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STM32F405VGT6XXX

STMicroelectronics

STM32F405VGT6XXX by STMicroelectronics

STM32F405VGT6XXX by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU. It features 16 external interrupts, 82 I/O lines, and 200704 bytes of RAM. Ideal for industrial applications requiring high-speed processing up to 26 MHz and low power mode support.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,852 parts In-Stock

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2,852

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Vyrian

USA . 1,449 parts In-Stock

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1,449

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Anansix

USA . 755 parts In-Stock

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755

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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AZTECH Wire

Italy . 682 parts In-Stock

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$18.442

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682

$18.442

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Semicontronic

India . 1,074 parts In-Stock

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$31.000

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$30.225

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$30.070

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1,074

$31.000

$30.225

$30.070

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Ampacity Inc.

Singapore . 931 parts In-Stock

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$32.000

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931

$32.000

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Aztec Data Supply Inc.

USA . 942 parts In-Stock

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$62.170

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942

$62.170

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Corohmni

South Africa . 191 parts In-Stock

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$68.239

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191

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IDEA Electronic Components Group

UK . 2,129 parts In-Stock

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$70.992

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$63.893

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2,129

$70.992

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$63.893

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MKK Technologies

India . 1,949 parts In-Stock

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$133.495

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$133.495

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DigiPath Technology Company

USA . 1,949 parts In-Stock

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$133.495

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$133.495

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Robosynatics

Brazil . 5,000 parts In-Stock

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Corphita

USA . 4,755 parts In-Stock

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Continental Prestige Electronics

USA . 938 parts In-Stock

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Argo Parts USA

USA . 698 parts In-Stock

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Parana Technologies

USA . 452 parts In-Stock

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$84.882

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452

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$84.882

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Discover the powerful STM32F405VGT6XXX microcontroller by STMicroelectronics, a top-tier manufacturer known for delivering high-quality products. Designed for industrial applications, this microcontroller offers a wide range of features such as DAC and ADC channels, DMA channels, and PWM channels, making it versatile and efficient. With its low power mode and robust technology, customers can expect reliable performance and seamless integration into their systems. Experience the value and benefits of the STM32F405VGT6XXX for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components and ensures durability.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle a relatively high supply voltage, making it versatile for different applications.

Address Bus Width: 8

Provides sufficient address lines for memory access and data transfer operations.

Package Shape: SQUARE

Optimal shape for saving space on the PCB and for efficient placement.

Bit Size: 32

Offers a high-performance processing capability and can handle complex computations.

DAC Channels: YES

Allows for analog output capabilities, which is essential for many applications.

No. of Terminals: 100

Provides a sufficient number of terminals for connecting to external components and peripherals.

Minimum Supply Voltage: 1.8 V

Can operate effectively at low voltage levels, offering energy efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial applications.

CPU Family: CORTEX-M4

Utilizes a powerful CPU family known for its efficiency and performance.

No. of External Interrupts: 16

Allows for handling multiple external events or signals simultaneously.

Peripheral IC Type: MICROCONTROLLER, RISC

Employs a RISC architecture for efficient processing and control operations.

ADC Channels: YES

Enables the microcontroller to convert analog signals into digital data for processing.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer without CPU intervention.

RAM Bytes: 200704

Offers a large amount of random access memory for data storage and processing.

ROM Programmability: FLASH

Utilizes flash memory for programmability, enabling easy updates and modifications to the code.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Speed: 168 rpm

Operates at a high speed, suitable for real-time applications and processing requirements.

No. of I/O Lines: 82

Provides a sufficient number of input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers STM32F405VGT6XXX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of External Interrupts:

16

No. of I/O Lines:

82

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

200704

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

168 rpm

Maximum Supply Current:

102 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32F405VGT6XXX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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