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LPC1768FBD100,551

NXP Semiconductors

LPC1768FBD100,551 by NXP Semiconductors

NXP Semiconductors' LPC1768FBD100,551 is a 32-bit microcontroller with 524288 ROM words and 65536 RAM bytes. It features 8-Ch 12-Bit ADC channels, CAN(2), ETHERNET, I2C(3), UART(4), USB connectivity, and operates at a max clock frequency of 25 MHz. Ideal for industrial applications requiring high-speed processing and multiple communication interfaces.

Median Price

$9.637

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 300 parts In-Stock

1+ parts

$7.094

100+ parts

-

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300

$7.094

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$12.180

100+ parts

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500

$12.180

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Chip Stock

USA . 68,000 parts In-Stock

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68,000

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Cyclops Electronics Ltd

UK . 26,463 parts In-Stock

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26,463

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Vyrian

USA . 4,660 parts In-Stock

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4,660

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Digiode

USA . 2,429 parts In-Stock

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2,429

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Anansix

USA . 1,171 parts In-Stock

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Sensible Micro Corp

USA . 450 parts In-Stock

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450

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Martec Srl

Italy . 303 parts In-Stock

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303

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Rebound Electronics

UK . 90 parts In-Stock

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90

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Inventory MP

USA . 34 parts In-Stock

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34

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Cogito LLC

Ukraine . 10 parts In-Stock

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10

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Bristol Electronics

USA . 5 parts In-Stock

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5

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Semtec, LLC

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 772 parts In-Stock

1+ parts

$7.121

100+ parts

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1k+ parts

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772

$7.121

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Ampacity Inc.

Singapore . 885 parts In-Stock

1+ parts

$8.000

100+ parts

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885

$8.000

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Continental Prestige Electronics

USA . 5,029 parts In-Stock

1+ parts

$11.675

100+ parts

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10k+ parts

$11.441

5,029

$11.675

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$11.441

Semicontronic

India . 2,641 parts In-Stock

1+ parts

$13.000

100+ parts

$12.675

1k+ parts

$12.610

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2,641

$13.000

$12.675

$12.610

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One Stop Electronics

USA . 538 parts In-Stock

1+ parts

$26.000

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538

$26.000

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Aztec Data Supply Inc.

USA . 603 parts In-Stock

1+ parts

$39.680

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603

$39.680

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Microchip USA

USA . 2,440 parts In-Stock

1+ parts

$76.660

100+ parts

$76.660

1k+ parts

$76.660

10k+ parts

$76.660

2,440

$76.660

$76.660

$76.660

$76.660

Modulus Dynamics

Lithuania . 69 parts In-Stock

1+ parts

$85.367

100+ parts

$85.367

1k+ parts

$85.367

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69

$85.367

$85.367

$85.367

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Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$89.035

100+ parts

$84.583

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$84.583

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900

$89.035

$84.583

$84.583

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Perfect Parts

USA . 215,498 parts In-Stock

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215,498

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Lixinc

USA . 19,872 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,792 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,841 parts In-Stock

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GreenTree Electronics

Israel . 4,520 parts In-Stock

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4,520

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Lucentia Tech

USA . 3,210 parts In-Stock

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$34.866

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$34.155

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$34.155

3,210

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$34.866

$34.155

$34.155

Argo Parts USA

USA . 2,554 parts In-Stock

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2,554

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iodParts Technologies Inc.

India . 1,442 parts In-Stock

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1,442

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Infinite Electronics LLP (Excess)

. 1,383 parts In-Stock

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1,383

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S.R.D Solutions

India . 1,100 parts In-Stock

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UNI Independent Distributors

Spain . 1,093 parts In-Stock

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1,093

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$11.936

1k+ parts

$11.571

10k+ parts

$11.327

1,000

-

$11.936

$11.571

$11.327

Corphita

USA . 923 parts In-Stock

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923

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Speed Components Ltd (Excess)

Israel . 761 parts In-Stock

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761

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Corohmni

South Africa . 695 parts In-Stock

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695

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Overview

Unlock endless possibilities with the LPC1768FBD100,551 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-quality microcontrollers that are versatile and reliable. This product is perfect for a wide range of applications, offering customers value and benefits that go beyond just functionality. Seamlessly integrate this powerful microcontroller into your projects and experience unparalleled performance and efficiency. Discover the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring longevity and reliability in various applications.

Surface Mount: YES

Surface mount implementation allows for compact and space-efficient designs, making it suitable for small form factor applications.

Maximum Supply Voltage: 3.6 V

Support for a higher supply voltage allows for flexibility in power input requirements and compatibility with a wide range of systems.

Bit Size: 32

A 32-bit architecture offers enhanced performance, efficiency, and processing capabilities compared to lower bit sizes, making it suitable for demanding tasks.

DAC Channels: YES

Digital-to-analog converters enable the microcontroller to interface with analog components, expanding the range of applications it can be utilized in.

No. of Terminals: 100

A higher number of terminals allow for more connectivity options and I/O capabilities, enhancing the versatility of the microcontroller.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and operate reliably in various industrial settings.

CPU Family: CORTEX-M3

The Cortex-M3 architecture offers a balance of performance and power efficiency, making it ideal for a wide range of embedded systems applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances processing speed and efficiency, while the microcontroller design provides integrated peripherals for streamlined system design.

RAM Bytes: 65536

With a generous amount of RAM, the microcontroller can handle complex tasks and datasets efficiently, ensuring smooth operation in demanding applications.

Technical Specifications

Microcontrollers LPC1768FBD100,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

PART, ROHS INFO AND SHIPPING METHOD CONSIDERED FROM MFR WEBSITE

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

70

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3,3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(3), UART(4), USB

Peripherals:

BOD, DMA, POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC1768FBD100,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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