROM Words: 524288

Large ROM capacity allows for extensive program storage and firmware flexibility.

Width: 28 mm

Compact width facilitates space-saving PCB layout designs and integration into tight spaces.

External Data Bus Width: 16

16-bit external data bus width enables fast data transfer between the microcontroller and external peripherals.

Peripherals: BOD, DMA(30), RTC, TIMER(8), WDT

Rich set of integrated peripherals like Brownout Detector, DMA, Real-Time Clock, Timer, and Watchdog Timer for enhanced functionality.

Maximum Clock Frequency: 25 MHz

Supports high clock frequencies for fast processing speeds and real-time operation requirements.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the reflow soldering process for robust assembly.

Length: 28 mm

Compact length enables easy placement on the PCB and efficient use of board space.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers enhanced performance and efficiency for embedded systems.

RAM Bytes: 163840

Ample RAM capacity for data storage and processing, supporting multitasking and complex algorithms.

Terminal Form: GULL WING

Gull wing terminal form provides reliable soldering connections for durability and long-term performance.

Analog To Digital Convertors: 12-Ch 12-Bit

12-channel 12-bit ADCs enable precise analog-to-digital conversions for sensor interfacing and data acquisition.

Nominal Supply Voltage: 1.8 V

Nominal supply voltage of 1.8V ensures compatibility with standard power sources and efficient power consumption.

PWM Channels: YES

Integrated PWM channels for precise control of analog outputs and motor control applications.

Connectivity: CAN, ETHERNET, I2C(10), I2S(10), SPI(10), USART(10), USB(2)

Multiple connectivity options including CAN, Ethernet, I2C, I2S, SPI, USART, and USB for versatile communication interfaces.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible firmware updates and field programming capabilities.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm for high-density mounting and miniaturization in electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture during storage and handling, requiring standard precautions.

Speed: 180 rpm

Operates at a speed of 180 rotations per minute for consistent performance in motor control applications.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width for efficient program storage and execution.

No. of I/O Lines: 171

Abundant I/O lines provide ample connectivity options for interfacing with external sensors, actuators, and peripherals.

Technical Specifications

Microcontrollers LPC54608J512BD208E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

14

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

171

No. of Terminals:

208

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

163840

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, ETHERNET, I2C(10), I2S(10), SPI(10), USART(10), USB(2)

Peripherals:

BOD, DMA(30), RTC, TIMER(8), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LPC54608J512BD208E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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