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LPC1857FET256,551

NXP Semiconductors

LPC1857FET256,551 by NXP Semiconductors

NXP Semiconductors' LPC1857FET256,551 is a 32-bit microcontroller with Cortex-M3 CPU family. It features 24-bit address bus width, 32-bit external data bus width, and 139264 bytes of RAM. Ideal for industrial applications requiring high-speed processing and multiple ADC/DAC channels.

Median Price

$19.900

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 85 parts In-Stock

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$11.330

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$11.330

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Chip1Stop

Japan . 720 parts In-Stock

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$19.900

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$13.500

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$12.300

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720

$19.900

$13.500

$12.300

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DigiKey

USA . 6,118 parts In-Stock

1+ parts

$21.770

100+ parts

$15.175

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$14.147

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6,118

$21.770

$15.175

$14.147

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Mouser Electronics

USA . 2,119 parts In-Stock

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$21.770

100+ parts

$14.710

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$14.070

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$21.770

$14.710

$14.070

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RS (Exports)

UK . 2,033 parts In-Stock

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$21.351

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$21.351

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Verical

USA . 1,530 parts In-Stock

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$12.928

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$12.928

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Rochester

USA . 1,034 parts In-Stock

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$11.160

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$9.990

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$9.400

1,034

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$9.400

Avnet

USA . 180 parts In-Stock

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Digiode

USA . 3,673 parts In-Stock

1+ parts

$9.785

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3,673

$9.785

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$16.629

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$16.629

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Chip Stock

USA . 100,000 parts In-Stock

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Anansix

USA . 2,324 parts In-Stock

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Vyrian

USA . 1,347 parts In-Stock

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NAC Semi

USA . 630 parts In-Stock

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$19.570

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$18.060

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630

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$19.570

$18.060

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Bristol Electronics

USA . 233 parts In-Stock

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Cyclops Electronics Ltd

UK . 90 parts In-Stock

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IBS Electronics

USA . 90 parts In-Stock

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$14.768

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$14.586

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90

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$14.768

$14.586

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,484 parts In-Stock

1+ parts

$8.920

100+ parts

$8.697

1k+ parts

$8.652

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4,484

$8.920

$8.697

$8.652

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Corphita

USA . 2,932 parts In-Stock

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$9.270

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2,932

$9.270

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Continental Prestige Electronics

USA . 3,018 parts In-Stock

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$15.906

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$15.588

3,018

$15.906

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$15.588

Modulus Dynamics

Lithuania . 1,277 parts In-Stock

1+ parts

$16.629

100+ parts

$16.629

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$16.629

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1,277

$16.629

$16.629

$16.629

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$16.630

100+ parts

$15.798

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$14.801

450

$16.630

$15.798

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$14.801

Ampacity Inc.

Singapore . 1,190 parts In-Stock

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$19.610

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Advanced Electronics

New Zealand . 15,000 parts In-Stock

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$26.539

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$24.150

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$21.762

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$26.539

$24.150

$21.762

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Microchip USA

USA . 1,178 parts In-Stock

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$50.071

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Aztec Data Supply Inc.

USA . 508 parts In-Stock

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$72.480

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S.R.D Solutions

India . 45,200 parts In-Stock

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Lucentia Tech

USA . 10,458 parts In-Stock

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$16.296

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$15.964

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$15.964

10,458

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$16.296

$15.964

$15.964

Lixinc

USA . 7,858 parts In-Stock

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Perfect Parts

USA . 5,443 parts In-Stock

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Argo Parts USA

USA . 4,526 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Allen Electronics Distributors

USA . 2,033 parts In-Stock

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UNI Independent Distributors

Spain . 1,303 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corohmni

South Africa . 963 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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900

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iodParts Technologies Inc.

India . 105 parts In-Stock

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Overview

Empower your projects with the LPC1857FET256,551 by NXP Semiconductors, a premium microcontroller designed to deliver outstanding performance and reliability. With a cutting-edge CORTEX-M3 CPU family and a wide range of features like DAC and ADC channels, DMA capabilities, and PWM channels, this device offers unparalleled value and benefits for various industrial applications. Trust NXP Semiconductors' expertise in creating top-notch semiconductor solutions, and take your projects to new heights with the LPC1857FET256,551.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package body material is durable and cost-effective, making the product suitable for various applications.

Surface Mount: YES

Surface mount feature enables easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6V allows for compatibility with a wide range of power sources.

Address Bus Width: 24

With a 24-bit address bus width, the microcontroller can access a large memory space, enhancing its processing capabilities.

Package Shape: SQUARE

Square package shape provides ease of mounting and handling, making it suitable for compact device designs.

Bit Size: 32

32-bit architecture offers high processing power and efficiency, enabling the microcontroller to handle complex tasks effectively.

DAC Channels: YES

Having DAC channels allows the microcontroller to convert digital signals to analog signals, expanding its interface capabilities.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages gives flexibility in system design and integration.

No. of Terminals: 256

A higher number of terminals allow for more connections and interfaces, enhancing the microcontroller's versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array package style with low profile design saves space on the PCB and contributes to a compact overall system layout.

Minimum Supply Voltage: 2.2 V

Operating at a minimum supply voltage of 2.2V ensures power efficiency and compatibility with low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance of 85°C allows the microcontroller to perform reliably in industrial environments with elevated temperatures.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family ensures efficient processing performance and compatibility with a wide range of software tools and libraries.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature limit of -40°C enables the microcontroller to function in extreme cold conditions without issue.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish provides good conductivity and reliability in electrical connections, ensuring long-term performance.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals to digital signals, expanding its sensor interfacing capabilities.

DMA Channels: YES

Support for DMA channels enables efficient data transfer and processing, improving the microcontroller's overall performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making it easier to integrate the microcontroller into various electronic devices.

ROM Words: 1048576

Large ROM capacity of 1048576 words allows for storing a significant amount of program data, enabling the microcontroller to run complex algorithms and applications.

Maximum Seated Height: 1.55 mm

Low maximum seated height of 1.55mm contributes to a compact design and enables the microcontroller to be used in slim devices.

Width: 17 mm

A width of 17mm provides a balance between space efficiency and ease of integration, making the microcontroller suitable for various form factors.

External Data Bus Width: 32

With a 32-bit external data bus width, the microcontroller can efficiently transfer data to and from external devices, improving overall performance.

Maximum Clock Frequency: 25 MHz

Maximum clock frequency of 25MHz allows for rapid data processing and operation speed, making the microcontroller ideal for high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microcontroller can withstand soldering processes without damage or degradation.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable soldering and assembly of the microcontroller onto the PCB, enhancing product longevity.

Length: 17 mm

A length of 17mm provides a compact form factor, making the microcontroller suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the microcontroller's robustness and reliability in harsh operating conditions typical of industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient and fast processing, suitable for applications requiring quick response times and performance.

RAM Bytes: 139264

With a large RAM capacity of 139264 bytes, the microcontroller can efficiently store and process data, enhancing its multitasking capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, improving the energy efficiency and reliability of the microcontroller.

Terminal Form: BALL

Ball terminal form allows for reliable and secure electrical connections, ensuring stable performance and longevity of the microcontroller.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and voltage levels, simplifying system integration.

PWM Channels: YES

Having PWM channels enables the microcontroller to generate precise analog outputs, making it suitable for applications such as motor control and signal modulation.

ROM Programmability: FLASH

ROM programmability using flash memory allows for easy and quick updates to the microcontroller's firmware, enhancing flexibility in software development.

Terminal Pitch: 1 mm

With a terminal pitch of 1mm, the microcontroller's terminals are closely spaced for efficient PCB layout and compact design.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the microcontroller's resistance to moisture-related damage during storage and handling, ensuring long-term reliability.

Speed: 180 rpm

Operating at a speed of 180rpm allows for quick data processing and execution of instructions, making the microcontroller suitable for real-time applications.

No. of I/O Lines: 164

With 164 I/O lines, the microcontroller offers ample connectivity options for interfacing with external devices and peripherals, expanding its application versatility.

Technical Specifications

Microcontrollers LPC1857FET256,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

164

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.55 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LPC1857FET256,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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