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TM4C129ENCPDTI3R

Texas Instruments

TM4C129ENCPDTI3R by Texas Instruments

TM4C129ENCPDTI3R by Texas Instruments is a 32-bit microcontroller with integrated cache and a max clock frequency of 25 MHz. It offers connectivity options such as CAN, Ethernet, I2C, SPI, UART, and USB. This microcontroller is commonly used in industrial applications due to its low power mode and temperature grade suitable for harsh environments.

Median Price

$25.850

Lifecycle Status

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12

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1k+

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Texas Instruments

USA . 7,032 parts In-Stock

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$14.032

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$12.257

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$8.453

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Mouser Electronics

USA . 1,803 parts In-Stock

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$25.850

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$18.320

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DigiKey

USA . 1,509 parts In-Stock

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Digiode

USA . 631 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Cyclops Electronics Ltd

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Chip Stock

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Vyrian

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Component Sense

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Bristol Electronics

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Sensible Micro Corp

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ComSIT Distribution GmbH

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Semicontronic

India . 4,179 parts In-Stock

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$11.930

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$11.632

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$11.572

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Ampacity Inc.

Singapore . 3,951 parts In-Stock

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Continental Prestige Electronics

USA . 896 parts In-Stock

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Corphita

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Aranea Global

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Modulus Dynamics

Lithuania . 600 parts In-Stock

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$14.825

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$14.376

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Component Stockers USA

USA . 7,405 parts In-Stock

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$17.590

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$13.650

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$12.140

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$12.140

Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$18.971

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Microchip USA

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Corohmni

South Africa . 770 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 3,291 parts In-Stock

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IDEA Electronic Components Group

UK . 455 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Argo Parts USA

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Robosynatics

Brazil . 450 parts In-Stock

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Lucentia Tech

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iodParts Technologies Inc.

India . 100 parts In-Stock

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Overview

Discover the TM4C129ENCPDTI3R by Texas Instruments, a cutting-edge microcontroller that offers unmatched quality and performance. With its advanced features and impressive connectivity options, this device is perfect for a wide range of applications. From industrial automation to consumer electronics, the TM4C129ENCPDTI3R delivers exceptional value and benefits to customers. Experience seamless integration with its surface mount design and compact size. Unlock endless possibilities with its integrated cache, on-chip data RAM, and an extensive array of peripherals. Trust Texas Instruments, a renowned manufacturer known for their reliability and innovation. Upgrade your projects today with the TM4C129ENCPDTI3R and see the difference it can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

. The use of plastic/epoxy as the package body material provides durability and protects the microcontroller from external damage, making it a reliable choice for various applications.

Integrated Cache: YES

. With an integrated cache, this microcontroller can quickly access frequently used data, enhancing its overall processing speed and efficiency, making it suitable for tasks that require high performance.

Surface Mount: YES

. The surface mount feature allows for easy and convenient installation on PCBs, reducing assembly time and effort, making it a practical option for mass production and compact designs.

Maximum Supply Voltage: 1.32 V

. The microcontroller's ability to operate at a maximum supply voltage of 1.32 V ensures compatibility with a wide range of power sources, providing flexibility for different power supply configurations.

On Chip Data RAM Width: 8

. With a data RAM width of 8, this microcontroller can handle larger data sets and perform complex tasks more efficiently, making it suitable for applications that require extensive data processing.

Address Bus Width: 28

. The address bus width of 28 enables the microcontroller to access a large memory space, allowing for seamless handling of memory-intensive operations, making it an ideal choice for applications with substantial memory requirements.

Package Shape: SQUARE

. The square package shape provides ease of mounting and alignment, simplifying the integration of the microcontroller into various systems, making it a versatile solution for different design configurations.

Bit Size: 32

. With a bit size of 32, this microcontroller can handle larger data chunks, enabling efficient execution of complex algorithms and calculations, making it suitable for demanding computational applications.

No. of Terminals: 128

. The microcontroller's 128 terminals provide ample connectivity options for peripherals and external components, allowing for flexible interfacing and expanding the functionality of the overall system.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

. The flatpack style, thin profile, and fine pitch of this microcontroller's package design enable compact and space-saving circuit layouts, making it an excellent choice for applications with size constraints.

Minimum Supply Voltage: 1.14 V

. The microcontroller's ability to function at a minimum supply voltage of 1.14 V offers compatibility with low-power sources, optimizing energy efficiency and making it suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

. With a maximum operating temperature of 85°C, this microcontroller can withstand high-temperature environments, ensuring reliable operation in challenging conditions.

CPU Family: CORTEX-M4F

. The use of the CORTEX-M4F CPU family provides advanced processing capabilities, enabling the microcontroller to execute complex instructions efficiently, making it a reliable choice for demanding applications.

Minimum Operating Temperature: -40 °C

. The microcontroller's ability to operate at a minimum temperature of -40°C makes it suitable for harsh environments and extreme conditions, ensuring stable performance in various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

. The use of nickel palladium gold terminal finish enhances the microcontroller's durability, improving its resistance to corrosion and ensuring reliable electrical connections, making it a reliable choice for long-term use.

ADC Channels: YES

. With ADC channels, this microcontroller can convert analog signals into digital data, facilitating precise measurement and control of external devices, making it suitable for applications requiring analog sensor interfacing.

DMA Channels: YES

. The availability of DMA (Direct Memory Access) channels allows for efficient data transfer between peripheral devices and memory, offloading the CPU and improving overall system performance, making it ideal for high-speed data processing.

Terminal Position: QUAD

. The quad terminal position provides multiple contact points, ensuring secure and reliable connections, making it suitable for applications that require robust and stable connections, such as industrial control systems.

ROM Words: 1048576

. With a large ROM word capacity of 1048576, this microcontroller can store extensive code and data, accommodating complex programs and enabling versatile functionalities, making it suitable for applications with extensive software requirements.

Maximum Seated Height: 1.2 mm

. The microcontroller's maximum seated height of 1.2 mm allows for compact and low-profile designs, facilitating integration into space-constrained applications, such as portable devices or thin client solutions.

RAM Words: 256

. With a RAM word capacity of 256, this microcontroller can efficiently store and manipulate data during runtime, facilitating real-time processing and responsiveness, making it suitable for applications requiring quick data access.

Width: 14 mm

. The microcontroller's width of 14 mm provides a compact form factor, allowing for flexible placement and integration within various systems, making it an excellent choice for designs with limited space availability.

Data EEPROM Size: 6K

. The 6K data EEPROM size allows for non-volatile storage of critical data, such as calibration values or configuration settings, ensuring data integrity and system reliability, making it suitable for data-sensitive applications.

Boundary Scan: YES

. The boundary scan feature enables developers to efficiently test and debug the microcontroller, simplifying the production process and ensuring optimal performance, making it a reliable choice for high-quality manufacturing.

External Data Bus Width: 32

. With an external data bus width of 32, this microcontroller can efficiently exchange data with external devices, facilitating fast and seamless communication, making it suitable for applications with demanding connectivity requirements.

Peripherals: BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

. The wide range of peripherals available, including BOD, comparators, CRC, DMA, LCD, POR, PWM, QEI, RTC, timers, and WDT, expands the microcontroller's functionality, making it versatile and adaptable to various application needs.

Maximum Clock Frequency: 25 MHz

. With a maximum clock frequency of 25 MHz, this microcontroller can execute instructions and process data at high speeds, making it suitable for applications that require rapid data manipulation and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

. The microcontroller's maximum time at peak reflow temperature of 30 seconds ensures reliable solder connections during assembly, guaranteeing optimal performance in the final product, making it suitable for efficient manufacturing processes.

Peak Reflow Temperature °C: 260

. With a peak reflow temperature of 260°C, the microcontroller can withstand the high temperatures of the soldering process, ensuring proper solder joint formation and reliable assembly, making it suitable for industrial production.

Length: 14 mm

. The microcontroller's length of 14 mm contributes to its compact form factor, allowing for easy integration into space-constrained designs while maintaining functionality, making it suitable for small-scale applications.

Temperature Grade: INDUSTRIAL

. The microcontroller's industrial temperature grade ensures reliable operation across a wide temperature range, making it suitable for industrial environments that require robust and resilient electronic components.

Peripheral IC Type: MICROCONTROLLER, RISC

. With a microcontroller and RISC (Reduced Instruction Set Computer) architecture, this product offers efficient instruction execution and improved overall system performance, making it a reliable choice for performance-critical applications.

No. of Timers: 8

. The microcontroller's 8 timers enable precise timing and synchronization of tasks, facilitating event-based operations and enhancing system control, making it suitable for applications that require accurate time management.

RAM Bytes: 262144

. With a RAM capacity of 262144 bytes, this microcontroller can handle and process large volumes of data efficiently, supporting complex algorithms and optimizing overall system performance, making it suitable for data-intensive applications.

Technology: CMOS

. The use of CMOS (Complementary Metal-Oxide-Semiconductor) technology ensures low power consumption and high noise immunity, making the microcontroller energy-efficient and suitable for applications that require reliable and long-lasting operation.

Terminal Form: GULL WING

. The gull wing terminal form provides mechanical stability and secure solder connections, making it suitable for applications that require robust electrical connections, such as automotive or aerospace systems.

Analog To Digital Convertors: 20-Ch 12-Bit

. With 20 channels and 12-bit resolution, the microcontroller's analog-to-digital converters enable precise conversion of analog signals into digital data, allowing for accurate measurement and control applications.

Maximum Supply Current: 42 mA

. The microcontroller's maximum supply current of 42 mA ensures efficient power consumption, allowing for reliable operation while minimizing energy usage, making it suitable for battery-powered applications or energy-conscious designs.

Nominal Supply Voltage: 1.2 V

. With a nominal supply voltage of 1.2 V, this microcontroller can operate within a range of low-voltage power sources, making it suitable for energy-efficient and low-power applications.

No. of DMA Channels: 32

. The microcontroller's 32 DMA channels enable efficient and parallel data transfer between different peripherals and memory, optimizing overall system performance, making it suitable for high-bandwidth applications.

No. of Serial I/Os: 27

. With 27 serial I/Os, this microcontroller offers extensive connectivity options for serial communication interfaces, enabling seamless integration with various devices and expanding the system's capabilities.

PWM Channels: YES

. The availability of PWM (Pulse-Width Modulation) channels allows for precise control of analog signals and accurate generation of digital-to-analog conversions, making it suitable for applications that require precise control of motors or analog devices.

Technical Specifications

Microcontrollers TM4C129ENCPDTI3R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

90

No. of Serial I/Os:

27

No. of Terminals:

128

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Current:

42 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Trade Compliance

TM4C129ENCPDTI3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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