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TM4C123GH6PZI7R

Texas Instruments

TM4C123GH6PZI7R by Texas Instruments

TM4C123GH6PZI7R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 22-Ch 12-Bit ADC channels and 32 DMA channels. Ideal for industrial applications, it features a max clock frequency of 25 MHz and peripherals like PWM(16) and UART(8).

Median Price

$16.940

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,331 parts In-Stock

1+ parts

$16.940

100+ parts

$10.870

1k+ parts

$10.380

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1,331

$16.940

$10.870

$10.380

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Distributors (In-Stock)

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Nova Conductors

Japan . 73 parts In-Stock

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$8.341

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73

$8.341

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Cyclops Electronics Ltd

UK . 8,001 parts In-Stock

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Chip Stock

USA . 6,775 parts In-Stock

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Vyrian

USA . 2,482 parts In-Stock

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Digiode

USA . 2,476 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 884 parts In-Stock

1+ parts

$7.310

100+ parts

$7.127

1k+ parts

$7.091

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884

$7.310

$7.127

$7.091

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Ampacity Inc.

Singapore . 828 parts In-Stock

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$7.310

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828

$7.310

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Continental Prestige Electronics

USA . 240 parts In-Stock

1+ parts

$7.993

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$7.834

240

$7.993

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$7.834

Netroflash

USA . 100 parts In-Stock

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$8.341

100+ parts

-

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$7.924

10k+ parts

$7.757

100

$8.341

-

$7.924

$7.757

Modulus Dynamics

Lithuania . 64 parts In-Stock

1+ parts

$9.258

100+ parts

$9.165

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$8.888

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64

$9.258

$9.165

$8.888

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AZTECH Wire

Italy . 869 parts In-Stock

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$18.831

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869

$18.831

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Microchip USA

USA . 2,302 parts In-Stock

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$20.460

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$20.170

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$20.020

10k+ parts

$19.880

2,302

$20.460

$20.170

$20.020

$19.880

Corohmni

South Africa . 192 parts In-Stock

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$47.852

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192

$47.852

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Parana Technologies

USA . 1,530 parts In-Stock

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$48.177

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1,530

$48.177

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DigiPath Technology Company

USA . 187 parts In-Stock

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$53.049

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$48.805

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187

$53.049

$48.805

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ChromeModa Solutions

Germany . 4,590 parts In-Stock

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$54.132

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$44.388

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$54.132

$44.388

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IDEA Electronic Components Group

UK . 1,696 parts In-Stock

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$54.132

100+ parts

$51.425

1k+ parts

$48.719

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1,696

$54.132

$51.425

$48.719

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$58.423

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$55.501

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$55.501

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$55.501

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QUARKTWIN TECHNOLOGY LTD

USA . 10,101 parts In-Stock

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Lixinc

USA . 9,645 parts In-Stock

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Perfect Parts

USA . 6,720 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,228 parts In-Stock

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Corphita

USA . 1,550 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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$0.360

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$0.360

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$0.360

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Kepictronics

USA . 46 parts In-Stock

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Argo Parts USA

USA . 31 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments TM4C123GH6PZI7R microcontroller, a high-quality product from a trusted manufacturer. Ideal for applications in various industries, this microcontroller offers integrated cache, DMA channels, and ADC channels for seamless performance. With a maximum clock frequency of 25 MHz and low power mode, customers can enjoy efficient operation and extended battery life. Experience the value and reliability of Texas Instruments with the TM4C123GH6PZI7R microcontroller, bringing innovation to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, ensuring the product is long-lasting.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 3.63 V

Allows for a higher voltage input, providing flexibility in power supply options.

Surface Mount: YES

Facilitates easy installation on PCBs, saving space and reducing assembly time.

CPU Family: CORTEX-M4F

Features a powerful Cortex-M4F processor architecture for efficient and fast operation.

ROM Programmability: FLASH

Offers reprogrammable ROM, allowing for updates and modifications to the program code.

Analog To Digital Convertors: 22-Ch 12-Bit

Provides multiple ADC channels with high resolution for accurate analog to digital conversion.

Connectivity: CAN(2), I2C(6), SSI(4), UART(8), USB

Supports various communication protocols for versatile connectivity options.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient processing and control of peripherals.

No. of I/O Lines: 69

Offers a high number of input/output lines for connecting external devices and peripherals.

Technical Specifications

Microcontrollers TM4C123GH6PZI7R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

69

No. of Serial I/Os:

21

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

54.9 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

CAN(2), I2C(6), SSI(4), UART(8), USB

Peripherals:

DMA(32), PWM(16), QEI(2), TIMER(12), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Trade Compliance

TM4C123GH6PZI7R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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